10AX090U4F45I3LG - Arria 10 GX FPGA 900K LE | Intel
MPN： 10AX090U4F45I3LG ✓ 啟用中10AX090U4F45I3LG 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as block RAM, DSP slices, high-speed transceivers, and external memory controllers. Modern FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor) and are used as glue logic, accelerators, and full SoC replacements where ASIC NRE cost is unjustified. The Arria 10 GX family specifically targets 10 Gbps backplane, 25 Gbps backplane-ready, video processing, and DSP-intensive applications with hard PCIe Gen3 and 100G Ethernet IP.
Key features of the 10AX090U4F45I3LG include 480 user I/O pins, 20 nm TSMC process, industrial temperature grade (-40C to +100C), industrial speed grade, and 28 Gbps-capable transceivers (per Arria 10 GX family capability). The -I3 speed/power bin denotes a mid-power balance suitable for fan-cooled line cards and modular embedded systems. The 1932-ball FCBGA (F45 package code) uses a 45 mm body with fine-pitch BGA balls to deliver the 480 user I/O bandwidth while providing mechanical rigidity for high-layer-count PCB stackups.
The architecture pairs a programmable logic fabric with hard memory controllers, hard PCIe Gen3 x8 IP, hard 10/25/100G Ethernet MACs, and hardened floating-point DSP blocks. This heterogeneous integration removes soft-IP area overhead and lets the FPGA sustain multi-gigasample DSP throughput while keeping core voltage at 0.9 V for power-efficient operation in dense line-card designs. The Arria 10 family is widely deployed in 4K/8K video broadcast, medical imaging, and defense signal-processing platforms.
Typical applications include 4K/8K video broadcast and processing, 100G Ethernet line cards, software-defined radio (SDR) baseband, radar signal processing, ASIC prototyping, and high-performance DSP co-processing. The 20 nm process node gives a good power/performance trade-off for thermally constrained chassis compared with 28 nm predecessors.
When designing with this FPGA, plan PCB stackup with the BGA escape pattern, allocate sufficient decoupling, and verify Quartus Prime software version compatibility for the -I3 device variant. Thermal management is critical at 0.9 V core due to static plus dynamic power; a heat spreader or heatsink with adequate airflow is recommended for sustained operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and engineering teams make informed sourcing and design decisions.
直接替換替代品，適用於 10AX090U4F45I3LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AX090U4F45I3LG （相同外形與佔位） — 差異在於 Package, Speed Grade, Process Technology, Transceivers, DSP Blocks.
10AX090U4F45E3LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U3F45I2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U2F45I2LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090S4F45I3LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090N4F45I3LG
✅ 直接替換聯絡詢價
查看資料表 →10AX090U4F45I3LG 最大額定值與電氣特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (Bits) | 59,234,304 |
| User I/O Pins | 480 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 封裝 | 1932-ball FCBGA (F45) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -3 (mid-power) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
| Transceivers | Up to 28 Gbps (Arria 10 GX family capability) |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR3/DDR4 controllers |
| DSP Blocks | Hardened floating-point DSP fabric |
| Configuration | SRAM-based, supports via Quartus Prime |
10AX090U4F45I3LG 1932-ball fcbga (f45) 腳位配置指南
10AX090U4F45I3LG（1932-ball fcbga (f45) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AX090U4F45I3LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AX090U4F45I3LG 適用於 6 應用s: 4K/8K Video Broadcast Processing, 100G Ethernet Line Card, Software-Defined Radio (SDR) Baseband, Radar Signal Processing, ASIC Prototyping, High-Performance DSP Co-Processing.
4K/8K Video Broadcast Processing
The 10AX090U4F45I3LG's 900,000 logic elements and hard DSP fabric deliver the parallel arithmetic throughput needed for 4K/8K video pipelines, including chroma upsampling, color-space conversion, HDR tone mapping, and wavelet compression. The -3 speed grade sustains 300 MHz DSP operation, while the 1932-ball FCBGA exposes the high-pin-count parallel video bus and multiple DisplayPort/SDI links. Hard PCIe Gen3 x8 IP enables direct attachment to host CPUs for ingest cards. Compared with software-only pipelines on x86, the FPGA approach offloads per-pixel operations for deterministic low-latency broadcast output.
推薦
100G Ethernet Line Card
The 10AX090U4F45I3LG integrates hard 100G Ethernet MAC and hardened PCS IP, enabling a single-chip 100G line card for switch/router platforms. The 28 Gbps-capable transceivers (per Arria 10 GX family) drive CFP/CFP2/QSFP28 optics directly, while the 480 user I/O feed multiple front-panel ports and backplane lanes. The -3 speed grade closes 156.25 MHz timing for 100G Ethernet PCS and OTN framing, and the 59 Mbit of block RAM supports deep packet buffering. Pair with external DDR4 for line-rate table lookup and traffic management.
