S9S08DZ96F2MLH vs S9S08DZ32F1MLF 比較

詳細並排比較 S9S08DZ96F2MLH 由 NXP Semiconductors 與 S9S08DZ32F1MLF 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
S9S08DZ96F2MLH S9S08DZ96F2MLH - 8-bit S08 MCU, 96KB Flash, CAN | NXP

S9S08DZ96F2MLH - 8-bit S08 MCU, 96KB Flash, CAN | NXP

S9S08DZ96F2MLH ✓ 啟用中
NXP Semiconductors
S9S08DZ32F1MLF S9S08DZ32F1MLF - 40MHz HCS08 MCU, 32KB Flash, 48-LQFP | NXP

S9S08DZ32F1MLF - 40MHz HCS08 MCU, 32KB Flash, 48-LQFP | NXP

S9S08DZ32F1MLF ✓ 啟用中

規格比較

參數 S9S08DZ96F2MLH S9S08DZ32F1MLF
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core S08 (HCS08), 8-bit —
Number of Cores 1 —
最大時脈頻率 40 MHz —
Program Memory Size 96 KB Flash —
Data EEPROM Size 2 KB —
RAM Size [DATA_NEEDED: RAM size] —
工作電源電壓 [DATA_NEEDED: operating supply voltage range] —
工作溫度範圍 -40C to +125C —
CAN Embedded CAN (CAN 2.0) —
On-Chip Debug On-chip emulation/debug (background debug) —
封裝 LQFP-64 (QFP 64, square, LFQFP) 48-LQFP (7x7 mm)
Number of Terminals 64 —
Terminal Form Gull Wing —
安裝類型 Surface Mount Surface Mount
Qualification Automotive Qualified (AEC-Q100 grade per NXP S9S08DZ family) —
Program Memory Width 8 bit —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
Packaging Tray —
Core Architecture — HCS08 (enhanced S08, HC08-compatible with BGND)
CPU Frequency — 40 MHz (20 MHz bus)
Instruction Set — HC08 with BGND
Program Memory (Flash) — 32 KB (32K x 8)
RAM — 2 KB (2K x 8)
Number of I/O Pins — 39
供應電壓 — 2.7 V to 5.5 V
CAN Controller — 1 x CAN 2.0 A/B
Serial Interfaces — SCI (UART), SPI
ADC — 10-bit, up to 16 channels [DATA_NEEDED: exact ADC channel count for this mask set]
Timers — TPM modules [DATA_NEEDED: exact TPM count and channel count]
工作溫度 — -40 C to +125 C (automotive grade)
Mask Set — M74K (MASK ONLY-AUTO)

資料表與資源

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