10CL025YU256C8G - Cyclone 10 LP FPGA, 25K LE, 256-BGA | Intel
MPN： 10CL025YU256C8G ✓ 啟用中10CL025YU256C8G 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. Within the broader taxonomy of digital logic devices, an FPGA sits between fixed-function Application Specific Integrated Circuits (ASICs) and microcontrollers, offering hardware-level parallelism with software-style reconfigurability. FPGAs belong to the broader category of programmable logic devices (PLDs) and are widely used for I/O expansion, chip-to-chip bridging, and acceleration of parallel compute tasks.
Key features of the 10CL025YU256C8G include 24,624 logic elements, 594 Kbits of embedded memory (M9K blocks), 66 embedded 18x18 multipliers, and 4 general-purpose PLLs per device. The Cyclone 10 LP family is built on a low-power process that delivers static power as low as 25 mW, making it suitable for thermally constrained designs without active cooling. Configuration is supported via an industry-standard serial or parallel configuration scheme.
The Cyclone 10 LP architecture combines an efficient logic fabric with hard IP blocks for memory interfaces (DDR3/LPDDR2 controllers), PCIe Gen2, and high-speed LVDS I/O. Designers can implement custom peripherals, state machines, and signal processing pipelines in parallel hardware, achieving deterministic latency that microcontrollers cannot match. The U256 package variant provides a 14x14 mm footprint with 0.8 mm ball pitch, supporting PCB designs that balance routing density with assembly yield.
Typical applications include industrial I/O expansion modules, motor control front-ends, sensor fusion hubs, video bridging and format adaptation, low-cost PCIe endpoint cards, and general-purpose logic replacement for discrete glue logic. The low static and dynamic power also makes the part attractive for battery-powered or fanless embedded systems.
When designing with the 10CL025YU256C8G, ensure the Quartus Prime design suite is used for synthesis, place-and-route, and timing closure. Verify all I/O assignments against the U256 pinout, and provide adequate decoupling on each power rail (1.2V core, 2.5V analog, 3.3V I/O). For high-speed LVDS or DDR3 interfaces, follow the recommended PCB stackup and impedance control guidelines.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineers evaluating the Cyclone 10 LP family for a new design will find parametric comparisons, alternative part numbers, and application notes consolidated in one place.
直接替換替代品，適用於 10CL025YU256C8G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10CL025YU256C8G （相同外形與佔位） — 差異在於 Package, Speed Grade, Logic Elements (LE), Operating Temperature, Process Technology.
10CL025YU256C6G
✅ 直接替換聯絡詢價
查看資料表 →10CL025YU256A7G
✅ 直接替換聯絡詢價
查看資料表 →10CL016YU256C8G
✅ 直接替換聯絡詢價
查看資料表 →10CL016YU256C6G
✅ 直接替換聯絡詢價
查看資料表 →10CL016YU256A7G
✅ 直接替換聯絡詢價
查看資料表 →10CL025YU256C8G 最大額定值與電氣特性
| Family | Cyclone® 10 LP |
| Series | 10CL025 |
| Logic Elements | 24,624 |
| Total RAM Bits | 608,256 |
| User I/O Count | 150 |
| 封裝 | 256-LFBGA / UFBGA (U256) |
| Package Dimensions | 14 mm x 14 mm |
| Ball Pitch | 0.8 mm |
| Core Voltage | 1.2 V |
| 工作溫度 | 0C to +85C (Commercial) |
| 安裝類型 | Surface Mount |
| Lead Shape | Ball |
| 腳位數 | 256 |
| Configuration | Serial / Parallel |
| Embedded Multipliers | 66 (18x18) |
| PLLs | 4 |
| Static Power | 25 mW (typical) |
| RoHS 狀態 | Compliant |
10CL025YU256C8G 14 mm x 14 mm 腳位配置指南
10CL025YU256C8G（14 mm x 14 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10CL025YU256C8G.
請參閱 資料表 以查看完整腳位配置。
典型應用
10CL025YU256C8G 適用於 7 應用s: Industrial I/O Expansion, Motor Control Front-End, Video Bridging and Format Adaptation, Sensor Fusion Hub, Low-Cost PCIe Endpoint Card, Discrete Glue Logic Replacement, Communication Protocol Bridge.
