5CEFA5F23C7N - Cyclone V E FPGA, 77k LE, 484-FBGA | Intel
MPN: 5CEFA5F23C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $141.83 | $141.83 |
| 10 | $132.5 | $1,325.00 |
| 100 | $122.4 | $12,240.00 |
| 500 | $115.2 | $57,600.00 |
| 1,000 | $108.75 | $108,750.00 |
5CEFA5F23C7N Overview
What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic device whose interconnect, lookup tables, and embedded blocks (memory, DSP, transceivers, PLLs) are reconfigured by the user after manufacture, providing ASIC-like parallelism with the flexibility of software-defined hardware. Within the broader programmable-logic taxonomy, the Cyclone V E family sits below the high-performance Stratix family and above the low-cost Cyclone family, targeting mid-range applications that need a balance of logic density, transceivers or hard IP, and low static-power consumption. FPGAs are typically paired with external flash (for configuration), DDR2/DDR3 memory, and an Ethernet or USB bridge, often managed by an embedded Nios II soft processor.
Key differentiating specifications for the 5CEFA5F23C7N include a 1.1 V core VCC, 240 user I/O with up to 840 Mbps LVDS support, dedicated 8-bit DDR3 hard memory controller, variable-precision DSP blocks (18x19 multiplier), and up to 12 general-purpose PLLs. The Cyclone V E family uses TSMC's 28 nm low-power process, which contributes to its low static power (typical 0.6 W at 85 °C) and its suitability for thermally constrained embedded systems without active cooling.
Typical applications include industrial motor control drives, machine-vision frame grabbers, broadcast video processing (SD/HD-SDI), PCIe-based protocol bridges, software-defined radio front-ends, and low-cost ASIC prototyping. The combination of DSP blocks and high LVDS pin count makes the part particularly well-suited to multi-channel ADC/DAC interfacing.
When designing with this device, ensure that the Quartus Prime toolchain (subscription or free web edition) is selected early because the Cyclone V E family is not supported by legacy Quartus II versions. A 0.1 µF decoupling capacitor network must be placed adjacent to every VCC pin pair, and the JTAG chain must include a 10 kΩ pull-up on TCK, TMS, and TDI to guarantee clean boundary-scan operation during factory test.
This page synthesizes distributor pricing for 5CEFA5F23C7N, drop-in same-family alternatives, and practical design notes not present in the Intel Cyclone V handbook.
Drop-in alternatives for 5CEFA5F23C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CEFA5F23C7N (same form factor and footprint) — differing in Package, Family, Operating Temperature, RoHS Status, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CEFA5F23C8N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
5CEFA5F23I7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$138.4 / Unit
View Datasheet →5CEFA7F23C7N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
5CEFA5F31C7N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
5CEFA5F23C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V E |
| Logic Elements | 77,000 |
| Embedded Memory (Bits) | 5,001,216 |
| User I/O Count | 240 |
| Core Voltage (VCCINT) | 1.1 V |
| Hard Memory Controllers | Yes (DDR2/DDR3/LPDDR2) |
| Variable-Precision DSP Blocks | Yes (18x19 multiplier) |
| PCIe Hard IP | Gen1/Gen2 x1/x2/x4 |
| PLLs | Up to 12 general-purpose |
| Package | 484-ball FBGA, 23x23 mm, 1.0 mm pitch |
| Process Node | TSMC 28 nm low-power |
| Operating Temperature (Commercial) | 0 °C to +85 °C (TJ) |
| Speed Grade | 7 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Configuration Scheme | Active Serial (AS) / JTAG / Passive Serial |
5CEFA5F23C7N 484-ball fbga, 23x23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for 5CEFA5F23C7N (484-ball fbga, 23x23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CEFA5F23C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
5CEFA5F23C7N is suitable for 6 applications: Industrial Motor Control Drive, Machine Vision Frame Grabber, Broadcast Video Processing, PCIe Gen2 Protocol Bridge, Software-Defined Radio Front End, Low-Cost ASIC Prototyping.
Industrial Motor Control Drive
The 5CEFA5F23C7N suits industrial motor control drives because its variable-precision DSP blocks and 1 MSPS sample-rate LVDS I/O enable field-oriented control (FOC) for three-phase PMSM and ACIM motors. The hard DDR3 controller buffers position-feedback data from incremental encoders or SSI absolute encoders without consuming fabric logic, and 240 user I/O leave headroom for multi-axis control (4-axis drives need ~80-120 I/O) plus safety isolation. Engineers typically pair the FPGA with 25LC1024-I/SM SPI flash for configuration boot and an OPA1612 op-amp on the current-sense analog front end, achieving sub-microsecond control loops at industrial -40C to +85C ambient.
Recommended
Machine Vision Frame Grabber
The 5CEFA5F23C7N is well-matched to machine-vision frame grabber cards thanks to its 240 LVDS-capable user I/O accepting Channel Link or CoaXPress camera data at up to 840 Mbps per pair. The 4.77 Mbit embedded memory (M9K blocks) doubles as line buffers and Bayer-pattern reconstruction RAM, while the PCIe Gen2 hard IP block provides the host uplink (x4 lane = 16 Gbps) without consuming fabric. Real-world designs implement HDR stitching, multi-camera synchronization via fabric PLLs, and 1080p60 throughput while remaining within 1.5 W static power, suitable for fanless industrial PCs.
