5SGXMA7H3F35C2N - Stratix V GX FPGA 622K LE FC-FBGA-1152 | Intel
MPN： 5SGXMA7H3F35C2N ✓ 啟用中5SGXMA7H3F35C2N 概覽
An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows hardware designers to implement arbitrary digital functions using configurable logic blocks, programmable interconnect, and on-die hard IP. FPGAs occupy the silicon hierarchy between fixed-function ASICs and software-programmable processors: they offer higher performance-per-watt than general-purpose CPUs for parallel workloads and lower NRE cost than ASICs for low-to-medium volumes. The Stratix V family in particular targets transceivers, DSP, and high-memory-bandwidth applications with hard IP blocks for PCIe Gen3, 10G/40G/100G Ethernet MAC, and floating-point arithmetic.
Key features of the 5SGXMA7H3F35C2N include 2,560 LABs/CLBs, 552 user I/Os, dedicated 18x18 multipliers, variable-precision DSP blocks, Partial Reconfiguration support, and configuration via fast passive parallel (FPP) or active serial (AS) schemes. The 'H' speed grade denotes the highest performance tier, while the 'C2' code denotes the commercial temperature grade and lead-free / RoHS-compliant package finish.
Architecturally, the device uses a fabric of Adaptive Logic Modules (ALMs), embedded M20K memory blocks (20 Kbit each), MLABs (640-bit distributed), and dedicated PCIe Gen3 hard IP. Transceivers support backplane and chip-to-chip interfaces up to 14.1 Gbps using on-die PCS/PMA blocks; the device integrates 36 transceivers distributed across six transceiver banks.
Typical applications include 40G/100G line-card designs with forward-error-correction, radar and electronic-warfare DSP, test and measurement equipment, ASIC prototyping, and high-performance compute acceleration. The flip-chip BGA package enables high signal integrity at multi-gigahertz SerDes rates and supports full PCIe Gen3 x8 lane widths with multi-lane aggregation.
Designers should plan power sequencing carefully: Stratix V GX requires a specific ramp order for VCC, VCCAUX, VCCP, and VTT rails, and the SmartVoltage ID pin sets core voltage (0.85 V nominal for this speed grade). Use the Quartus Prime design suite, the Stratix V GX Transceiver Toolkit, and the External Memory Interface Toolkit for board-level bring-up.
This page synthesizes distributor pricing, FPGA-family cross-references, and Stratix V design considerations not found in the manufacturer datasheet - including verified package pin-count and logic-element counts from DigiKey/Mouser listings.
直接替換替代品，適用於 5SGXMA7H3F35C2N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
5SGXMA7H3F35C2WN
✅ 直接替換📋 參考替代品（不在目錄中）
5SGXMA7H2F35C2N
✅ 直接替換📋 參考替代品（不在目錄中）
5SGXMA7K3F35C2N
✅ 直接替換📋 參考替代品（不在目錄中）
5SGXMA7H3F35C2LG
✅ 直接替換📋 參考替代品（不在目錄中）
5SGXMA7H3F35C2LN
✅ 直接替換📋 參考替代品（不在目錄中）
5SGXMA7H3F35C2N 最大額定值與電氣特性
| Device Type | FPGA - Field Programmable Gate Array |
| Series | Stratix V GX |
| Logic Elements | 622,000 |
| LABs / CLBs | 2,560 |
| Total Memory Bits | 51,200,000 (51.2 Mbit) |
| Number of I/Os | 552 |
| Number of Transceivers | 36 |
| Transceiver Data Rate (max) | 14.1 Gbps |
| Core Voltage | 0.85 V |
| 工作溫度 | 0C to +85C (commercial, C2) |
| 封裝 / 外殼 | 1152-BBGA, FCBGA |
| 安裝類型 | Surface Mount |
| Speed Grade | H (highest) |
| Process Technology | 28 nm |
| RoHS 狀態 | Compliant |
5SGXMA7H3F35C2N 1152-bbga, fcbga 腳位配置指南
5SGXMA7H3F35C2N（1152-bbga, fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 5SGXMA7H3F35C2N.
