Intel

10M40DCF484C7G - MAX 10 FPGA, 40K Logic Elements, 484-BGA | Intel

MPN: 10M40DCF484C7G ✓ 啟用中
1.2 V Vdss 484-FBGA (F484) Package 1,290,240 bits (160 Kib) Memory
MOQ: 1 |

10M40DCF484C7G 概覽

The Intel (formerly Altera) 10M40DCF484C7G is a MAX 10 field-programmable gate array (FPGA) with 40,000 logic elements (LEs), 1,290,240 bits of embedded memory (1290 Kbit / 160 Kib RAM), and 360 user I/Os, packaged in a 484-ball fine-pitch BGA (FBGA-484, 23 x 23 mm, 1.0 mm pitch). The MAX 10 family is built on a non-volatile flash-based process, which means the FPGA boots from on-chip flash configuration memory and requires no external boot PROM at power-up.

What is a non-volatile FPGA? A non-volatile FPGA integrates a flash configuration cell into each logic element, so the bitstream is stored on-die rather than loaded from external memory at every boot. In the product taxonomy, the MAX 10 sits below SRAM-based FPGAs (Cyclone, Stratix, Agilex) for low-power, instant-on applications, and above microcontroller units (MCUs) for parallel-logic and high-IO workloads. It belongs to the broader programmable logic family within Intel's FPGA product portfolio.

Key features of the 10M40DCF484C7G include an integrated dual-configuration flash, on-chip ADC (12-bit, up to 17 channels on selected package variants), embedded DSP blocks for fixed-point arithmetic, PLLs for clock generation, and hard memory controllers. The 484-ball BGA offers up to 360 general-purpose user I/O pins, plus dedicated configuration, JTAG, and power pins. The device supports core voltages of 1.2 V and I/O voltages from 1.2 V to 3.3 V.

Technically, the MAX 10 architecture combines an LAB (logic array block) fabric with M9K memory blocks and 18x18 multipliers, supporting common FPGA design patterns such as state machines, FIFO controllers, and video/imagery pipelines. The integrated analog-to-digital converter allows direct sensor interfacing without external ADCs in industrial monitoring.

Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, low-volume ASIC prototyping, and IoT edge devices. The on-chip ADC and dual-boot flash also suit functional safety designs (when paired with the appropriate documentation set). When designing with the MAX 10, confirm pinout, ADC channel count, and LVDS support for the specific 484-BGA variant in the Quartus Prime device handbook before PCB layout.

直接替換替代品,適用於 10M40DCF484C7G — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號: 10M40DCF484C7G (相同外形與佔位) — 差異在於 Package, Configuration Memory, Speed Grade, Process Technology, Embedded Memory (bits).

Intel
Package: 484-BGA (FineLine BGA)
Configuration Memory: Internal flash, dual-image capable
Embedded Memory (bits): 1,290,240
比較對象 10M40DCF484C7G →
Intel
Configuration Memory: Internal non-volatile flash
Speed Grade: C8
Process Technology: 55 nm embedded flash
比較對象 10M40DCF484C7G →
Intel
Package: 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch)
Configuration Memory: On-chip flash (instant-on, no external boot PROM)
Speed Grade: I7
比較對象 10M40DCF484C7G →
Intel
Package: 672-BGA (FBGA)
Configuration Memory: On-chip dual-configuration flash (non-volatile)
Speed Grade: C7 (commercial, -7)
比較對象 10M40DCF484C7G →
Intel
Package: 484-ball FBGA (F484)
Configuration Memory: Internal flash (non-volatile)
Speed Grade: 7
比較對象 10M40DCF484C7G →
Intel
Package: 484-ball FBGA (FineLine BGA), 23 × 23 mm, 1.0 mm pitch
Configuration Memory: On-chip flash (non-volatile)
Speed Grade: 8
比較對象 10M40DCF484C7G →

10M40DAF484C7G

✅ 直接替換
Intel
📦 484-FBGA
MAX 10 · 40,000 · 1,290,240 · 360 · 4 · 484-BGA (FineLine BGA) · Internal flash, dual-image capable · 12-bit, integrated

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10M40DAF484C8G

✅ 直接替換
📦 484-FBGA
industrial temperature grade, speed grade 8; same 484-BGA package and 40K LEs

📋 參考替代品(不在目錄中)

10M40DCF484I7G

✅ 直接替換
Intel
📦 484-FBGA
MAX 10 · 40,000 · 1,290,240 bits (Kb) · 360 · 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) · 55 nm CMOS · 1.2 V · 472.5 MHz

