MSC8251TAG1000B vs MSC8156ESAG1000B 比較
詳細並排比較 MSC8251TAG1000B 由 NXP Semiconductors 與 MSC8156ESAG1000B 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ 停產規格比較
| 參數 | MSC8251TAG1000B | MSC8156ESAG1000B |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | DSP | DSP |
| 生命週期狀態 | 停產終止 | 停產終止 |
| Product Type | Digital Signal Processor (DSP) | — |
| Core | SC3850 StarCore (single core) | — |
| Core Architecture | VLIW / static superscalar, 32-bit | — |
| Core Frequency | 1 GHz | — |
| On-chip Performance | 4 GMACS (peak) | — |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| L2 Cache | [DATA_NEEDED: L2 size] | — |
| Accelerator | MAPLE-B2 (Turbo/Viterbi/FFT baseband engine) | — |
| Memory Controller | Dual-channel DDR2/DDR3, 64-bit, ECC | 64-bit DDR2/DDR3, up to 800 MT/s |
| Serial Interfaces | 4x SerDes up to 1.25 Gbps (SGMII/CPRI) | — |
| Ethernet MACs | 2x RGMII/GMII | — |
| PCI Express | PCIe 2.0 endpoint, x1/x2/x4 | — |
| GPIO | 32 | — |
| 封裝 | 783-FCBGA (29x29 mm, 1.0 mm pitch) | 783-ball FCBGA (29x29 mm) |
| 工作溫度 | [DATA_NEEDED: temperature grade] | 0C to +105C |
| 供應電壓 | 1.0 V core / 1.5 V / 1.8 V / 2.5 V / 3.3 V I/O | [DATA_NEEDED: core and I/O rail voltages] |
| Process Technology | CMOS | 45 nm CMOS |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| DSP Cores | — | 6x SC3850 StarCore cores |
| Core Clock Frequency | — | 1 GHz per core |
| Aggregate Performance | — | [DATA_NEEDED: aggregate MMACS rating] |
| Hardware Accelerator | — | MAPLE-B baseband accelerator (turbo decode) |
| SerDes Lanes | — | 2 lanes, SRIO or PCIe (selectable) |
| Ethernet | — | 1x Gigabit Ethernet MAC |
| Packet Engine | — | QUICC Engine subsystem |
| Security Engine | — | SEC 4.0 (Cryptographic accelerator) |
| 安裝類型 | — | Surface Mount (BGA) |
| 生命週期狀態 | — | End of Life (per NXP PCN) |