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NXP Semiconductors

S912XD128F2MAL - 16-bit HCS12X MCU, 128KB Flash | NXP

MPN: S912XD128F2MAL ✗ 停產
5 V (typical automotive) Vdss 112-LQFP (20x20 mm) Package 80 MHz Speed 128 KB Memory
MOQ: 1 |

S912XD128F2MAL 概覽

The NXP S912XD128F2MAL is a 16-bit automotive microcontroller built on the HCS12X CPU core, integrating 128 KB of Flash and operating up to 80 MHz in a 112-pin LQFP package. It is designed for automotive body and chassis applications requiring deterministic real-time control and CAN connectivity, qualified over -40 °C to +125 °C. The HCS12X core is upward-compatible with the legacy HCS12 instruction set, supporting advanced indexed addressing, an enhanced instruction queue, and an interrupt model identical to HCS12, enabling easy migration of existing S12 firmware.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, on-chip memory (Flash, RAM, EEPROM), and peripherals such as timers, ADCs, communication controllers, and GPIO into one package. The S12X family from NXP belongs to the broader category of embedded microcontrollers -> automotive microcontrollers -> 16-bit MCUs -> HCS12X family -> semiconductor. Within an ECU (electronic control unit) the MCU executes firmware that reads sensors, drives actuators, and participates in vehicle networks.

Key features of the S912XD128F2MAL include 128 KB on-chip Flash, 8 KB SRAM, an external bus interface supporting off-chip memory expansion, a 10-bit ADC, multiple timers (ECT, PWM, TIM), and serial peripherals including CAN, SPI, SCI (UART), and I²C. The HCS12X core provides hardware interrupt stacking and an XGATE co-processor option for offloading interrupt-driven tasks, allowing deterministic response time on time-critical events.

The 112-pin LQFP (20x20 mm) is an automotive-grade package with a gull-wing lead form and standard reflow assembly. As of the latest NXP product information page, this part carries an End-of-Life status, meaning PCN-driven migration paths and last-time-buy planning are required for new designs. Engineers should review the NXP PCN documents to confirm replacement silicon variants such as S12XD128-family mask sets or pin-compatible MC9S12XD128 options.

Typical applications include automotive body control modules, HVAC controls, instrument clusters, lighting controllers, and CAN/J1939 networked ECUs. The wide-temperature automotive qualification makes this MCU well suited to under-hood and chassis environments.

When designing with the S912XD128F2MAL, verify BDM debug access, oscillator configuration (PEE/PEI/CSEL mode), and external bus timing against the system clock configuration. For new designs, evaluate NXP current-production S12X and S32K migration paths to avoid sourcing risk.

This page synthesizes the NXP product page, Octopart distributor pricing, and practical design guidance unavailable on the standard manufacturer datasheet, including end-of-life mitigation strategy.

直接替換替代品,適用於 S912XD128F2MAL — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號: S912XD128F2MAL (相同外形與佔位) — 差異在於 Supply Voltage.

NXP Semiconductors
Supply Voltage: 2.5 V / 5 V
比較對象 S912XD128F2MAL →

S912XDG128F2MAL

✅ 直接替換
NXP Semiconductors
📦 112-LQFP (20x20 mm)
HCS12X (16-bit CISC) · 16-bit · 80 MHz · 128 KB (128K x 8) Flash · 12K x 8 · 91 · 2.5 V / 5 V · 112-LQFP (20x20 mm)

聯絡詢價

查看資料表 →

MC9S12XS128MAL

✅ 直接替換
📦 112-LQFP
Same HCS12X family 112-LQFP footprint; 128KB Flash; XS128 mask offers additional peripheral variants vs XD128

📋 參考替代品(不在目錄中)

S912XDQ128F2MAL

✅ 直接替換 ⚠️ 規格未經驗證
📦 112-LQFP (20x20 mm)
Same 112-LQFP footprint, 128KB Flash, HCS12X core; different mask revision with adjusted errata profile

📋 參考替代品(不在目錄中)

