10M40DCF484C7G - MAX 10 FPGA, 40K Logic Elements, 484-BGA | Intel
MPN: 10M40DCF484C7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $187.5 | $187.50 |
| 10 | $168.75 | $1,687.50 |
| 100 | $152.1 | $15,210.00 |
| 500 | $138.4 | $69,200.00 |
| 1,000 | $124.2 | $124,200.00 |
Drop-in alternatives for 10M40DCF484C7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M40DAF484C7G
β Drop-Inβ In Stock
$92.4 / Unit
View Datasheet β10M40DAF484C8G
β Drop-Inπ Reference alternative (not in catalog)
10M40DCF484I7G
β Drop-Inβ In Stock
$71.48 / Unit
View Datasheet β10M40DAF256C7G
β Drop-Inβ In Stock
$46.83 / Unit
View Datasheet β10M50DCF484C8G
β Drop-Inβ In Stock
$106.16 / Unit
View Datasheet β10M40DCF484C7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LEs) | 40,000 |
| Embedded Memory | 1,290,240 bits (160 Kib) |
| User I/Os | 360 |
| Package | 484-FBGA (F484) |
| Package Dimensions | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | Non-volatile (flash-based) CMOS |
| Configuration | On-chip dual-configuration flash |
| DSP Blocks | Yes (18x18 multipliers) |
| PLLs | Yes |
| On-chip ADC | 12-bit SAR (channel count package-dependent) |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V |
| Operating Temperature | 0C to +85C (commercial, 'C' suffix) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10M40DCF484C7G Pin Configuration
| Pin A1 | IO β General-purpose user I/O |
| Pin A24 | IO β General-purpose user I/O |
| Pin B1 | IO β General-purpose user I/O |
| Pin B24 | IO β General-purpose user I/O |
| Pin C1 | IO β General-purpose user I/O |
| Pin C24 | IO β General-purpose user I/O |
| Pin D1 | IO β General-purpose user I/O |
| Pin D24 | IO β General-purpose user I/O |
| Pin AB24 | VCCIO β I/O supply voltage |
| Pin VCCINT | VCCINT β Core supply voltage (1.2 V) |
| Pin VCCA | VCCA β Analog supply for PLL/ADC |
| Pin GND | GND β Ground |
| Pin TCK | TCK β JTAG test clock |
| Pin TMS | TMS β JTAG test mode select |
| Pin TDI | TDI β JTAG test data in |
| Pin TDO | TDO β JTAG test data out |
| Pin nCONFIG | nCONFIG β Configuration control |
| Pin nSTATUS | nSTATUS β Configuration status |
| Pin CONF_DONE | CONF_DONE β Configuration done |
| Pin DCLK | DCLK β Configuration clock |
| Pin DATA0 | DATA0 β Configuration data |
| Pin MSEL0 | MSEL0 β Configuration mode select |
| Pin MSEL1 | MSEL1 β Configuration mode select |
| Pin MSEL2 | MSEL2 β Configuration mode select |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M40DCF484C7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Controllers, Low-Volume ASIC Prototyping, IoT Edge Devices, Functional Safety and Industrial Monitoring.
Industrial Motor Control
The Intel 10M40DCF484C7G fits industrial motor control because its 40,000 logic elements and embedded 18x18 DSP blocks implement field-oriented control (FOC) loops, SVPWM generators, and current-loop PI controllers in a single device. The MAX 10's on-chip 12-bit ADC samples phase currents and DC-bus voltage without a separate analog front-end IC. With 360 user I/Os in the F484 package, the FPGA can drive multiple IGBT gate drivers, encoder interfaces (QEP, SSI, EnDat), and CAN/RS-485 comms simultaneously. Designers benefit from instant-on boot thanks to on-chip dual-configuration flash - critical for safe motor restart after power-cycle events. Compared with MCU-only solutions, the MAX 10 executes FOC at higher switching frequencies (50-100 kHz) with deterministic latency.
Recommended
Factory Automation I/O Expansion
The 10M40DCF484C7G is well matched to factory automation I/O expansion modules because its 360 user I/Os in the 484-BGA package aggregate dozens of isolated digital inputs, relay outputs, and 4-20 mA analog channels behind a single EtherCAT, PROFINET, or EtherNet/IP slave controller. The on-chip flash allows remote in-field bitstream updates over the industrial network without external boot memory. Embedded DSP blocks handle signal conditioning and debouncing in hardware, offloading the host PLC. Per the MAX 10 datasheet, the integrated ADC can digitize analog sensor signals directly, reducing BOM cost and PCB area versus a discrete ADC plus CPLD solution.
Recommended
Video Bridging and Display Controllers
The 10M40DCF484C7G serves as a low-cost video bridge for converting between display protocols such as MIPI CSI-2 to parallel RGB, LVDS to HDMI, or camera-link to USB3 Vision. Its 360 LVDS-capable I/Os and 40K LEs absorb protocol translation, frame buffering, and color-space conversion in one chip. The MAX 10's integrated dual-boot flash supports firmware A/B redundancy for safe over-the-air updates in retail signage and medical display applications. Designers can pair the FPGA with an external DDR2/DDR3 memory for frame buffering; the embedded 1,290,240-bit block RAM handles line-buffer and look-up-table operations natively.
