S9S08AW16AE0CLDR vs MC9S08AW16MPUE 比較
詳細並排比較 S9S08AW16AE0CLDR 由 NXP Semiconductors 與 MC9S08AW16MPUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | S9S08AW16AE0CLDR | MC9S08AW16MPUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| Core Architecture | HCS08 | — |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Program Memory Size | 16 KB (16K x 8) | 16 KB Flash |
| Program Memory Type | FLASH | — |
| RAM Size | 1 KB (1K x 8) | 1 KB |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Number of I/O | 34 | — |
| Connectivity | I2C, SCI (UART), SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| 封裝 | 44-LQFP (10x10 mm) | — |
| 工作溫度 | -40C to +85C | — |
| 供應電壓 | 3 V (typical) | — |
| 安裝類型 | Surface Mount | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | — |
| RoHS 狀態 | Compliant | Compliant |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| AEC-Q100 Qualified | Yes (Automotive) | — |
| Core | — | HCS08 (enhanced S08) |
| 資料匯流排寬度 | — | 8 bit |
| 最大時脈頻率 | — | 40 MHz |
| ADC Resolution | — | 10 bit |
| Number of I/Os | — | 54 I/O |
| 工作電源電壓 | — | 2.7 V to 5.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +125 C (Automotive Grade 1) |
| 安裝方式 | — | SMD/SMT |
| 封裝 / 外殼 | — | 64-LQFP (10x10 mm, gull-wing) |
| Package Code (per JEDEC) | — | LFQFP |
| Series | — | MC9S08AW16 (S08AW family) |
| Communication Interfaces | — | SCI, SPI, I2C |
| Timers | — | TPM, MTIM, RTI |
| Watchdog | — | Yes (COP) |
| Low Voltage Detect (LVD) | — | Yes |
| Lead-Free | — | Yes |