5CEFA5F23I7N - Cyclone V E FPGA 77K LE 484-FBGA | Intel / Altera
MPN： 5CEFA5F23I7N ✓ 啟用中5CEFA5F23I7N 概覽
A Field-Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reconfigure after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which themselves are a sub-class of digital logic ICs. Cyclone V E is the logic-only variant of the Cyclone V family, positioning itself below Cyclone V GT (with transceivers) and Cyclone V SE/SX/ST (with hard processor system) for applications needing DSP, memory, and I/O bandwidth without high-speed serial links.
Key features include support for up to 240 general-purpose I/O with 1.4 Gbps LVDS capability on selected pins, dedicated 18×18 multipliers (up to 300 in this density), variable-precision DSP blocks, and a configurable Memory Controller (Hard Memory Controller) for DDR3, DDR2, and LPDDR2 external memories. The device also integrates PCI Express Gen2 hard IP blocks (×1, ×2, or ×4) and a high-speed ADC block for system monitoring. Configuration is supported via fast passive parallel, active serial, or JTAG interfaces, and the part supports remote system upgrades through dedicated dual-configuration flash interfaces.
Architecturally, the Cyclone V E fabric combines logic-array blocks (LABs) of 16 adaptive logic modules (ALMs), an interconnect hierarchy of row and column interconnects, and embedded memory blocks (M9K and M144K). The Hard Memory Controller with ECC, combined with variable-precision DSP, makes this density ideal for mid-range digital signal processing, video bridging, and industrial motor control where deterministic latency and power efficiency are required.
Typical applications include industrial machine vision and factory automation, broadcast video processing and display controllers, automotive driver assistance (non-transceiver paths), medical imaging preprocessing, software-defined radio baseband processing, and PCI Express endpoint cards in test/measurement. Cyclone V E devices are also widely used in motor-control and servo drives, where the combination of DSP blocks, fast ADCs, and PCI Express endpoint capability fits compactly on a single FPGA.
When designing with the 5CEFA5F23I7N, allocate sufficient PCB layer count to route 240 single-ended (or ~120 LVDS-pair) signals out of the 19×19 mm BGA. Use the Altera / Intel Quartus II or Quartus Prime design suite (14.0 and later for Cyclone V support) and validate pin assignments with the Pin Planner before tape-out. The 'I' in I7N denotes industrial temperature, so pay attention to thermal-rise derating in enclosed enclosures; the N denotes lead-free packaging.
This page consolidates distributor pricing, pin-compatible same-family variants, and practical design considerations that complement, but do not replace, the official Intel Cyclone V device datasheet and handbook.
直接替換替代品，適用於 5CEFA5F23I7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 5CEFA5F23I7N （相同外形與佔位） — 差異在於 Package, Process Node, RoHS Status.
5CEFA5F23C7N
✅ 直接替換聯絡詢價
查看資料表 →5CEFA7F23I7N
✅ 直接替換📋 參考替代品（不在目錄中）
5CEBA5F23I7N
✅ 直接替換📋 參考替代品（不在目錄中）
5CEFA5F23I7
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
5CEFA5F23C8N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
5CEFA5F23I7N 最大額定值與電氣特性
| Family | Cyclone V E |
| Logic Elements | 77,000 |
| Embedded Memory (bits) | 5,001,216 |
| User I/O Pins | 240 |
| 封裝 | 484-ball FBGA (F23) |
| 工作溫度 | -40 °C to +100 °C (Industrial) |
| Speed Grade | 7 |
| Process Node | 28 nm |
| Hard Memory Controller | Yes (DDR2/DDR3/LPDDR2 with ECC) |
| PCI Express Hard IP | Yes, Gen2 ×1 / ×2 / ×4 |
| DSP Blocks | Variable-precision DSP blocks |
| Transceivers | None (logic-only Cyclone V E variant) |
| Configuration Modes | FPP, AS, PS, JTAG |
| RoHS 狀態 | Compliant (lead-free) |
5CEFA5F23I7N 484-ball fbga (f23) 腳位配置指南
5CEFA5F23I7N（484-ball fbga (f23) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 5CEFA5F23I7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
5CEFA5F23I7N 適用於 6 應用s: Industrial Machine Vision, Video Broadcast Processing, Motor Control and Servo Drives, PCI Express Endpoint Card, Software-Defined Radio Baseband, Medical Imaging Preprocessing.