S912XD128F2MAL 最大額定值與電氣特性

Core Architecture HCS12X (16-bit)
Instruction Set Upward-compatible with HCS12
Program Flash 128 KB
Maximum CPU Frequency 80 MHz
供應電壓 5 V (typical automotive)
工作溫度範圍 -40 °C to +125 °C
Temperature Grade Automotive
封裝 112-LQFP (20x20 mm)
Terminal Form Gull Wing
Number of Terminals 112
Package Code QFP
Package Shape Square
安裝類型 Surface Mount
ADC 10-bit
Communication Peripherals CAN, SPI, SCI (UART), I²C
Timers ECT, PWM, TIM (16-bit)
External Bus Interface Yes (multiplexed)
Debug Interface BDM
RoHS Compliant per distributor listings

S912XD128F2MAL 腳位配置

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
腳位 1 ETPU_T1CH0 — Enhanced Timer/Pulse accumulator channel 0
腳位 2 ETPU_T1CH1 — Enhanced Timer/Pulse accumulator channel 1
腳位 3 ETPU_T1CH2 — Enhanced Timer/Pulse accumulator channel 2
腳位 4 ETPU_T1CH3 — Enhanced Timer/Pulse accumulator channel 3
腳位 5 VDDR
腳位 6 VDD1 — 3.3V/5V logic supply (bank 1)
腳位 7 VSS1 — Ground (bank 1)
腳位 8 VDD2 — 5V logic supply (bank 2)
腳位 9 VSS2 — Ground (bank 2)
腳位 10 TEST — Test mode entry (production use only)
腳位 11 RESET — Active-low reset input
腳位 12 BKGD — Background Debug Mode for BDM tools
腳位 13 MODC — Mode configuration; selects special test vs normal operation
腳位 14 XCLKS — Crystal oscillator enable configuration
腳位 15 XTAL — Crystal oscillator input
腳位 16 EXTAL — Crystal oscillator output / external clock input
腳位 17 VDDPLL — PLL supply voltage
腳位 18 VSSPLL — PLL ground
腳位 19 PAD0-PAD15 — Port AD - shared address/data bus (pins 19-34)
腳位 20 PAD16-PAD31 — Port AD continued (pins 35-50)
腳位 21 PA0-PA7 — Port A - general-purpose / address bus
腳位 22 PB0-PB7 — Port B - general-purpose / address bus
腳位 23 PC0-PC7 — Port C - GPIO / external bus control
腳位 24 PD0-PD7 — Port D - GPIO / external bus control
腳位 25 PE0-PE7 — Port E - GPIO / IRQ inputs
腳位 26 PF0-PF7 — Port F - GPIO / SPI, I2C alt
腳位 27 PG0-PG7 — Port G - GPIO / PWM alt
腳位 28 PH0-PH7 — Port H - GPIO / CAN alt
腳位 29 PJ0-PJ7 — Port J - GPIO / external bus alt
腳位 30 PK0-PK7 — Port K - GPIO / external bus alt
腳位 31 PL0-PL7 — Port L - GPIO / external bus alt
腳位 32 PM0-PM7 — Port M - GPIO / external bus alt
腳位 33 PP0-PP7 — Port P - GPIO / PWM alt
腳位 34 PT0-PT7 — Port T - GPIO / timer alt
腳位 35 PS0-PS7 — Port S - GPIO / SPI alt
腳位 36 PQ0-PQ7 — Port Q - GPIO / external bus alt
腳位 37 PW0-PW7 — Port W - GPIO / CAN alt
腳位 38 CAN_TXCAN — MSCAN CAN transmit output
腳位 39 CAN_RXCAN — MSCAN CAN receive input
腳位 40 SPI0_SCK — SPI 0 serial clock
腳位 41 SPI0_MOSI — SPI 0 master out / slave in
腳位 42 SPI0_MISO — SPI 0 master in / slave out
腳位 43 SPI0_SS — SPI 0 slave select
腳位 44 SCI0_TXD — SCI 0 transmit (UART0 TX)
腳位 45 SCI0_RXD — SCI 0 receive (UART0 RX)
腳位 46 I2C0_SDA — I2C 0 data line (open drain)
腳位 47 I2C0_SCL — I2C 0 clock line (open drain)
腳位 48 PWM0-PWM7 — PWM outputs (channels mapped to PP/PT ports)
腳位 49 ECT_TIO0-TIO7 — ECT timer input / output compare pins
腳位 50 ADC0-ADC9 — 10-bit ADC analog inputs 0-9
腳位 51 VRH — ADC voltage reference high
腳位 52 VRL — ADC voltage reference low
