XC6SLX25-2FGG484I vs XC6SLX45-2FGG484I 比較
詳細並排比較 XC6SLX25-2FGG484I 由 AMD 與 XC6SLX45-2FGG484I 由 AMD. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | XC6SLX25-2FGG484I | XC6SLX45-2FGG484I |
|---|---|---|
| 品牌 | AMD | AMD |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24051 | 43,661 |
| Block RAM | 958464 bits | 2,138,112 bits (2,088 Kb/s) |
| DSP Slices | 52 | — |
| User I/O | 266 | — |
| 封裝 | 484-BBGA (23x23 mm, 1 mm pitch) | 484-ball BGA (FBGA-484) |
| Core Voltage | 1.2 V | — |
| Internal Frequency | 500 MHz | — |
| Speed Grade | -2 | -2 |
| 工作溫度 | -40°C to +100°C | — |
| Process Technology | 45 nm CMOS | 45 nm low-power CMOS |
| 安裝類型 | Surface Mount | — |
| RoHS | Compliant | — |
| Lead Free | Yes | — |
| Configuration Modes | Master SPI, Slave SelectMAP, JTAG | — |
| Logic Slices | — | 6,822 |
| Flip-Flops | — | 54,576 |
| DSP Slices (DSP48A1) | — | 58 |
| Maximum User I/O | — | 316 |
| Package Dimensions | — | 23 x 23 mm, 1.0 mm ball pitch |
| Operating Temperature (I grade) | — | -40C to +100C (industrial) |
| Supply Voltage Core | — | 1.2 V typical |
| Clock Management Tiles | — | 6 CMT (4 DCM + 2 PLL) |
| Maximum I/O Speed | — | 800 Mbps LVDS |
| Memory Interface Support | — | DDR, DDR2, DDR3, LPDDR |
| Configuration Memory | — | AES-256 bitstream encryption |
| RoHS Compliance | — | Lead-free / RoHS compliant |