Industrial Machine Vision
The 5CEFA5F23I7N's 77,000 logic elements, embedded PCIe Gen2 hard IP, and DDR3 hard memory controller make it well-suited for industrial machine vision systems that aggregate image sensors over Camera Link or MIPI adapters and transfer processed frames to a host CPU. The industrial -40 °C to +100 °C temperature grade supports factory-floor operation without additional thermal conditioning. Designers typically use 30-40 % of the LE fabric for sensor aggregation pipelines, 20 % for image preprocessing (debayering, lens correction via LUTs), and 15-20 % for PCIe DMA engines. The hard memory controller offloads DDR3 read/write scheduling, freeing fabric for pixel-pipeline DSP at 148.5 MHz pixel clock rates typical in HD/2MP machine vision designs.
推薦
Video Broadcast Processing
The Cyclone V E 5CEFA5F23I7N handles SD/HD/3G-SDI and HDMI video bridging with up to 240 LVDS-capable I/O supporting parallel RGB or OpenLDI display interfaces. Its variable-precision DSP blocks perform chroma upsampling, scaling, and color-space conversion (BT.709/BT.2020) at 148.5 MHz pixel clock, while the hard memory controller buffers multiple video frames in DDR3. For broadcast monitoring walls, the LE budget supports 4-6 independent SDI channels plus on-screen display overlay. Industrial temperature grade ensures rack-mount reliability in 24/7 broadcast environments.
推薦
Motor Control and Servo Drives
The 5CEFA5F23I7N's variable-precision DSP, fast on-chip ADC support, and PCIe endpoint capability make it ideal for multi-axis industrial servo drives running FOC (field-oriented control) at 32 kHz PWM rates with torque loops. Typical designs use 20-30 % of LE for current/voltage PI controllers and SVPWM modulators, 15 % for encoder feedback (EnDat, BiSS, or SSI), and 10 % for safety/state machines. The industrial temperature grade and DDR3 hard controller simplify deterministic-logic motor control with sensor-fusion inputs over PCIe to a host controller.
推薦
PCI Express Endpoint Card
The 5CEFA5F23I7N integrates hard PCIe Gen2 ×1/×2/×4 IP that delivers up to 2 Gbps per lane without consuming fabric resources. The hard IP supports root-port and endpoint modes with MSI/MSI-X interrupts and 256-byte payload TLP framing. Designers use ~10 % of the 77 K LE for the PCIe application layer, leaving the remainder for custom data acquisition, DSP, or protocol-bridging logic. The 484-FBGA package supports x4 edge-finger or card-electromechanical (CEM) connector routing on standard 4-layer PCBs.
推薦
Software-Defined Radio Baseband
The 5CEFA5F23I7N's variable-precision DSP blocks at up to 250 MHz and 5 Mbits of block RAM make it a viable mid-range baseband processor for software-defined radio (SDR) applications up to 100 MHz of instantaneous bandwidth. The hard memory controller supports DDR3 burst transfers at 533 MT/s for ADC sample buffering, while the PCI Express Gen2 endpoint enables streaming samples to a host CPU for visualization. Industrial temperature grade ensures operation in outdoor and vehicular SDR enclosures. Designers typically achieve 30-50 % fabric utilization across a multi-channel DDC/DUC chain.