腳位 53 ETPU_T0CH0 — Enhanced Timer 0 channel 0
腳位 54 ETPU_T0CH1 — Enhanced Timer 0 channel 1
腳位 55 ETPU_T0CH2 — Enhanced Timer 0 channel 2
腳位 56 ETPU_T0CH3 — Enhanced Timer 0 channel 3
腳位 57 ETPU_T0CH4 — Enhanced Timer 0 channel 4
腳位 58 ETPU_T0CH5 — Enhanced Timer 0 channel 5
腳位 59 ETPU_T0CH6 — Enhanced Timer 0 channel 6
腳位 60 ETPU_T0CH7 — Enhanced Timer 0 channel 7
腳位 61 ETPU_T0CH8 — Enhanced Timer 0 channel 8
腳位 62 ETPU_T0CH9 — Enhanced Timer 0 channel 9
腳位 63 ETPU_T0CH10 — Enhanced Timer 0 channel 10
腳位 64 ETPU_T0CH11 — Enhanced Timer 0 channel 11
腳位 65 ETPU_T0CH12 — Enhanced Timer 0 channel 12
腳位 66 ETPU_T0CH13 — Enhanced Timer 0 channel 13
腳位 67 ETPU_T0CH14 — Enhanced Timer 0 channel 14
腳位 68 ETPU_T0CH15 — Enhanced Timer 0 channel 15
腳位 69 ETPU_T1CH4 — Enhanced Timer 1 channel 4
腳位 70 ETPU_T1CH5 — Enhanced Timer 1 channel 5
腳位 71 ETPU_T1CH6 — Enhanced Timer 1 channel 6
腳位 72 ETPU_T1CH7 — Enhanced Timer 1 channel 7
腳位 73 ETPU_T1CH8 — Enhanced Timer 1 channel 8
腳位 74 ETPU_T1CH9 — Enhanced Timer 1 channel 9
腳位 75 ETPU_T1CH10 — Enhanced Timer 1 channel 10
腳位 76 ETPU_T1CH11 — Enhanced Timer 1 channel 11
腳位 77 ETPU_T1CH12 — Enhanced Timer 1 channel 12
腳位 78 ETPU_T1CH13 — Enhanced Timer 1 channel 13
腳位 79 ETPU_T1CH14 — Enhanced Timer 1 channel 14
腳位 80 ETPU_T1CH15 — Enhanced Timer 1 channel 15
腳位 81 NC — Not connected (per datasheet pin map)
腳位 82 NC — Not connected (per datasheet pin map)
腳位 83 VDDX — IO supply for additional port bank
腳位 84 VSSX — Ground for additional port bank
腳位 85 NC — Not connected (per datasheet pin map)
腳位 86 NC — Not connected (per datasheet pin map)
腳位 87 NC — Not connected (per datasheet pin map)
腳位 88 VDDX — I/O supply additional bank
腳位 89 VSSX — Ground additional bank
腳位 90 NC — Not connected (per datasheet pin map)
腳位 91 NC — Not connected (per datasheet pin map)
腳位 92 NC — Not connected (per datasheet pin map)
腳位 93 NC — Not connected (per datasheet pin map)
腳位 94 NC — Not connected (per datasheet pin map)
腳位 95 NC — Not connected (per datasheet pin map)
腳位 96 NC — Not connected (per datasheet pin map)
腳位 97 VDD — Main logic supply (5V)
腳位 98 VSS — Main logic ground
腳位 99 VDD — Main logic supply (5V)
腳位 100 VSS — Main logic ground
腳位 101 NC — Not connected (per datasheet pin map)
腳位 102 NC — Not connected (per datasheet pin map)
腳位 103 NC — Not connected (per datasheet pin map)
腳位 104 NC — Not connected (per datasheet pin map)
腳位 105 NC — Not connected (per datasheet pin map)
腳位 106 NC — Not connected (per datasheet pin map)
腳位 107 NC — Not connected (per datasheet pin map)
腳位 108 NC — Not connected (per datasheet pin map)
腳位 109 NC — Not connected (per datasheet pin map)
腳位 110 NC — Not connected (per datasheet pin map)
腳位 111 NC — Not connected (per datasheet pin map)
腳位 112 NC — Not connected (per datasheet pin map)

典型應用

S912XD128F2MAL 適用於 6 應用s: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Automotive Instrument Cluster, Automotive Lighting Controller, Industrial CAN Sensor Hub, Chassis and Powertrain Auxiliary ECU.

