10AX115N1F45I1SG - Arria 10 GX FPGA 1150K LE FCBGA-1932 | Intel
MPN： 10AX115N1F45I1SG ✓ 啟用中10AX115N1F45I1SG 概覽
An FPGA is a reprogrammable integrated circuit that lets designers implement arbitrary digital logic using configurable logic blocks (CLBs), routing resources, and hardened IP. Modern FPGAs such as the Arria 10 GX also integrate high-speed transceivers, external memory controllers (EMIFs), DSP blocks, and PCIe hard IP, placing them in the hierarchy: programmable logic -> FPGA -> programmable logic device (PLD) -> digital integrated circuit -> semiconductor. The Arria 10 family targets mid-range applications that require a balance of logic density, transceiver bandwidth, and power efficiency.
Key features include 17.4 Gbps transceivers with hardened PCS/PMA, hardware PCIe Gen3 x8 IP blocks, variable-precision DSP with hardened IEEE 754 single-precision floating-point support, and SmartVID core voltage scaling for dynamic power reduction. The 1932-ball FCBGA package is one of the largest Intel offers for this family, providing the maximum user I/O count of 768 and the densest pin escape for high-bandwidth memory and transceiver interfaces. Configuration is supported through JTAG, AS, PS, and FPP modes.
Typical applications for the 10AX115N1F45I1SG include 100G/40G/10G optical transport line cards, 4K/8K video broadcast and image processing pipelines, 5G fronthaul/baseband prototyping, radar and electronic-warfare DSP front-ends, high-speed test and measurement instrumentation, and ASIC prototyping where 1.15M logic elements and 17.4 Gbps transceivers are required.
When designing with this device, plan PCB layer stackup for the FCBGA-1932 escape (typically 16+ layers with stacked vias), provide matched-length routing for transceiver channels, and verify the Quartus Prime power estimator early in the cycle. Thermal dissipation at full transceiver utilization can exceed 25W; the FCBGA package requires a properly designed thermal management solution including heatsink and airflow.
This page synthesizes distributor availability, same-package Arria 10 drop-in alternatives, and practical design notes that are not consolidated in the official Intel datasheet alone.
直接替換替代品，適用於 10AX115N1F45I1SG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX115N1F45I1SG （相同外形與佔位） — 差異在於 Package, Speed Grade, DSP Blocks, Temperature Grade, Transceivers.
10AX115N1F45E1SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115N1F40I1SG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115N1F45I1SG 最大額定值與電氣特性
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| DSP Blocks | 1,518 |
| Maximum User I/Os | 768 |
| Transceivers | Up to 24 |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| Hardened PCIe Blocks | PCIe Gen3 x8 |
| Process Node | TSMC 20nm |
| 封裝 | 1932-ball FCBGA (F45) |
| 工作溫度 | -40C to +100C (industrial) |
| Speed Grade | 1 |
| Configuration Modes | JTAG, AS, PS, FPP |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount (BGA) |
10AX115N1F45I1SG 1932-ball fcbga (f45) 腳位配置指南
10AX115N1F45I1SG（1932-ball fcbga (f45) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX115N1F45I1SG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX115N1F45I1SG 適用於 7 應用s: 100G/40G Optical Transport Line Cards, 4K/8K Video Broadcast and Image Processing, 5G Fronthaul and Baseband Prototyping, Radar and Electronic-Warfare DSP Front-Ends, High-Speed Test and Measurement Instrumentation, ASIC Prototyping with High-Speed Serial, Industrial High-Performance DSP and Motor Control.
100G/40G Optical Transport Line Cards
The 10AX115N1F45I1SG is well suited for 100G and 40G OTN/optical line-card designs where the 24 transceivers at up to 17.4 Gbps each can be aggregated into a 4x25G CAUI-4 or 10x10G configuration. The 1,150,000 logic elements and 1,518 DSP blocks provide ample capacity for OTN framer/mapper, FEC, MAC, and packet-processing functions, while the FCBGA-1932 F45 package exposes the maximum user I/O count of 768 for multi-lane parallel interfaces. Compared with discrete ASSP+FPGA implementations, the integrated transceiver hard IP reduces BOM cost and PCB area. Designers should budget power at roughly 1.5W per active 17.4 Gbps channel and confirm thermal headroom via the Quartus Prime power estimator before tape-out.
推薦
4K/8K Video Broadcast and Image Processing
For 4K and 8K video broadcast, contribution, and live production workflows, the 10AX115N1F45I1SG provides the variable-precision DSP blocks (1,518 instances) and embedded memory (68 Mbits) needed for multi-channel HEVC/H.264 encoding/decoding pipelines, color-space conversion, frame-rate conversion, and SDI de-embedding. The 768 user I/Os on the FCBGA-1932 package allow multi-channel 12G-SDI or quad-link 3G-SDI ingest without external muxing, and the industrial temperature grade suits broadcast rack environments. Hard PCIe Gen3 x8 IP accelerates host offload paths to broadcast servers. Expect 25-40W core power at full DSP utilization; pair the device with a properly heatsinked cold plate for rack deployments.
推薦
5G Fronthaul and Baseband Prototyping
The 10AX115N1F45I1SG is a strong choice for 5G fronthaul (CPRI/eCPRI up to option 7-2x) and baseband prototyping because its 17.4 Gbps transceivers natively support CPRI line rates up to 16 Gbps, while the 1,150,000 logic elements and 1,518 DSP blocks provide headroom for PHY/macro-layer baseband processing and L1 acceleration. The PCIe Gen3 x8 hard IP connects directly to host processors for split-RU architectures. With up to 768 user I/Os in the F45 package, multiple antenna streams and JEDEC 204B/JESD204C converters can be routed without external fanout. Industrial temperature grade suits outdoor RU deployments. Plan PCB stackup with 16+ layers for the FCBGA-1932 fanout.
