SPC5604BF1MLL6 vs SPC5602BF1MLL6 比較

詳細並排比較 SPC5604BF1MLL6 由 NXP Semiconductors 與 SPC5602BF1MLL6 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
SPC5604BF1MLL6 SPC5604BF1MLL6 - 32-bit MCU 512KB Flash 100-Pin LQFP | NXP

SPC5604BF1MLL6 - 32-bit MCU 512KB Flash 100-Pin LQFP | NXP

SPC5604BF1MLL6 ✓ 啟用中
NXP Semiconductors
SPC5602BF1MLL6 SPC5602BF1MLL6 - 32-bit Auto MCU, 256KB Flash, 64MHz | NXP

SPC5602BF1MLL6 - 32-bit Auto MCU, 256KB Flash, 64MHz | NXP

SPC5602BF1MLL6 ✓ 啟用中

規格比較

參數 SPC5604BF1MLL6 SPC5602BF1MLL6
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core Architecture Power Architecture e200z0h —
Core Size 32-bit Single-Core —
Program Memory Size 512KB Flash —
RAM Size 32KB —
最大時脈頻率 64 MHz —
供應電壓 3.3V / 5V (automotive range) 3.3 V / 5 V
封裝 LQFP-100 (14x14 mm, Gull Wing) 100-LQFP (14x14 mm)
Number of Terminals 100 100
Terminal Form Gull Wing GULL WING
Temperature Grade Automotive (-40C to +125C) AUTOMOTIVE
ADC 12-bit (10/12-bit modes available) 10-bit (integrated)
Communication Interfaces FlexCAN, LINFlex, UART, SPI, I2C CAN, LIN, SPI, SCI
Timer Module eMIOS (PWM/IC/OPWM) —
Debug Interface JTAG / Nexus —
安裝類型 Surface Mount Surface Mount
RoHS 狀態 Compliant ROHS3 Compliant
AEC-Q100 Qualification Qualified —
Packaging Tray —
Core — PowerPC e200z0
CPU Architecture — 32-bit
Maximum CPU Frequency — 64 MHz
Program Memory (Flash) — 256 KB
RAM — [DATA_NEEDED: RAM size]
工作溫度範圍 — -40C to +125C (Automotive)
Package Code — QFP
Package Shape — SQUARE

資料表與資源

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