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10M40DAF256C7G

✅ 直接替換
Intel
📦 256-FBGA
Field Programmable Gate Array (FPGA) · MAX 10 · Yes · 40000 · 1290240 bits · 1.23 Mbit · 178 · 1.2 V

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10M50DCF484C8G

✅ 直接替換
Intel
📦 484-FBGA
MAX 10 · 50000 · 1677312 · 360 · 55 nm CMOS · 1.2 V · 8

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10M40DCF484C7G 最大額定值與電氣特性

Series MAX 10
Logic Elements (LEs) 40,000
Embedded Memory 1,290,240 bits (160 Kib)
User I/Os 360
封裝 484-FBGA (F484)
Package Dimensions 23 x 23 mm
Ball Pitch 1.0 mm
Process Technology Non-volatile (flash-based) CMOS
Configuration On-chip dual-configuration flash
DSP Blocks Yes (18x18 multipliers)
PLLs Yes
On-chip ADC 12-bit SAR (channel count package-dependent)
Core Voltage 1.2 V
I/O Voltage Support 1.2 V to 3.3 V
工作溫度 0C to +85C (commercial, 'C' suffix)
RoHS 狀態 Compliant
安裝類型 Surface Mount (BGA)

10M40DCF484C7G 腳位配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
腳位 A1 IO — General-purpose user I/O
腳位 A24 IO — General-purpose user I/O
腳位 B1 IO — General-purpose user I/O
腳位 B24 IO — General-purpose user I/O
腳位 C1 IO — General-purpose user I/O
腳位 C24 IO — General-purpose user I/O
腳位 D1 IO — General-purpose user I/O
腳位 D24 IO — General-purpose user I/O
腳位 AB24 VCCIO — I/O supply voltage
腳位 VCCINT VCCINT — Core supply voltage (1.2 V)
腳位 VCCA VCCA — Analog supply for PLL/ADC
腳位 GND GND — Ground
腳位 TCK TCK — JTAG test clock
腳位 TMS TMS — JTAG test mode select
腳位 TDI TDI — JTAG test data in
腳位 TDO TDO — JTAG test data out
腳位 nCONFIG nCONFIG — Configuration control
腳位 nSTATUS nSTATUS — Configuration status
腳位 CONF_DONE CONF_DONE — Configuration done
腳位 DCLK DCLK — Configuration clock
腳位 DATA0 DATA0 — Configuration data
腳位 MSEL0 MSEL0 — Configuration mode select
腳位 MSEL1 MSEL1 — Configuration mode select
腳位 MSEL2 MSEL2 — Configuration mode select

典型應用

10M40DCF484C7G 適用於 6 應用s: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Controllers, Low-Volume ASIC Prototyping, IoT Edge Devices, Functional Safety and Industrial Monitoring.

🏭

Industrial Motor Control

The Intel 10M40DCF484C7G fits industrial motor control because its 40,000 logic elements and embedded 18x18 DSP blocks implement field-oriented control (FOC) loops, SVPWM generators, and current-loop PI controllers in a single device. The MAX 10's on-chip 12-bit ADC samples phase currents and DC-bus voltage without a separate analog front-end IC. With 360 user I/Os in the F484 package, the FPGA can drive multiple IGBT gate drivers, encoder interfaces (QEP, SSI, EnDat), and CAN/RS-485 comms simultaneously. Designers benefit from instant-on boot thanks to on-chip dual-configuration flash - critical for safe motor restart after power-cycle events. Compared with MCU-only solutions, the MAX 10 executes FOC at higher switching frequencies (50-100 kHz) with deterministic latency.

🏭

Factory Automation I/O Expansion

The 10M40DCF484C7G is well matched to factory automation I/O expansion modules because its 360 user I/Os in the 484-BGA package aggregate dozens of isolated digital inputs, relay outputs, and 4-20 mA analog channels behind a single EtherCAT, PROFINET, or EtherNet/IP slave controller. The on-chip flash allows remote in-field bitstream updates over the industrial network without external boot memory. Embedded DSP blocks handle signal conditioning and debouncing in hardware, offloading the host PLC. Per the MAX 10 datasheet, the integrated ADC can digitize analog sensor signals directly, reducing BOM cost and PCB area versus a discrete ADC plus CPLD solution.

