S9S08DZ96F2VLL vs S9S08DZ32F1MLF 比較

詳細並排比較 S9S08DZ96F2VLL 由 NXP Semiconductors 與 S9S08DZ32F1MLF 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
S9S08DZ96F2VLL S9S08DZ96F2VLL - 8-bit MCU, 96KB Flash, 40MHz | NXP

S9S08DZ96F2VLL - 8-bit MCU, 96KB Flash, 40MHz | NXP

S9S08DZ96F2VLL ✓ 啟用中
NXP Semiconductors
S9S08DZ32F1MLF S9S08DZ32F1MLF - 40MHz HCS08 MCU, 32KB Flash, 48-LQFP | NXP

S9S08DZ32F1MLF - 40MHz HCS08 MCU, 32KB Flash, 48-LQFP | NXP

S9S08DZ32F1MLF ✓ 啟用中

規格比較

參數 S9S08DZ96F2VLL S9S08DZ32F1MLF
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core S08 (HCS08), 8-bit —
CPU Frequency 40 MHz (20 MHz bus) 40 MHz (20 MHz bus)
Instruction Set HC08 with added BGND instruction HC08 with BGND
Flash Memory 96 KB (96K x 8) —
RAM 6 KB (6K x 8) 2 KB (2K x 8)
EEPROM 2 KB embedded —
ADC Resolution 12-bit —
ADC Channels 24-channel —
ADC Conversion Time 2.5 us —
DMA Controller Yes —
PWM Channels Yes —
CAN Embedded CAN module —
I/O Lines 87 —
Interrupt/Reset Sources Up to 32 —
Oscillator Type External —
工作溫度 -40C to +105C -40 C to +125 C (automotive grade)
Qualification Automotive Qualified —
封裝 100-LQFP (14x14 mm), LFQFP, gull wing 48-LQFP (7x7 mm)
安裝類型 Surface Mount Surface Mount
Packaging Tray —
Core Architecture — HCS08 (enhanced S08, HC08-compatible with BGND)
Program Memory (Flash) — 32 KB (32K x 8)
Number of I/O Pins — 39
供應電壓 — 2.7 V to 5.5 V
CAN Controller — 1 x CAN 2.0 A/B
Serial Interfaces — SCI (UART), SPI
ADC — 10-bit, up to 16 channels [DATA_NEEDED: exact ADC channel count for this mask set]
Timers — TPM modules [DATA_NEEDED: exact TPM count and channel count]
Mask Set — M74K (MASK ONLY-AUTO)
RoHS 狀態 — Compliant

資料表與資源

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