MSC8156HAG1000B vs MSC8156AG1000B 比較

詳細並排比較 MSC8156HAG1000B 由 NXP Semiconductors 與 MSC8156AG1000B 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ 啟用中
NXP Semiconductors
MSC8156AG1000B MSC8156AG1000B - 6x 1GHz StarCore DSP SoC | NXP (Freescale)

MSC8156AG1000B - 6x 1GHz StarCore DSP SoC | NXP (Freescale)

MSC8156AG1000B ⚠ 最後購買機會

規格比較

參數 MSC8156HAG1000B MSC8156AG1000B
品牌 NXP Semiconductors NXP Semiconductors
類別 DSP DSP
生命週期狀態 啟用中 最後購買
Product Type Multi-core Digital Signal Processor (DSP) Multi-core DSP SoC
DSP Cores 6 x StarCore SC3850 —
Core Clock Frequency 1 GHz per core —
On-chip RAM 576 KB (L1/L2 SRAM) —
On-chip ROM 96 KB 96 kB
Hardware Accelerator MAPLE-B (turbo/Viterbi FEC) MAPLE-B (turbo/Viterbi/encryption)
External Memory Interface DDR2/DDR3 with ECC —
High-speed Serial Fabric 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 —
Ethernet 2 x Gigabit Ethernet (SGMII/RGMII) 2x Gigabit Ethernet MACs (GbE)
Queuing Engine Yes (QE for packet/traffic management) —
Peripheral Interfaces SPI, I2C, UART, PCI I2C, SPI, UART/USART, PCI, RGMII, SGMII
Process Technology CMOS 45 nm
封裝 783-ball FCBGA (FCP-BGA), 29 x 29 mm 783-FCPBGA, 29x29 mm
安裝類型 Surface Mount Surface Mount (BGA)
工作溫度 0C to +105C 0C to +90C (commercial grade)
Peak Reflow Temperature 245C (JEDEC J-STD-020) —
Terminal Finish Tin Silver Copper (e1 per JESD-609) —
MSL 等級 [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
RoHS 狀態 Compliant (per distributor datasheet listing) [DATA_NEEDED: RoHS compliance]
DSP Core — 6x StarCore SC3850
Clock Rate (per core) — 1 GHz
Aggregate Throughput — ~ 6 GHz single-core equivalent
Memory Controller — DDR2 / DDR3 with ECC
Serial RapidIO (SRIO) — 2x lanes
PCI Express — 2x Gen1 controllers
Queue Manager — QF7

資料表與資源

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