S9S12DG25F0MPVE vs MC9S12E64MPVE 比較
詳細並排比較 S9S12DG25F0MPVE 由 NXP Semiconductors 與 MC9S12E64MPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP
S9S12DG25F0MPVE ✓ 啟用中規格比較
| 參數 | S9S12DG25F0MPVE | MC9S12E64MPVE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core Processor | HCS12 | — |
| Core Size | 16-Bit | — |
| CPU Speed | 25 MHz | — |
| Program Memory Type | FLASH | — |
| Program Memory Size | 256 KB (256K x 8) | — |
| EEPROM Size | 4 KB (4K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size in KB] | 4 KB (4K x 8) |
| Number of I/O | 91 | 92 |
| Connectivity | CANbus, I²C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| ADC | 2x 8-channel, 10-bit | 8-channel, 10-bit [DATA_NEEDED: channels per mask set] |
| Timers | 8-channel IC/OC Enhanced Capture Timer | — |
| 工作溫度 | -40°C to +125°C | — |
| 封裝 / 外殼 | 112-LQFP (20 x 20 mm) | 112-LQFP (20 x 20 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| Automotive Qualification | AEC-Q100 Qualified | — |
| RoHS 狀態 | Compliant | Compliant (per ETEI comparison) |
| Lead-Free | Yes | — |
| Core | — | HCS12 (16-bit CISC) |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| Maximum CPU Clock / Bus Speed | — | 25 MHz |
| 工作電源電壓 | — | 2.5 V / 3.3 V / 5 V |
| Terminal Form | — | GULL WING |
| Number of Terminals | — | 112 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | Automotive (per Partstack listing) |
| CAN Controllers | — | Up to 2 x MSCAN (CAN 2.0A/B) [DATA_NEEDED: exact count per mask] |
| PWM | — | 8-channel [DATA_NEEDED: resolution] |
| Debug Interface | — | Background Debug Mode (BDM) |
| REACH Status | — | Compliant (per ETEI comparison) |
| Series | — | HCS12 |