推薦
Software-Defined Radio (SDR) Baseband
The 10AX090U4F45I3LG's hardened floating-point DSP blocks and high-speed transceivers make it a natural fit for SDR baseband, where it performs channelization, FFT-based spectrum analysis, and modem signal processing on wideband IF samples. The 20 nm process keeps core power manageable at 0.9 V despite the 900K LE count, while the industrial temperature rating supports outdoor/ruggedized radio enclosures. The 480 user I/O provide abundant LVDS pairs for ADC/DAC interfacing at GSPS rates.
推薦
Radar Signal Processing
Phased-array radar systems rely on FPGAs like the 10AX090U4F45I3LG for pulse compression, beamforming, and Doppler processing in real time. The Arria 10 GX hardened floating-point DSP blocks execute complex FFTs and matrix operations at hundreds of MHz, while the 59 Mbit block RAM stages range-Doppler maps. The 1932-ball FCBGA provides mechanical rigidity for vibration-prone environments, and the -I3 industrial temp grade handles the -40C to +100C junction range required in airborne radar pods.
推薦
ASIC Prototyping
The 10AX090U4F45I3LG is widely used as an ASIC prototyping vehicle because its 900K LE and hard memory controllers can map large ASIC RTL partitions with high fidelity. Multiple FPGAs can be tiled with high-speed transceivers bridging partitions, achieving multi-hundred-MHz ASIC-equivalent emulation. The 1932-ball FCBGA exposes enough GPIO to replicate most ASIC package pinouts, and Quartus Prime Pro supports industry-standard prototyping flows (HAPS, Protium).
推薦
High-Performance DSP Co-Processing
The 10AX090U4F45I3LG's hardened floating-point DSP fabric acts as a coprocessor to host CPUs or GPUs, offloading compute kernels like FIR filters, FFTs, convolutions, and matrix multiplies. The hard PCIe Gen3 x8 IP provides 8 GB/s host coupling, while the 59 Mbit block RAM and external DDR4 controller stage large datasets. Industrial temp (-40C to +100C) and -3 speed grade suit medical imaging accelerators and high-frequency trading platforms where deterministic low-latency DSP matters.
推薦
推薦產品摘要
工程參考資料，適用於 10AX090U4F45I3LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AX090U4F45E3LG | 10AX090U3F45I2LG | 10AX090U2F45I2LG | 10AX090S4F45I3LG | 10AX090N4F45I3LG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 SoC | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -3 (mid-power) | -3 | -2 | -2 | -3 | -3 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial | Industrial | Industrial | Industrial |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
| User I/O Pins | 480 | 480 | 480 | 480 | 480 | 480 |
主要差異化特點
- Mid-power -3 speed grade in industrial temp (對比10AX090U3F45I2LG)
- Pure FPGA fabric without embedded HPS (對比10AX090S4F45I3LG)
- Industrial temperature rating for harsh environments (對比10AX090U4F45E3LG)
設計說明
Estimated: at typical utilization (60-70% LE, 50% DSP, 25 Gbps transceivers active), the 10AX090U4F45I3LG dissipates 15-25 W from a 0.9 V core plus I/O. The 1932-ball FCBGA package requires a heatsink or heat-spreader lid plus 200-400 LFM airflow to keep junction below 100C in industrial temp. Apply thermal interface material (TIM) with conductivity >= 3 W/mK between the lid and heatsink.
The 1932-ball FCBGA at F45 pitch demands an HDI PCB stackup (any-layer microvia, laser-drilled vias) for breakout routing. Plan at least a 12-layer stackup with paired ground planes adjacent to signal layers to maintain signal integrity on 25 Gbps transceiver channels. Decouple with 0402/0201 ceramic caps (0.1 uF, 1 uF, 10 uF) placed as close as possible to each power pin per the Arria 10 pin connection guidelines.
Route 25/28 Gbps transceiver channels with controlled impedance (100 ohm differential) and keep stubs under 150 mil. Match pair lengths within 5 mil for 25 Gbps and 2 mil for 28 Gbps. Use AC-coupled capacitors (100 nF) at transmitter outputs per Arria 10 GX transceiver user guide. Provide a clean reference ground plane under transceiver channels; avoid crossing power plane splits.
Do not assume all Arria 10 GX OPNs are feature-equivalent: the U, S, and N suffixes denote unlocked GX, SoC with HPS, and feature-restricted variants respectively. Pin-compatibility is preserved in the F45 package, but Quartus device support files and fitter results differ. Always compile your design against the exact OPN in the Quartus device selection to avoid fitter errors and unused-pin warnings.
合規資訊
RoHS/REACH compliance per Intel/Altera product page; AEC-Q100 is automotive-grade qualification and not applicable to high-density FPGAs in this class. Industrial temperature grade -I3 supports -40C to +100C junction operation.