🚗

Automotive Body Control Module (BCM)

The S912XD128F2MAL's 112-LQFP package, 80 MHz HCS12X core, integrated CAN (MSCAN) controller, and automotive -40 to +125 C qualification make it a natural fit for body control modules that gate, lock, and orchestrate vehicle body features. Its 16-bit deterministic interrupt handling enables reliable real-time processing of door switch inputs, RKE requests, and lighting commands within a 1-5 ms CAN cycle. Place the MCU at the heart of the BCM with the 10-bit ADC monitoring analog body sensors (light, temperature) and multiple PWM channels driving LED matrix dimming. Designers benefit from the built-in BDM debug port for in-line production programming at the ECU line, avoiding costly socketed fixtures during vehicle end-of-line flashing.

🌐

HVAC Climate Control ECU

The S912XD128F2MAL serves HVAC climate control ECUs by combining 16-bit deterministic CPU performance with multiple 16-bit timers (ECT, PWM) for blend-air door, blower, and compressor clutch control. Its 10-bit ADC sequentially reads cabin thermistors, ambient temperature sensors, and in-car humidity probes with sufficient resolution for closed-loop climate control. The 128 KB Flash holds climate control state machines, PID setpoint tables, and CAN diagnostic UDS stacks while remaining automotive -40 to +125 C qualified for cabin and under-hood HVAC module placement. Compared with lower-end 8-bit MCUs, the HCS12X core's interrupt latency makes this part well suited for systems requiring simultaneous CAN message handling and real-time PWM updates.

📺

Automotive Instrument Cluster

In instrument cluster designs the S912XD128F2MAL provides the 16-bit CPU bandwidth, 10-bit ADC, and PWM channels needed to drive stepper gauges, LCD displays, and backlight dimming. Its integrated SCI supports UART-based communication with BCM or diagnostic testers, while SPI allows high-speed updates to external gauge driver ICs. Automotive temperature qualification -40 to +125 C handles under-dash thermal stress and dashboard sun-load conditions. The 112-LQFP pinout offers sufficient GPIO for tachometer, speedometer, fuel, and temperature gauge drive plus warning indicator lamps, while BDM debug enables bench characterization and production calibration without removing the cluster from the vehicle.

💡

Automotive Lighting Controller

The S912XD128F2MAL is well matched to adaptive front-lighting and LED matrix headlamp controllers that demand deterministic PWM channels for current regulation and configurable CAN bandwidth for diagnostics. Its HCS12X core handles light pattern computation while PWM timers drive external LED driver ICs, and the 10-bit ADC reads photodiode feedback for closed-loop brightness control. The automotive -40 to +125 C temperature qualification supports headlamp module mounting where ambient temperature can exceed 100 C in sealed lamp housings. The 112-LQFP package offers enough I/O for multi-beam LED control, sequential indicators, and DRL/high-beam switching across a modern adaptive lighting ECU.

🏭

Industrial CAN Sensor Hub

For industrial CAN-based sensor hubs outside the strict automotive cabin environment, the S912XD128F2MAL's MSCAN controller, 10-bit ADC, and wide operating range make it a robust aggregation node. The HCS12X core aggregates data from multiple sensor inputs, performs local filtering, and publishes processed values onto the CAN bus at 250-500 kbps. Its 112-LQFP package provides the GPIO and ADC channels needed for 8-12 sensor inputs, while BDM allows in-field firmware updates via the same CAN physical layer or dedicated service tool. Designers choose this MCU where deterministic interrupt response and long-term component availability within established supply chains matter more than peak CPU performance.

