S912XDG128F2MAL vs S912XD128F2MAL 比較

詳細並排比較 S912XDG128F2MAL 由 NXP Semiconductors 與 S912XD128F2MAL 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
S912XDG128F2MAL S912XDG128F2MAL - 16-bit 80MHz 128KB MCU | NXP | Automotive

S912XDG128F2MAL - 16-bit 80MHz 128KB MCU | NXP | Automotive

S912XDG128F2MAL ✗ 停產
NXP Semiconductors
S912XD128F2MAL S912XD128F2MAL - 16-bit HCS12X MCU, 128KB Flash | NXP

S912XD128F2MAL - 16-bit HCS12X MCU, 128KB Flash | NXP

S912XD128F2MAL ✗ 停產

規格比較

參數 S912XDG128F2MAL S912XD128F2MAL
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 停產終止 停產終止
Core Processor HCS12X (16-bit CISC) —
Core Size 16-bit —
Speed 80 MHz —
Program Memory Size 128 KB (128K x 8) Flash —
RAM Size 12K x 8 —
Number of I/O 91 —
供應電壓 2.5 V / 5 V 5 V (typical automotive)
封裝 / 外殼 112-LQFP (20x20 mm) —
安裝類型 Surface Mount Surface Mount
Terminal Form Gull Wing Gull Wing
工作溫度 -40 degC to +125 degC —
Industry Application Automotive —
Qualification AEC-Q100 —
Architecture Compatibility Upward compatible with HCS12 instruction set —
Packaging Tray —
RoHS 狀態 [DATA_NEEDED: RoHS status] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Core Architecture — HCS12X (16-bit)
Instruction Set — Upward-compatible with HCS12
Program Flash — 128 KB
RAM — [DATA_NEEDED: RAM size]
EEPROM — [DATA_NEEDED: EEPROM size]
Maximum CPU Frequency — 80 MHz
Operating Voltage — [DATA_NEEDED: VDD range]
工作溫度範圍 — -40 °C to +125 °C
Temperature Grade — Automotive
封裝 — 112-LQFP (20x20 mm)
Number of Terminals — 112
Package Code — QFP
Package Shape — Square
ADC — 10-bit
Communication Peripherals — CAN, SPI, SCI (UART), I²C
Timers — ECT, PWM, TIM (16-bit)
External Bus Interface — Yes (multiplexed)
Debug Interface — BDM
RoHS — Compliant per distributor listings

資料表與資源

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