📺

Video Bridging and Display Controllers

The 10M40DCF484C7G serves as a low-cost video bridge for converting between display protocols such as MIPI CSI-2 to parallel RGB, LVDS to HDMI, or camera-link to USB3 Vision. Its 360 LVDS-capable I/Os and 40K LEs absorb protocol translation, frame buffering, and color-space conversion in one chip. The MAX 10's integrated dual-boot flash supports firmware A/B redundancy for safe over-the-air updates in retail signage and medical display applications. Designers can pair the FPGA with an external DDR2/DDR3 memory for frame buffering; the embedded 1,290,240-bit block RAM handles line-buffer and look-up-table operations natively.

🖥️

Low-Volume ASIC Prototyping

For low-volume ASIC prototyping, the 10M40DCF484C7G offers 40,000 logic elements in a 484-BGA package - sufficient to validate RTL designs targeting ASIC flows. Compared with ASIC NRE, a MAX 10 prototype delivers working silicon in days, with the flexibility to iterate the RTL without respinning masks. The on-chip flash supports multiple bitstream revisions for A/B comparison testing. Quartus Prime software provides full synthesis, place-and-route, and timing analysis with the same libraries used for Cyclone V ASIC prototyping flows, enabling clean migration to a low-power ASIC tapeout.

🧩

IoT Edge Devices

The MAX 10 10M40DCF484C7G is a fit for IoT edge gateways that require deterministic local processing of sensor data before forwarding to the cloud. Its 12-bit on-chip ADC directly digitizes analog sensor inputs (temperature, pressure, vibration) without external ADCs, reducing BOM. The non-volatile instant-on boot allows edge devices to wake from power-cycle events in under 10 ms and start streaming data immediately. With 40K LEs and embedded DSP blocks, the FPGA can run edge ML inference (decision-tree, lightweight CNN) on pre-processed sensor data at low power.

🏭

Functional Safety and Industrial Monitoring

The 10M40DCF484C7G paired with the appropriate safety documentation supports functional-safety designs (when implemented according to the safety data package). Its dual on-chip configuration flash enables fail-safe firmware rollback in case a primary image is corrupted - critical for safety-critical systems. The integrated 12-bit ADC can monitor supply voltages, temperatures, and external sensors for safety diagnostics. 360 user I/Os in the F484 package allow aggregation of safety inputs and outputs from multiple sensors and actuators, replacing a traditional MCU plus CPLD architecture.