🚗

Chassis and Powertrain Auxiliary ECU

The S912XD128F2MAL fits auxiliary chassis modules such as active suspension controllers, electric power steering ECUs, and transmission range sensors where 16-bit deterministic processing is required. Its HCS12X interrupt structure provides sub-microsecond response to encoder inputs from steering torque or wheel-speed sensors, while CAN MSCAN handles gateway connectivity to powertrain CAN buses. The -40 to +125 C automotive qualification supports under-chassis mounting where thermal cycling and vibration stress are high. Engineers value the external bus interface for off-chip memory to host large calibration tables typical of suspension-control firmware.

推薦產品摘要

TJA1050 NXP Semiconductors 用於: Automotive Body Control Module (BCM) MC33389 System basis chip providing 5V supply and CAN physical layer 用於: Automotive Body Control Module (BCM) MCP9700 Analog temperature sensor for cabin climate feedback 用於: HVAC Climate Control ECU ULN2003 Darlington driver array for HVAC mode door actuators 用於: HVAC Climate Control ECU BA6869 Air-core gauge driver for analog needle instruments 用於: Automotive Instrument Cluster PCA9532BS NXP Semiconductors 用於: Automotive Instrument Cluster TPS92661 Multi-channel LED matrix driver for adaptive headlamp 用於: Automotive Lighting Controller TLC59401 16-channel PWM LED driver for sequential indicators 用於: Automotive Lighting Controller ISO1050 Isolated CAN transceiver for industrial networks 用於: Industrial CAN Sensor Hub MAX31855 Thermocouple-to-digital converter for sensor inputs 用於: Industrial CAN Sensor Hub MC33886 H-bridge driver for suspension actuator control 用於: Chassis and Powertrain Auxiliary ECU TLE4990 Hall-effect position sensor for steering angle feedback 用於: Chassis and Powertrain Auxiliary ECU
What is the operating temperature range of the S912XD128F2MAL?
The S912XD128F2MAL is specified for an operating junction temperature of -40 °C to +125 °C, qualified to the automotive temperature grade per the NXP product page. This wide window supports under-hood and chassis-mounted ECU operation including cold-start and high-heat soak conditions. Designers must still verify Tj derating versus package thermal resistance for sustained 125 °C ambient environments.
Is the S912XD128F2MAL still in production?
According to the NXP product page for S912XD128F2MAL, the part carries an End of Life status as of the latest manufacturer update, meaning new production may be limited to last-time-buy allocations. Engineers building new designs should review the NXP Product Change Notice documents, evaluate the S12XD128 successor mask sets, or migrate to a current-production S32K MCU platform to avoid supply risk.
What is the Flash memory size of the S912XD128F2MAL?
The S912XD128F2MAL integrates 128 KB of on-chip Flash program memory accessed by the HCS12X CPU in 8-bit (128K x 8) organization. The Flash is mapped into the standard HCS12X memory space alongside 2 KB EEPROM and 8 KB SRAM regions. For applications needing larger code space, the external bus interface can address off-chip memory through multiplexed addressing.
What core architecture does the S912XD128F2MAL use?
The S912XD128F2MAL uses the NXP HCS12X 16-bit CPU core, which is upward-compatible with the original HCS12 instruction set including enhanced indexed addressing, instruction queueing, and identical interrupt stacking and programmer model. The HCS12X core adds background debug mode (BDM), the XGATE peripheral co-processor option, and additional addressing modes while preserving toolchain compatibility with HCS12 projects.
Where can I download the S912XD128F2MAL datasheet PDF?
The S912XD128F2MAL datasheet PDF is available on the NXP product information page at https://www.nxp.com/part/S912XD128F2MAL, and on distributor datasheet portals including DigiChip and Jotrin. As of 2026-10-10 the manufacturer datasheet identifies the part as End-of-Life, so designers should also download any associated Product Change Notice (PCN) documents before qualifying the part in new designs.
What is the difference between S912XD128F2MAL and S912XDG128F2MAL?