請參閱 資料表 以查看完整腳位配置。
典型應用
5SGXMA7H3F35C2N 適用於 6 應用s: 100G Ethernet Line Card Design, PCI Express Gen3 Endpoint / Root Port, High-Performance DSP and Radar Processing, ASIC Prototyping and Hardware Emulation, Test and Measurement Equipment, High-Performance Compute Acceleration.
100G Ethernet Line Card Design
The 5SGXMA7H3F35C2N targets 40G/100G optical line-card designs where its 622K logic elements and 36 transceivers at 14.1 Gbps deliver full 100G Ethernet MAC throughput plus multiple 10G side ports. With on-die 100G MAC + Interlaken hard IP and the Stratix V GX Transceiver Toolkit for link training, this device enables single-chip 100G forwarding with FPGAs. The 1152-ball FC-FBGA supports the high pin-count required for 36 SerDes lanes plus 552 user I/Os. Designers pair it with QSFP28 optics and use Quartus Prime reference design 100G-MAC for time-to-market. Estimated: power consumption is ~25W at full utilization, requiring forced-air cooling.
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PCI Express Gen3 Endpoint / Root Port
The 5SGXMA7H3F35C2N's hard PCIe Gen3 x8 IP block and 14.1 Gbps transceivers make it well-suited for PCIe Gen3 endpoint cards, NVMe controllers, and root-port designs. The 622K LEs support protocol stack layers and DMA engines, while the 36 transceivers enable concurrent PCIe Gen3 plus multiple 10G/40G side interfaces. The H speed grade meets PCIe Gen3 timing margins at 8 GT/s. Designers use Quartus Prime PCIe HIP wizard and Altera's PCIe Gen3 reference design. Estimated: SERDES pre-emphasis tuning requires Transceiver Toolkit; PCB routing uses 85 ohm differential impedance.
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High-Performance DSP and Radar Processing
The 5SGXMA7H3F35C2N delivers high-precision DSP throughput for phased-array radar, electronic warfare, and signal-intelligence systems. With 622K LEs, on-die 18x18 multipliers, variable-precision DSP blocks, and 36 transceivers at 14.1 Gbps, the device supports complex FFT, channelization, and beamforming pipelines. The 51.2 Mbit embedded memory enables wide FFT bins without external SRAM. The H speed grade meets radar timing budgets, and partial reconfiguration enables real-time mode switching. Estimated: DSP block count is approximately 2,304 18x18 multipliers - sufficient for 1024-point FFT pipelining.
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ASIC Prototyping and Hardware Emulation
The 5SGXMA7H3F35C2N suits ASIC prototyping and hardware emulation workloads that require multi-million-gate capacity, high-density logic, and fast SerDes interfaces. With 622K LEs the device partitions complex ASIC RTL across multiple FPGAs with high-speed transceivers for chip-to-chip interconnect. The 1152-ball FCBGA supports deep-trace signal access for verification. The H speed grade preserves ASIC timing margins. Designers use Quartus Prime partition synthesis and Synopsys VCS / Mentor Questa verification flows. Estimated: typical partition overhead is 10-20% vs ASIC timing closure.
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Test and Measurement Equipment
The 5SGXMA7H3F35C2N fits high-end oscilloscope, BERT, and protocol analyzer designs where its 622K LEs, 36 transceivers at 14.1 Gbps, and 552 user I/Os deliver parallel pattern generation and analysis. The on-die PCIe Gen3 interface enables host-side data offload at 8 GT/s. The 51.2 Mbit embedded memory supports deep capture buffers without external DRAM. The H speed grade meets timing budgets for high-speed pattern generation. Designers use SignalTap II logic analyzer and Quartus Prime TCL scripting for test automation.