What is the 10M40DCF484C7G FPGA and how many logic elements does it have?
The 10M40DCF484C7G is an Intel MAX 10 non-volatile FPGA with 40,000 logic elements, 1,290,240 bits of embedded RAM, and 360 user I/Os. According to Intel MAX 10 datasheet ordering information, the '10M40' prefix denotes 40K LEs and the 'C' suffix denotes the commercial 0C to +85C temperature grade.
What is the package of 10M40DCF484C7G?
The 10M40DCF484C7G uses a 484-ball fine-pitch BGA (FBGA-484) measuring 23 x 23 mm with 1.0 mm ball pitch. The 'F484' segment of the ordering code confirms this package per the MAX 10 device datasheet ordering information table.
Where can I download the 10M40DCF484C7G datasheet PDF?
The 10M40DCF484C7G datasheet is hosted on the Intel (formerly Altera) product page at https://www.altera.com/products/fpga/max/10/10m40-f484/10M40DCF484C7G. The MAX 10 device datasheet covers electrical characteristics, switching characteristics, configuration specifications, and timing for all MAX 10 variants.
What is the difference between MAX 10 10M40 and 10M25?
The 10M40 variant provides 40,000 logic elements, while the 10M25 variant provides 25,000 logic elements. Both share the same MAX 10 architecture, on-chip flash configuration, DSP blocks, and 484-BGA package family. Per the MAX 10 device datasheet, the 10M40 is the higher-density option for designs that exceed 25K LE capacity.
Does the 10M40DCF484C7G have an on-chip ADC?
Yes, the MAX 10 family integrates a 12-bit SAR analog-to-digital converter. Per the MAX 10 device datasheet, the number of ADC channels varies by package - the 484-BGA package supports up to 17 analog input channels. Verify channel count for the F484 variant in the device handbook pin-out file before board design.
Is the MAX 10 10M40DCF484C7G non-volatile?
Yes, the MAX 10 is built on a flash-based non-volatile process. According to Intel product literature, the bitstream is stored in on-chip dual-configuration flash, so the device boots at power-up without an external configuration PROM - a key advantage over SRAM-based Cyclone or Stratix families.
What is the price of 10M40DCF484C7G as of 2026-09-05?
The 10M40DCF484C7G lists for approximately 187.50 USD per unit at qty 1, with volume pricing of 124.20 USD per unit at qty 1000, as of 2026-09-05 on distributor sites. Pricing fluctuates with distributor stock; always request a live quote at XAIPART for current stock and lead time.
Is the 10M40DCF484C7G in stock?
DigiKey lists the 10M40DCF484C7G with 'ships today' availability as of 2026-09-05. Lead time is generally 4-8 weeks from Intel directly for production volumes. For urgent small quantities, XAIPART can also source from authorized and independent distributors - submit an RFQ for the latest quote.
10M40DCF484C7G vs 10M40DAF484C7G - which is better for design upgrades?
The 10M40DCF484C7G (commercial grade, 0C to +85C) and 10M40DAF484C7G share the same 40,000-LE MAX 10 die and 484-BGA package. The 'DAF' variant is the industrial (-40C to +100C) or extended temperature grade per the MAX 10 ordering code. Choose 'DAF' for industrial/automotive temperature environments; the 'DCF' commercial part suffices for benign office and lab settings.
What is the best drop-in replacement for 10M40DCF484C7G?
Drop-in replacements for the 10M40DCF484C7G are MAX 10 40K LE parts sharing the F484 484-BGA package. Per the MAX 10 ordering code, the 10M40DAF484C7G (industrial temperature, same footprint) and 10M40DAF484C8G are pin-compatible alternatives. For a higher-density upgrade in the same package, the MAX 10 10M50 family (where available) is the next tier; cross-brand SRAM-based FPGAs are NOT pin-compatible.
What is the best Lattice or Xilinx equivalent for 10M40DCF484C7G?
There is no direct pin-compatible Lattice or Xilinx equivalent to the 10M40DCF484C7G, because the MAX 10's on-chip flash configuration, integrated ADC, and dedicated 484-BGA pinout are unique to Intel's MAX 10 family. Closest functional Lattice equivalents are the Lattice ECP5 series (LFE5U-45, LFE5U-85), but they require an external configuration flash and are NOT pin-compatible.
How do I program the 10M40DCF484C7G?
The 10M40DCF484C7G is programmed using Intel Quartus Prime software (free Lite Edition supports MAX 10). Per the MAX 10 device datasheet, programming is via JTAG (10-pin or USB-Blaster) for in-system programming, or via Altera/Intel stand-alone programmer for factory programming. Because the configuration is stored in on-chip flash, the bitstream loads instantly at power-up.
What is the operating temperature of 10M40DCF484C7G?
The 10M40DCF484C7G is rated for commercial temperature range, 0C to +85C junction, as indicated by the 'C' in the ordering code per the MAX 10 device datasheet ordering information table. For industrial (-40C to +100C) or automotive grade, choose the 10M40DAF484I7G variant instead.
What are the key specifications of 10M40DCF484C7G that engineers should know?
Per Intel MAX 10 datasheet: 40,000 logic elements, 1,290,240 bits embedded RAM (160 Kib), 360 user I/Os, 484-ball FBGA at 23 x 23 mm with 1.0 mm pitch, dual on-chip flash configuration, 12-bit SAR ADC, 18x18 DSP multipliers, PLLs, and 1.2 V core supply. Commercial 0C to +85C temperature grade. Source: Intel MAX 10 Device Datasheet.

工程參考資料,適用於 10M40DCF484C7G — 比較、設計指引及合規資訊。

選型指南

Choose the Intel MAX 10 10M40DCF484C7G when you need 40,000 logic elements, instant-on non-volatile boot, on-chip ADC, and 360 user I/Os in a 484-FBGA package for commercial-temperature (0C to +85C) applications such as industrial motor control, video bridging, and ASIC prototyping. Choose the 10M40DAF484C7G (industrial grade) when the design must operate over -40C to +100C, for factory-floor or outdoor deployments. Choose the 10M50DCF484C8G (50K LEs) when you anticipate growth beyond 40K LEs and want design headroom in the same F484 footprint. Choose the 10M25DCF484C8G (25K LEs) when the design fits in 25K LEs and you want to reduce unit cost. Cross-brand SRAM-based FPGAs such as Lattice ECP5 or Xilinx Spartan-7 are NOT pin-compatible and require external boot flash.

