SPC5516GBMLQ66 vs SPC5643LFF2MLL6 比較

詳細並排比較 SPC5516GBMLQ66 由 NXP Semiconductors 與 SPC5643LFF2MLL6 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
SPC5516GBMLQ66 SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP

SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP

SPC5516GBMLQ66 ✓ 啟用中
NXP Semiconductors
SPC5643LFF2MLL6 SPC5643LFF2MLL6 - 32-bit Dual-Core 64MHz MCU, 1MB Flash | NXP

SPC5643LFF2MLL6 - 32-bit Dual-Core 64MHz MCU, 1MB Flash | NXP

SPC5643LFF2MLL6 ✓ 啟用中

規格比較

參數 SPC5516GBMLQ66 SPC5643LFF2MLL6
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core Processor e200z0, e200z1 e200z4 (Power Architecture)
Core Size 32-Bit Dual-Core 32-Bit Dual-Core
Core Architecture Power Architecture (MPC55xx Qorivva) —
Maximum Clock Speed 66 MHz —
Program Memory Size 1 MB (1M x 8) FLASH —
Program Memory Type Flash with ECC —
RAM Size [DATA_NEEDED: RAM size] —
供應電壓 4.5 V to 5.25 V 3.3 V / 5 V
Number of I/O 111 [DATA_NEEDED: Number of I/O]
Connectivity CANbus, EBI/EMI, I2C, SCI, SPI CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
資料匯流排寬度 32-bit —
封裝 144-LQFP (20 x 20 mm, 1.40 mm height) 100-LQFP (14 x 14 mm)
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +125C (AEC-Q100 Grade 3) -40C to +125C
AEC-Q100 Qualified Yes (automotive grade) —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
MSL 等級 [DATA_NEEDED: MSL rating] —
Max Clock Speed — 64 MHz
Flash Memory — 1 MB (1M x 8)
Architecture — Dual Power Architecture (functional safety features on-chip)
Series — MPC56xx Qorivva
Grade — Automotive
Part Status — Active
SRAM Size — [DATA_NEEDED: SRAM size]

資料表與資源

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