推薦
Radar and Electronic-Warfare DSP Front-Ends
For radar and electronic-warfare (EW) front-end processing, the 10AX115N1F45I1SG combines 1,518 variable-precision DSP blocks (with hardened IEEE 754 single-precision floating point) and 24 transceivers up to 17.4 Gbps to support wide-bandwidth ADC/DAC interfaces via JESD204B/C. The 1,150,000 logic elements provide channel-count headroom for phased-array beamforming, pulse compression, and adaptive MTI filters, while the industrial -40C to +100C temperature range handles ruggedized and airborne environments. The FCBGA-1932 package exposes 768 user I/Os for multi-element array antennas. SmartVID core scaling helps manage the high transient power of pulse-Doppler modes.
推薦
High-Speed Test and Measurement Instrumentation
The 10AX115N1F45I1SG targets high-end oscilloscope, logic analyzer, and protocol-analyzer platforms where 24 transceivers at 17.4 Gbps provide multi-channel acquisition paths and PCIe Gen3 x8 hard IP accelerates host offload. The 1,518 DSP blocks enable real-time FFT, filtering, and trigger decoding across hundreds of input channels, while 768 user I/Os accommodate multi-bus probes. Industrial temperature grade suits lab and field test equipment. Designers can use the Quartus Prime Signal Tap logic analyzer for real-time internal visibility. Power dissipation scales with active channel usage; budget heatsink airflow accordingly.
推薦
ASIC Prototyping with High-Speed Serial
The 10AX115N1F45I1SG is widely used as an ASIC prototyping vehicle because 1,150,000 logic elements can map multi-million-gate ASIC designs partitioned across multiple FPGAs, while the 24 transceivers at 17.4 Gbps enable chip-to-chip serialization between FPGA sites at native ASIC clock rates. The FCBGA-1932 F45 package exposes 768 user I/Os - close to the practical maximum for production ASIC emulation - allowing prototype bring-up with realistic I/O loading. PCIe Gen3 x8 hard IP accelerates host-attached verification. Industrial temperature grade supports accelerated thermal stress tests during bring-up.
推薦
Industrial High-Performance DSP and Motor Control
For industrial factory automation, motor-control, and machine-vision systems, the 10AX115N1F45I1SG combines variable-precision DSP blocks (1,518), industrial -40C to +100C temperature support, and 768 user I/Os for multi-axis servo, encoder feedback, and GigE Vision camera links. Hard PCIe Gen3 x8 IP connects to industrial PCs and edge controllers, while the 17.4 Gbps transceivers can drive CoaXPress or 10G Ethernet uplinks. Compared with separate DSP and microcontroller ICs, the integrated Arria 10 platform simplifies BOM and reduces latency in closed-loop control paths.
推薦
推薦產品摘要
工程參考資料，適用於 10AX115N1F45I1SG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX115N1F45E1SG | 10AX115N1F40I1SG |
|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FCBGA-1932 (F45) | FCBGA-1932 (F45) - same | FCBGA-1517 (F40) - different |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| DSP Blocks | 1,518 | 1,518 | 1,518 |
| Transceivers | Up to 24 (17.4 Gbps) | Up to 24 (17.4 Gbps) | Up to 24 (17.4 Gbps) |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Industrial (-40C to +100C) |
| Speed Grade | 1 | 1 | 1 |
主要差異化特點
- Highest I/O count package in the Arria 10 115K family (對比10AX115N1F40I1SG)
- Speed-grade 1 transceivers optimized for lower-power designs (對比10AX115N2F45I2SG)
- Industrial temperature grade vs extended (對比10AX115N1F45E1SG)
- SmartVID dynamic voltage scaling (對比10AX090 family)
設計說明
At full transceiver utilization (24 channels at 17.4 Gbps) and 80% DSP utilization, the 10AX115N1F45I1SG can dissipate 25-35W core power. The FCBGA-1932 F45 package requires a high-performance thermal interface and either a heatsink with forced airflow (>=150 LFM) or a cold plate. Use the Quartus Prime Power Estimator early in the design cycle to predict worst-case junction temperature and validate that theta_JA stays within the -40C to +100C industrial envelope. Recommended junction-to-ambient thermal resistance is below 1.5 C/W for full-load operation.
The FCBGA-1932 F45 45mm package has a 1mm ball pitch and is the largest in the Arria 10 family. Plan a 16+ layer PCB stackup with stacked micro-vias for the inner rows and through-vias on the outer rows. Use the Intel Arria 10 package-specific breakout routing guidelines for signal integrity and matched-length routing on transceivers. Decoupling requires roughly 40-80 capacitors placed adjacent to power balls per the reference schematic.
Transceiver channels up to 17.4 Gbps require controlled-impedance routing (100 ohm differential), tight intra-pair skew (<1 ps/inch), and continuous reference planes for return-path integrity. The FCBGA-1932 package uses Intel-recommended escape patterns - deviate only after consulting the package datasheet. Pre-emphasis and equalization settings should be tuned with the Quartus Prime Transceiver Toolkit.
Avoid mixing F45 and F40 Arria 10 PCBs without revalidating firmware - although the silicon is identical, the F40 (1517-ball) package has fewer user I/Os and pin assignments differ. Also note that 10AX115N1F45I1SG is the industrial temperature grade; do not substitute with the 'E' (extended) variant when firmware relies on industrial-grade timing margins. Lastly, ensure SmartVID controller configuration is correct or core voltage may undershoot.
合規資訊
RoHS and REACH compliance confirmed via Intel/Altera product page. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive grade.