Recommended
Broadcast Video Processing
For broadcast video processing the 5CEFA5F23C7N's variable-precision DSP blocks deliver real-time SD/HD-SDI up/down/cross-conversion and chroma keying at 1080p60 with margin for ancillary data insertion. The 1.1 V core rail keeps static power around 0.6 W at 85 C junction, easing thermal design in 1U rack-mount broadcast appliances. Designers pair the FPGA with an external GV7700 SDI serializer and TLK2711 gigabit transceiver, plus a DDR3 buffer for frame store — all managed by fabric logic above the hardened PCIe Gen2 IP block, which links the device to the host CPU for control plane tasks.
Recommended
PCIe Gen2 Protocol Bridge
The 5CEFA5F23C7N includes a hard PCIe Gen1/Gen2 IP block supporting x1, x2, or x4 lane configurations, enabling it to act as a PCIe endpoint-to-anything bridge (e.g., PCIe-to-Ethernet, PCIe-to-DDR3, PCIe-to-SPI). This hard IP offloads transaction layer and data-link layer from fabric, leaving 77k logic elements free for the application protocol state machine. Reference designs from Intel demonstrate PCIe-to-RapidIO bridges at 6.25 Gbps aggregate; the FPGA sits on a host card with a 100 MHz reference clock and lane-equalization done by the built-in PCIe PHY.
Recommended
Software-Defined Radio Front End
Software-defined radio (SDR) front-ends benefit from the 5CEFA5F23C7N's 12 general-purpose PLLs and 240 LVDS I/O, which sample wideband IF signals up to ~200 MHz with multi-channel synchronization. The variable-precision DSP blocks implement polyphase channelizers, DDC, and DUC functions, while the 28 nm low-power process holds thermal dissipation to within 1.5 W at full DSP utilization. The device typically sits between an ADC such as the AD9268 and a host CPU over PCIe Gen2, forming a 4-channel wideband receiver subsystem with deterministic latency.
Recommended
Low-Cost ASIC Prototyping
Engineers use the 5CEFA5F23C7N as a low-cost ASIC prototype vehicle for mid-volume designs (10-100k unit/year) where mask costs prohibit a full ASIC tape-out. The Cyclone V E family offers the same Quartus Prime design flow as production Cyclone V GX/GT, so RTL developed here ports cleanly. With 77k logic elements and 4.77 Mbit embedded RAM, the device accommodates typical SoC prototype subsystems: ARM Cortex-M soft IP, DDR3 controller, GPIO banks, and standard peripherals (UART, SPI, I2C) — all while preserving the ability to migrate to a smaller Cyclone V device once the design is final.
Recommended
Recommended Products Summary
Engineering reference data for 5CEFA5F23C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CEFA5F23C8N | 5CEFA5F23I7N | 5CEFA7F23C7N |
|---|---|---|---|---|
| Package | 484-FBGA (F23) 23x23 mm | 484-FBGA (F23) 23x23 mm - same | 484-FBGA (F23) 23x23 mm - same | 484-FBGA (F23) 23x23 mm - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Family | Cyclone V E | Cyclone V E | Cyclone V E | Cyclone V E |
| Logic Elements | 77,000 | 77,000 | 77,000 | 149,500 |
| Embedded Memory (bits) | 5,001,216 | 5,001,216 | 5,001,216 | 8,463,360 |
| User I/O | 240 | 240 | 240 | 240 |
| Speed Grade | 7 | 8 (faster Fmax) | 7 | 7 |
| Temperature Grade | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to 100C) | Commercial (0C to 85C) |
| PCIe Hard IP | Gen1/Gen2 | Gen1/Gen2 | Gen1/Gen2 | Gen1/Gen2 |
| Approx Unit Price (USD) | $141.83 | $155-170 | $165-180 | $245-275 |
Key Differentiators
- Hardened PCIe Gen2 IP block (vs Lattice ECP5 LFE5U-85 (no hard PCIe))
- 240 user I/O at 1.0 mm pitch FBGA (vs Xilinx Spartan-6 XC6SLX75 (only 408 I/O but different package))
- Mature Quartus Prime toolchain (vs Lattice Diamond (smaller IP ecosystem))
Design Notes
Estimated: The 5CEFA5F23C7N dissipates roughly 0.6 W static at 85 C junction and 1.5-2.5 W dynamic at full DSP utilization with 50% toggle rate. Designers should budget a 1.1 V regulator capable of 3 A continuous (e.g., AP63205WU-7 buck regulator) and pair it with a TPS7A4701 LDO for the auxiliary analog rail. Decoupling per VCCINT/VCCIO pin pair is required — minimum 0.1 µF X7R ceramic placed within 50 mils of each ball.
The 484-FBGA F23 package has 1.0 mm ball pitch, requiring microvia or via-in-pad PCB fabrication to escape the inner-row balls. A 1.6 mm minimum board thickness with 0.5 oz copper is recommended. Place a continuous GND plane on the layer directly beneath the BGA and stitch vias around the package perimeter every 2-3 mm to suppress return-path resonance above 100 MHz.
The MSEL[3:0] boot-mode strap pins must be set via 4.7 kΩ pull-up or pull-down resistors before VCCINT ramp; choosing FPP x16 vs AS (active serial) vs PS (passive serial) is a hardware decision that cannot be changed at runtime. Also: VCCPD (3.3 V) must come up before VCCIO bank 1A during configuration, otherwise the device fails to latch the configuration image and the CONF_DONE pin stays low indefinitely.
Compliance Information
RoHS and lead-free per Intel Cyclone V product page; AEC-Q100 not applicable (FPGA is not a discrete automotive IC). Halogen-free status not explicitly stated in verified data — verified unknown.