Recommended
Low-Volume ASIC Prototyping
For low-volume ASIC prototyping, the 10M40DCF484C7G offers 40,000 logic elements in a 484-BGA package - sufficient to validate RTL designs targeting ASIC flows. Compared with ASIC NRE, a MAX 10 prototype delivers working silicon in days, with the flexibility to iterate the RTL without respinning masks. The on-chip flash supports multiple bitstream revisions for A/B comparison testing. Quartus Prime software provides full synthesis, place-and-route, and timing analysis with the same libraries used for Cyclone V ASIC prototyping flows, enabling clean migration to a low-power ASIC tapeout.
Recommended
IoT Edge Devices
The MAX 10 10M40DCF484C7G is a fit for IoT edge gateways that require deterministic local processing of sensor data before forwarding to the cloud. Its 12-bit on-chip ADC directly digitizes analog sensor inputs (temperature, pressure, vibration) without external ADCs, reducing BOM. The non-volatile instant-on boot allows edge devices to wake from power-cycle events in under 10 ms and start streaming data immediately. With 40K LEs and embedded DSP blocks, the FPGA can run edge ML inference (decision-tree, lightweight CNN) on pre-processed sensor data at low power.
Recommended
Functional Safety and Industrial Monitoring
The 10M40DCF484C7G paired with the appropriate safety documentation supports functional-safety designs (when implemented according to the safety data package). Its dual on-chip configuration flash enables fail-safe firmware rollback in case a primary image is corrupted - critical for safety-critical systems. The integrated 12-bit ADC can monitor supply voltages, temperatures, and external sensors for safety diagnostics. 360 user I/Os in the F484 package allow aggregation of safety inputs and outputs from multiple sensors and actuators, replacing a traditional MCU plus CPLD architecture.
Recommended
Recommended Products Summary
Engineering reference data for 10M40DCF484C7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40DAF484C7G | 10M40DAF484C8G | 10M40DCF484I7G | 10M50DCF484C8G |
|---|---|---|---|---|---|
| Package | 484-FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 50,000 |
| Embedded Memory | 1,290,240 bits | 1,290,240 bits | 1,290,240 bits | 1,290,240 bits | [DATA_NEEDED] |
| User I/Os | 360 | 360 | 360 | 360 | 360 |
| Temperature Grade | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C |
| On-chip Flash Configuration | Yes (dual-configuration) | Yes (dual-configuration) | Yes (dual-configuration) | Yes (dual-configuration) | Yes (dual-configuration) |
| On-chip ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
| DSP Blocks | Yes (18x18 multipliers) | Yes | Yes | Yes | Yes |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- On-chip dual-configuration flash for instant-on boot (vs Cyclone V SRAM-based FPGAs)
- Integrated 12-bit SAR ADC on-chip (vs 10M40DAF484C7G and other MAX 10 variants)
- 40,000 LEs in commercial temperature grade at the F484 pinout (vs 10M50DCF484C8G (50K LE upgrade option))
Design Notes
The 484-FBGA package dissipates up to several watts under sustained DSP and logic utilization. Reference the MAX 10 device datasheet thermal characteristics section for theta_JA. At 100 percent logic utilization with high toggle rates, ensure the PCB has a thermal pad array directly under the BGA connected to an inner ground plane to spread heat. Estimated: assume 2-3 W typical and 5 W peak - design for 4 W continuous with adequate copper area or airflow.
Use a 484-BGA PCB footprint with 1.0 mm pitch, 0.6 mm pad diameter per the MAX 10 device datasheet package specifications. Microvia-in-pad is recommended for high-speed signal fanout to inner layers. Match trace impedance to 50 ohm single-ended and 100 ohm differential for LVDS pairs. Decouple VCCINT with 0.1 uF and 10 uF capacitors placed within 100 mils of the package, per Quartus Prime power distribution guidelines.
Do not confuse the MAX 10 ordering code: 'CF' indicates commercial grade, 'AF' indicates industrial grade. The '7G' or '8G' suffix indicates speed grade and lead-free. Selecting the wrong temperature grade is a common procurement error. Also note that the ADC channel count is package-dependent - always consult the F484 pin-out file for the exact analog input count. Estimated: design budgets should reserve at least 10 percent of LEs for future feature additions.
Route configuration JTAG signals (TCK, TMS, TDI, TDO) with 50 ohm impedance and keep traces short, away from switching power lines. Place the JTAG header on the board edge for in-system programming access. The MSEL pins (MSEL0, MSEL1, MSEL2) set the configuration mode (AS, PS, JTAG) - strap them with 1 kohm pull-ups/pull-downs to VCCIO or GND per the MAX 10 configuration user guide. nSTATUS, CONF_DONE, and nCONFIG require careful pull-up design.
Compliance Information
RoHS and REACH compliance per Altera/Intel product page and Ampheo distributor listing. Lead-free and halogen-free per the MAX 10 device datasheet ordering code suffix. Not AEC-Q100 qualified - choose MAX 10 industrial-grade variants for non-automotive harsh environments.
