MT40A512M8RH-075E:B vs K4A4G085WD-BCPB 比較

詳細並排比較 MT40A512M8RH-075E:B 由 Micron Technology 與 K4A4G085WD-BCPB 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Micron Technology
MT40A512M8RH-075E:B MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B ✓ 啟用中
Samsung Electronics
K4A4G085WD-BCPB K4A4G085WD-BCPB - 4Gb DDR4 SDRAM x8 1.2V | Samsung

K4A4G085WD-BCPB - 4Gb DDR4 SDRAM x8 1.2V | Samsung

K4A4G085WD-BCPB ✓ 啟用中

規格比較

參數 MT40A512M8RH-075E:B K4A4G085WD-BCPB
品牌 Micron Technology Samsung Electronics
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gbit 4 Gb
組織 512M x 8 512M x 8
資料速率 2666 MT/s (DDR4-2666) —
Clock Frequency 1333 MHz (1.33 GHz) —
VDD Supply Voltage 1.2 V +/-60 mV —
VDDQ Supply Voltage 1.2 V +/-60 mV —
VPP Supply Voltage 2.5 V, -125 mV/+250 mV —
介面類型 Parallel —
I/O Structure 1.2V pseudo open-drain —
參考電壓 On-die internal adjustable VREFDQ generation —
封裝 78-FBGA (9 x 10.5 mm), TFBGA FBGA-78 (PB)
安裝類型 Surface Mount Surface Mount (BGA)
工作溫度 [DATA_NEEDED: operating temperature range (standard grade)] [DATA_NEEDED: operating temperature range]
Refresh Refresh max interval extension at extended TC temperature range (125C capable per family features) [DATA_NEEDED: refresh specification]
Speed Grade Suffix -075E —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant (PB lead-free suffix)
Packaging Option Suffix :B (ball map B designation per Mouser listing) —
Die Generation — D-die
供應電壓 — 1.2 V
介面 — DDR4 (Double Data Rate 4)
Speed Grade / Data Rate — [DATA_NEEDED: speed grade / data rate]
CAS 延遲 — [DATA_NEEDED: CAS latency]
無鹵素 — [DATA_NEEDED: halogen-free status]
Datasheet Pages — 66 pages (K4A4G085WD family datasheet)

資料表與資源

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