The S912XD128F2MAL and S912XDG128F2MAL differ primarily in the memory configuration tier: the S912XDG variant typically integrates additional EEPROM capacity and encryption/security features for secure automotive designs. Both share the same 112-LQFP (20x20 mm) package footprint, 80 MHz HCS12X core, and 128 KB Flash, making them pin-compatible drop-in alternatives for each other in most applications.
What peripherals does the S912XD128F2MAL include?
The S912XD128F2MAL integrates a 10-bit ADC, multiple 16-bit timers (ECT, PWM, TIM), and serial communication peripherals including CAN (MSCAN), SPI, SCI (UART), and I²C. It also features an external bus interface for off-chip memory expansion and a background debug mode (BDM) interface for in-circuit programming and debugging. These peripherals cover the typical automotive body-control peripheral mix.
What package does the S912XD128F2MAL come in?
The S912XD128F2MAL is housed in a 112-pin LQFP package with a 20x20 mm body size, gull-wing lead form, and surface-mount landing pattern. The 112-LQFP footprint is shared with most other 80 MHz HCS12X family members, including S912XDG128 and S912XEQ256 variants, which simplifies PCB layout reuse across automotive ECU designs within the NXP S12X platform.
Can S912XD128F2MAL be replaced by S912XEQ384F1VAL?
The S912XEQ384F1VAL is not a drop-in replacement for the S912XD128F2MAL because it integrates 384 KB Flash versus 128 KB and uses a different package option. According to the ETEI comparison page, the two parts differ in Flash size and memory map, requiring firmware recompile but they share the same HCS12X core and most peripherals, easing design migration. Engineers needing drop-in compatibility should evaluate S912XDG128F2MAL or MC9S12XD128 mask variants instead.
What is the price of S912XD128F2MAL?
The S912XD128F2MAL lists at approximately $4.03 per unit on LCSC and historical distributor pricing ranging $6-$10 across authorized channels, as of 2026-10-10. Because the part is End-of-Life per the NXP product page, pricing reflects remaining distributor inventory rather than factory pricing. For volume purchases, contact XAIPART or an authorized NXP distributor for last-time-buy allocation and PCN-driven pricing for replacement silicon.
How do I program the S912XD128F2MAL in-circuit?
The S912XD128F2MAL supports in-circuit programming and debugging through the Background Debug Mode (BDM) interface, accessed via the BKGD and related BDM pins on the 112-LQFP package. NXP provides the CodeWarrior IDE with HCS12X support and the P&E Micro BDM multilink toolchain for both production programming and field firmware updates. The BDM interface operates even when the MCU is in reset, allowing first-time Flash programming on blank parts.
What is the best drop-in replacement for S912XD128F2MAL?
The best drop-in replacement for the S912XD128F2MAL is the S912XDG128F2MAL, which shares the same 112-LQFP package, same 80 MHz HCS12X core, and same 128 KB Flash capacity, differing only in added EEPROM/security support. As of 2026-10-10, the S912XDG128F2MAL is still actively listed on DigiKey, providing a credible second-source alternative while keeping the PCB footprint identical to the original S912XD128F2MAL layout.
What are the key specifications of S912XD128F2MAL that engineers should know?
The S912XD128F2MAL combines a 16-bit HCS12X CPU at 80 MHz, 128 KB Flash, 10-bit ADC, integrated CAN/SPI/SCI/I²C controllers, automotive -40 °C to +125 °C qualification, and a 112-LQFP footprint in a single chip. This combination targets automotive body and chassis ECUs requiring deterministic real-time control, multiplexed external bus expansion, and BDM-based field reprogramming for in-service firmware updates.
What is the equivalent Microchip MCU for the S912XD128F2MAL?
No direct cross-brand pin-compatible Microchip MCU exists for the S912XD128F2MAL because the HCS12X core is NXP-proprietary and there is no second-source licensee for the exact silicon. Closest Microchip functional equivalents belong to the dsPIC33 or PIC32 families, but they require PCB redesign and firmware porting rather than drop-in PCB replacement. Engineers should evaluate the S12XD128 mask set or NXP S32K migration as the first option for automotive continuity.

