S9S12DG25F0MPVE vs MC9S12E64MPVE 对比

详细并排对比 S9S12DG25F0MPVE 出自 NXP Semiconductors 和 MC9S12E64MPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S12DG25F0MPVE S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP

S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP

S9S12DG25F0MPVE ✓ 量产中
NXP Semiconductors
MC9S12E64MPVE MC9S12E64MPVE - 16-Bit HCS12 MCU 64KB Flash | NXP

MC9S12E64MPVE - 16-Bit HCS12 MCU 64KB Flash | NXP

MC9S12E64MPVE Nrnd

规格对比

参数 S9S12DG25F0MPVE MC9S12E64MPVE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $19.10 $10.55
Core Processor HCS12 —
Core Size 16-Bit —
CPU Speed 25 MHz —
Program Memory Type FLASH —
Program Memory Size 256 KB (256K x 8) —
EEPROM Size 4 KB (4K x 8) —
RAM Size [DATA_NEEDED: RAM size in KB] 4 KB (4K x 8)
Number of I/O 91 92
Connectivity CANbus, I²C, SCI, SPI —
Peripherals PWM, WDT —
ADC 2x 8-channel, 10-bit 8-channel, 10-bit [DATA_NEEDED: channels per mask set]
Timers 8-channel IC/OC Enhanced Capture Timer —
工作温度 -40°C to +125°C —
封装 / 外壳 112-LQFP (20 x 20 mm) 112-LQFP (20 x 20 mm)
安装类型 Surface Mount Surface Mount
Automotive Qualification AEC-Q100 Qualified —
RoHS 状态 Compliant Compliant (per ETEI comparison)
Lead-Free Yes —
Core — HCS12 (16-bit CISC)
Program Memory (Flash) — 64 KB (64K x 8)
Maximum CPU Clock / Bus Speed — 25 MHz
工作电源电压 — 2.5 V / 3.3 V / 5 V
Terminal Form — GULL WING
Number of Terminals — 112
Package Shape — SQUARE
Temperature Grade — Automotive (per Partstack listing)
CAN Controllers — Up to 2 x MSCAN (CAN 2.0A/B) [DATA_NEEDED: exact count per mask]
PWM — 8-channel [DATA_NEEDED: resolution]
Debug Interface — Background Debug Mode (BDM)
REACH Status — Compliant (per ETEI comparison)
Series — HCS12

数据手册与资源

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