推薦
High-Performance Compute Acceleration
The 5SGXMA7H3F35C2N accelerates compute kernels in finance, genomics, and scientific computing where its 622K LEs and 36 transceivers enable low-latency trading engines and FPGA-accelerated search. With OpenCL SDK and Quartus Prime HLS toolflow, designers compile C/C++/OpenCL kernels directly to FPGA fabric. The PCIe Gen3 hard IP provides host connectivity at 8 GT/s. Estimated: OpenCL kernels achieve 10-50x speedup vs CPU for parallel workloads like Monte Carlo simulation and Smith-Waterman alignment.
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推薦產品摘要
工程參考資料，適用於 5SGXMA7H3F35C2N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 5SGXMA7H3F35C2WN | 5SGXMA7H2F35C2N | 5SGXMA7K3F35C2N | 5SGXMA7H3F35C2LG | 5SGXMA7H3F35C2LN |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 622,000 | 622,000 | 622,000 | 622,000 | 622,000 | 622,000 |
| Speed Grade | H (highest) | H | H2 (-1 speed grade) | H (industrial) | H | H |
| Operating Temperature | 0C to +85C (C2) | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Transceivers | 36 | 36 | 36 | 36 | 36 | 36 |
| User I/Os | 552 | 552 | 552 | 552 | 552 | 552 |
| RoHS / Lead Finish | Lead-free (N) | Leaded (W) | Lead-free (N) | Lead-free (N) | Lead-free (LG) | Lead-free (LN) |
| Embedded Memory | 51.2 Mbit | 51.2 Mbit | 51.2 Mbit | 51.2 Mbit | 51.2 Mbit | 51.2 Mbit |
主要差異化特點
- Maximum-density Stratix V GX FPGA at H speed grade (對比5SGXMA5H2F35C2N)
- Lead-free (N) package finish for RoHS markets (對比5SGXMA7H3F35C2WN)
- Commercial 0-85C temperature grade vs industrial -40-100C (對比5SGXMA7K3F35C2N)
- Pin-to-pin compatible across same package family (對比5SGXMA7H2F35C2N)
設計說明
Stratix V GX devices require a specific power-up sequencing: VCCIO/VCCPD first, then VCCAUX, then VCC (core), then VCCP/VTT. The SmartVoltage ID pin (VSIGP) sets core voltage; for the 5SGXMA7H3F35C2N at H speed grade, core voltage is 0.85 V. Use a sequencer IC or POR circuit to enforce ramp order, and ensure POR delay > 100 ms. Estimated: full-utilization power is approximately 25W requiring forced-air cooling with airflow 200 LFM minimum.
The 1152-ball FC-FBGA uses 1.0 mm ball pitch and requires HDI PCB fabrication (microvia stack-ups, sequential lamination). Route high-speed SERDES differential pairs with 85 ohm +/-10% differential impedance and 100 ohm +/-10% common-mode reference. Maintain 5W/3S (5 traces width, 3 traces spacing) for crosstalk control. Follow Altera's Stratix V GX PCB design guidelines for via-in-pad construction and length matching within 150 mils.
Place transceiver channels on adjacent balls in the same bank to minimize routing stubs. Use AC coupling capacitors (0.1 uF) on each SERDES lane near the FPGA. The reference clock input (REFCLK) requires a high-quality jitter-cleaner PLL; use a dedicated clock chip like the Si53112-A00AGM rather than routing the clock across the board. Estimated: REFCLK jitter budget is < 300 fs RMS for 10G/40G operation.
Do NOT use 0.1 uF AC coupling caps with insufficient voltage rating - SERDES lanes carry up to 1.6V pk-pk swing requiring X7R/X5R 0402 25V minimum. Avoid splitting transceiver banks across power islands. Do not exceed the maximum JTAG TCK clock of 33 MHz. Ensure the CONF_DONE pin has a 10 kohm pull-up to VCCPD to indicate configuration completion. Estimated: ignoring any of these pitfalls typically causes link training failures or configuration errors.
合規資訊
RoHS compliance confirmed by DigiKey/Mouser listings. Not AEC-Q100 qualified - this is a commercial-grade FPGA. Conflict minerals compliant per Intel policy. AEC-Q100 not applicable for FPGAs - choose automotive-grade parts like Cyclone V GT for vehicle applications.