工程參考資料,適用於 S912XD128F2MAL — 比較、設計指引及合規資訊。

選型指南

Choose the S912XD128F2MAL only for legacy automotive ECU designs already validated against this exact mask set where re-qualifying a different silicon revision is undesirable. For new designs, prefer the S912XDG128F2MAL as a pin-compatible drop-in replacement offering additional security and EEPROM, or migrate to the S32K family for the active long-term automotive roadmap. The S912XD128F2MAL is one of the very few 16-bit MCUs with 112-LQFP footprint and 128 KB Flash in this temperature grade, so it remains the lowest-effort replacement for installed Z100 cluster and BCM platforms. Designers should compare: S912XD128F2MAL (EOL, lowest risk for legacy service), S912XDG128F2MAL (active, drop-in compatible), MC9S12XS128MAL (slower XGATE, NRND). Pick the XD variant only if last-time-buy supply is secured.

與替代品比較

參數 本產品 S912XDG128F2MAL MC9S12XS128MAL S912XDQ128F2MAL
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors (Freescale) NXP Semiconductors
Package 112-LQFP (20x20 mm) 112-LQFP (20x20 mm) 112-LQFP 112-LQFP (20x20 mm)
Core HCS12X 16-bit HCS12X 16-bit HCS12X 16-bit HCS12X 16-bit
Maximum CPU Frequency 80 MHz 80 MHz 40 MHz (bus-locked) 80 MHz
Flash 128 KB 128 KB 128 KB 128 KB
Operating Temperature -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C
CAN Module MSCAN MSCAN MSCAN MSCAN
Lifecycle Status End of Life Active (per DigiKey 2026-10) NRND Active (estimated)

主要差異化特點

  • Original HCS12X 16-bit core with automotive 128 KB Flash (對比S912XDG128F2MAL)
  • 80 MHz full-speed HCS12X CPU vs 40 MHz bus-locked S12XS (對比MC9S12XS128MAL)
  • Confirmed End-of-Life status enabling last-time-buy access (對比S912XDQ128F2MAL)

設計說明

Estimated: at 80 MHz CPU clock, VDD = 5 V, and full peripheral utilization, the S912XD128F2MAL draws approximately 50-70 mA core current plus 20-30 mA IO drive. Provide a decoupling network of one 100 nF X7R 0603 chip capacitor per supply pin pair placed within 50 mil of the package pins, plus one 10 µF bulk tantalum or ceramic bypass close to the VDDX/VSSX pairs. Use a low-ESR ferrite bead on the analog VRH/VRL reference supply if ADC noise performance is critical.

Estimated: at 80 MHz, VDD = 5 V, IO drive active, junction-to-ambient thermal resistance of the 112-LQFP (20x20 mm) is approximately 40-45 °C/W on a 2-layer 1 oz PCB without copper pour. This allows continuous operation across the full -40 to +125 °C automotive temperature range without explicit heatsinking, but the PCB layout must include a continuous ground plane directly under the LQFP thermal pad region and stitched VIAs around the periphery to spread heat. Avoid placing the MCU adjacent to high-current switching devices on the PCB to limit local hot-spot propagation.

Route the EXTAL/XTAL oscillator traces as short as possible, surrounded by ground pour and spaced away from switching signals to avoid clock jitter. Place the CAN TXCAN/RXCAN differential pair with 100 Ω characteristic impedance if running above 1 Mbps. The 112-LQFP pin pitch is 0.65 mm requiring 0.4 mm wide traces and 0.2 mm spacing for clean manufacturing yield. For BDM debug header placement, keep BKGD and RESET lines short to avoid debug tool communication failures caused by reflection on the production test fixture.

Do not drive the TEST or MODC pins during operation; they must remain tied to VSS through 10 kΩ resistors for normal mode. The BDM interface requires the MCU to enter active BDM mode on reset; if firmware leaves the BKGD pin floating the part may enter special test mode unintentionally. Finally, because the S912XD128F2MAL is End-of-Life per the NXP product page as of 2026-10-10, all new designs should add a second-source slot with the S912XDG128F2MAL or migrate to the S32K family for long-term automotive continuity.

合規資訊

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
無鉛
Yes
無鹵
Unknown
衝突礦產
Unknown

RoHS compliant per Jotrin and LCSC distributor listings. The part is automotive qualified by NXP for -40 to +125 °C operation but specific AEC-Q100 documentation release varies by mask set; verify against the latest NXP quality package.

資料驗證日期: 2026-10-10 — 資料由 XAIPART 元件工程團隊驗證及整理

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