P1012NSE2HFB vs P1013NSE2MHB557 比較

詳細並排比較 P1012NSE2HFB 由 NXP Semiconductors 與 P1013NSE2MHB557 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
P1012NSE2HFB P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP

P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP

P1012NSE2HFB ⚠ 最後購買機會
NXP Semiconductors
P1013NSE2MHB557 P1013NSE2MHB557 - QorIQ P1013 e500v2 MPU 1.2GHz 689-TEPBGA II | NXP

P1013NSE2MHB557 - QorIQ P1013 e500v2 MPU 1.2GHz 689-TEPBGA II | NXP

P1013NSE2MHB557 ✓ 啟用中

規格比較

參數 P1012NSE2HFB P1013NSE2MHB557
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 啟用中
Processor Series QorIQ P1 —
Processor Core PowerPC e500v2 —
Number of Cores 1 1
Core Architecture 32-Bit Power Architecture PowerPC e500v2
Maximum Core Frequency 800 MHz 1.2 GHz
Process Technology 45 nm CMOS —
Memory Controller DDR2/DDR3 with ECC DDR2 / DDR3 with ECC, up to 800 MHz data rate
Ethernet Integrated GbE (multiple MACs) 3x 10/100/1000 Mbps Enhanced GMII/RGMII/TBI MACs
PCIe Controllers PCIe Gen 2 (x1/x2/x4) —
USB USB 2.0 (host + device) —
TDM Interfaces 4 (T1/E1) —
QUICC Engine (QE) Yes (protocol offload) —
SEC Security Accelerator SEC 4.0 —
封裝 689-TEPBGA II (31x31 mm) with exposed thermal pad 689-TEPBGA II (31x31 mm)
安裝類型 Surface Mount Surface Mount (BGA)
Operating Temperature (Tj) 0C to +125C —
RoHS 狀態 RoHS Compliant Compliant
Lead Free Status Lead Free —
Packaging Tray —
Manufacturer — NXP Semiconductors
Series — QorIQ P1
資料匯流排寬度 — 32-bit
PCI Express — 2x PCIe endpoints / root complex controllers
Security Accelerator — AES, 3DES, RC4, RSA, ECC, IPsec, SSL/TLS offload
L1 Cache — 32 KB I-cache + 32 KB D-cache
工作溫度範圍 — -40 C to +85 C (industrial)
MSL (Moisture Sensitivity Level) — 3 (168 hours)

資料表與資源

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