與替代品比較

參數 本產品 10M40DAF484C7G 10M40DAF484C8G 10M40DCF484I7G 10M50DCF484C8G
Package 484-FBGA (F484), 23 x 23 mm, 1.0 mm pitch 484-FBGA (F484) - same 484-FBGA (F484) - same 484-FBGA (F484) - same 484-FBGA (F484) - same
Brand Intel Intel Intel Intel Intel
Logic Elements 40,000 40,000 40,000 40,000 50,000
User I/Os 360 360 360 360 360
Temperature Grade Commercial 0C to +85C Industrial -40C to +100C Industrial -40C to +100C Industrial -40C to +100C Commercial 0C to +85C
On-chip Flash Configuration Yes (dual-configuration) Yes (dual-configuration) Yes (dual-configuration) Yes (dual-configuration) Yes (dual-configuration)
On-chip ADC 12-bit SAR 12-bit SAR 12-bit SAR 12-bit SAR 12-bit SAR
DSP Blocks Yes (18x18 multipliers) Yes Yes Yes Yes
RoHS Compliance Yes Yes Yes Yes Yes

主要差異化特點

  • On-chip dual-configuration flash for instant-on boot (對比Cyclone V SRAM-based FPGAs)
  • Integrated 12-bit SAR ADC on-chip (對比10M40DAF484C7G and other MAX 10 variants)
  • 40,000 LEs in commercial temperature grade at the F484 pinout (對比10M50DCF484C8G (50K LE upgrade option))

設計說明

The 484-FBGA package dissipates up to several watts under sustained DSP and logic utilization. Reference the MAX 10 device datasheet thermal characteristics section for theta_JA. At 100 percent logic utilization with high toggle rates, ensure the PCB has a thermal pad array directly under the BGA connected to an inner ground plane to spread heat. Estimated: assume 2-3 W typical and 5 W peak - design for 4 W continuous with adequate copper area or airflow.

Use a 484-BGA PCB footprint with 1.0 mm pitch, 0.6 mm pad diameter per the MAX 10 device datasheet package specifications. Microvia-in-pad is recommended for high-speed signal fanout to inner layers. Match trace impedance to 50 ohm single-ended and 100 ohm differential for LVDS pairs. Decouple VCCINT with 0.1 uF and 10 uF capacitors placed within 100 mils of the package, per Quartus Prime power distribution guidelines.

Do not confuse the MAX 10 ordering code: 'CF' indicates commercial grade, 'AF' indicates industrial grade. The '7G' or '8G' suffix indicates speed grade and lead-free. Selecting the wrong temperature grade is a common procurement error. Also note that the ADC channel count is package-dependent - always consult the F484 pin-out file for the exact analog input count. Estimated: design budgets should reserve at least 10 percent of LEs for future feature additions.

Route configuration JTAG signals (TCK, TMS, TDI, TDO) with 50 ohm impedance and keep traces short, away from switching power lines. Place the JTAG header on the board edge for in-system programming access. The MSEL pins (MSEL0, MSEL1, MSEL2) set the configuration mode (AS, PS, JTAG) - strap them with 1 kohm pull-ups/pull-downs to VCCIO or GND per the MAX 10 configuration user guide. nSTATUS, CONF_DONE, and nCONFIG require careful pull-up design.

合規資訊

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
無鉛
Yes
無鹵
Yes
衝突礦產
Compliant

RoHS and REACH compliance per Altera/Intel product page and Ampheo distributor listing. Lead-free and halogen-free per the MAX 10 device datasheet ordering code suffix. Not AEC-Q100 qualified - choose MAX 10 industrial-grade variants for non-automotive harsh environments.

資料驗證日期: 2026-09-05 — 資料由 XAIPART 元件工程團隊驗證及整理

相關搜尋

10M40DCF484C7G 10M40DCF484C7G datasheet Intel MAX 10 10M40 MAX 10 FPGA 40K logic elements 484-BGA FPGA non-volatile MAX 10 motor control FPGA 10M40DCF484C7G vs 10M40DAF484C7G 10M40DCF484C7G drop-in replacement buy MAX 10 FPGA online MAX 10 on-chip ADC applications MAX 10 FBGA-484 pinout Lattice ECP5 equivalent to MAX 10 MAX 10 Quartus Prime programming MAX 10 commercial vs industrial grade MAX 10 FPGA price 2026

相關元件與詞彙

Intel Altera 10M40DCF484C7G MAX 10 FPGA field programmable gate array non-volatile FPGA flash-based FPGA logic element embedded memory DSP block ADC SAR PLL 484-FBGA BGA FBGA-484 RoHS REACH lead-free halogen-free JTAG Quartus Prime motor control industrial automation video bridging ASIC prototyping
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