推薦
Medical Imaging Preprocessing
The 5CEFA5F23I7N enables compact medical imaging front-ends for ultrasound beamforming, endoscopy video processing, and patient-monitoring DSP. Its 240 user I/O accommodate multiple analog front-end channels, while the 28 nm low-power process keeps per-channel dissipation low. Hard memory controller simplifies DDR3 buffering of ultrasound RF channel data at 40 MSPS, and the variable-precision DSP blocks implement FIR decimation and Hilbert transforms. Industrial -40 °C to +100 °C temperature range plus deterministic latency suit FDA/IEC 62304-class software environments when paired with appropriate documentation.
推薦
推薦產品摘要
工程參考資料，適用於 5CEFA5F23I7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 5CEFA5F23C7N | 5CEFA7F23I7N | 5CEBA5F23I7N | 5CEFA5F23C8N |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) |
| Logic Elements | 77,000 | 77,000 | 149,500 | 77,000 | 77,000 |
| Embedded Memory (bits) | 5,001,216 | 5,001,216 | 8,046,336 | 5,001,216 | 5,001,216 |
| User I/O | 240 | 240 | 240 | 240 | 240 |
| Operating Temperature | Industrial -40 to +100 C | Commercial 0 to +85 C | Industrial -40 to +100 C | Industrial -40 to +100 C | Commercial 0 to +85 C |
| Speed Grade | 7 | 7 | 7 | 7 | 8 (slower Fmax) |
| Hard Memory Controller | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC | DDR2/DDR3/LPDDR2 + ECC |
| PCIe Hard IP | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 | Gen2 x1/x2/x4 |
主要差異化特點
- Industrial temperature grade for harsh environments (對比5CEFA5F23C7N)
- Higher-density upgrade path in same footprint (對比5CEFA7F23I7N)
- Logic-only variant without transceiver overhead (對比Cyclone V GT (e.g., 5CGTFD5C7F23))
- Hard memory controller offloads fabric (對比Cyclone 10 LP equivalent)
設計說明
The 484-FBGA F23 package has a 1.0 mm ball pitch and 19 × 19 mm body. A minimum 6-layer PCB stack-up with 0.5 oz copper is recommended to escape all 240 user I/O plus JTAG, configuration, and clock pins. Use buried vias under the BGA and a flooded ground plane on layer 2 to maintain signal-integrity on 148.5 MHz LVDS pairs. Decoupling: place 0.1 µF X7R capacitors within 100 mil of every VCCINT/VCCA pin group, plus bulk 47 µF tantalum or polymer caps on each power rail.
Power estimation: at 77 K LE utilization ~70 % and ~50 % toggle rate, expected core power is approximately 1.5-2.5 W before I/O and transceiver contribution. Use the Altera Early Power Estimator (EPE) spreadsheet in Quartus Prime to derive accurate numbers. Provision a 4 A regulator on VCCINT (typically 1.1 V) and a 2 A regulator on VCCA (2.5 V) to handle worst-case thermal-design-power transients.
For PCIe Gen2 endpoint designs, route the PCIe TX/RX differential pairs with 85 Ω differential impedance and 100 mil maximum intra-pair skew. Place AC-coupling capacitors (100 nF) at the transmitter side, as required by the PCIe CEM specification. If using the hard IP at Gen2 ×4, dedicate 8 user I/O lanes to the PCIe pins per the F23 pin connection guidelines.
Do not assume that any Cyclone V E variant is pin-compatible with the F23 footprint - only matching-package density codes (A5, A7, A9 with F23 package) are guaranteed drop-in. Mismatched speed grades (6/7/8) affect Fmax on memory interfaces, so verify with the Quartus Timing Analyzer before tape-out. The 'N' suffix indicates lead-free packaging; design your reflow profile to peak 245 °C ± 5 °C to comply with lead-free assembly.
合規資訊
RoHS compliant per distributor listing; lead-free packaging confirmed by 'N' suffix in part number. AEC-Q100 qualification is not applicable for FPGAs; for automotive-grade Altera FPGAs, see the automotive-cyclone family variants.