Industrial I/O Expansion
The 10CL025YU256C8G is well suited for industrial I/O expansion modules where 24,624 logic elements can implement multiple communication protocols (Modbus, RS-485, CAN, SPI, I2C) and 150 user I/O pins deliver enough headroom for opto-isolated inputs, relay outputs, and fieldbus transceivers. The 1.2V core voltage reduces thermal dissipation compared to legacy FPGAs, enabling fanless DIN-rail enclosure designs. Pair with the MAX1300 ADC for analog front-end monitoring.
推薦
Motor Control Front-End
The 10CL025YU256C8G provides deterministic hardware parallelism ideal for Field-Oriented Control (FOC) and stepper motor commutation loops. Its 66 embedded 18x18 multipliers accelerate Park/Clarke transforms and PID loops at sub-microsecond latency, while the 4 general-purpose PLLs synthesize the precise PWM switching frequencies required by IGBT/MOSFET gate drivers. The 150 I/O count supports multi-axis encoder feedback and resolver excitation simultaneously.
推薦
Video Bridging and Format Adaptation
The 10CL025YU256C8G can implement real-time video bridging between MIPI CSI-2, LVDS, parallel RGB, and HDMI interfaces, leveraging its hardware parallelism for pixel-rate processing without software bottlenecks. The 608 Kbits of embedded RAM supports line buffers and frame synchronization FIFOs, while 150 I/O lanes accommodate multi-channel parallel video buses. This makes the part suitable for industrial cameras, medical imaging, and HMI display controllers.
推薦
Sensor Fusion Hub
In sensor fusion applications, the 10CL025YU256C8G aggregates IMU, magnetometer, barometric, and GNSS data streams, running Kalman filter algorithms in hardware that would overwhelm a microcontroller. The 24,624 logic elements accommodate full sensor interfaces, while the 66 multipliers accelerate matrix operations required for 9-DoF fusion. Low static power of 25 mW enables battery-powered IoT and wearable designs with always-on sensor processing.
推薦
Low-Cost PCIe Endpoint Card
The Cyclone 10 LP architecture supports a hard PCIe Gen2 IP core that the 10CL025YU256C8G can implement as a single-lane endpoint, making it ideal for low-cost PCIe add-in cards such as protocol analyzers, data loggers, and custom accelerators. The 24K logic elements fit a Gen2 x1 endpoint plus DMA engine and device-side state machine. Its 1.2V core reduces auxiliary board power compared to larger FPGAs, which is critical for slot-powered cards.
推薦
Discrete Glue Logic Replacement
For designers consolidating TTL/CMOS glue logic - counters, address decoding, custom state machines, bus arbitration - the 10CL025YU256C8G replaces dozens of discrete packages with a single programmable device. The 24,624 logic elements and 150 I/O count exceed typical glue-logic demands, leaving significant headroom for design evolution. PCB real estate is reclaimed and BOM count drops, while the 1.2V core keeps thermal dissipation low.
推薦
Communication Protocol Bridge
The 10CL025YU256C8G implements multi-protocol bridging between UART, SPI, I2C, CAN, Ethernet MAC, and PCIe endpoints in a single device. Its 608 Kbits embedded RAM supports packet buffering, while 150 I/O pins accommodate multiple transceiver interfaces simultaneously. The 4 PLLs generate independent clocks for each protocol domain, eliminating external clock buffers and reducing BOM complexity.
推薦
推薦產品摘要
工程參考資料，適用於 10CL025YU256C8G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10CL025YU256C6G | 10CL025YU256A7G | 10CL016YU256C8G | 10CL016YU256C6G | 10CL016YU256A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LFBGA (U256) | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same | 256-LFBGA (U256) - same |
| Logic Elements | 24,624 | 24,624 | 24,624 | 15,408 | 15,408 | 15,408 |
| Total RAM Bits | 608,256 | 608,256 | 608,256 | 303,744 | 303,744 | 303,744 |
| User I/O Count | 150 | 150 | 150 | 150 | 150 | 150 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | C8 (speed grade 8) | C6 (speed grade 6) | A7 (grade 7) | C8 (speed grade 8) | C6 (speed grade 6) | A7 (grade 7) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
主要差異化特點
- 25K logic element density at low power (對比10CL016YU256C8G)
- Speed grade 8 (C8) timing margin (對比10CL025YU256C6G)
- Drop-in compatibility with full Cyclone 10 LP U256 family (對比10CL016YU256C8G)
設計說明
Estimated: At 1.2V core voltage and typical 25 mW static power plus dynamic power (varies with utilization and toggle rate), the 10CL025YU256C8G in a U256 BGA package typically dissipates 1-3W in real designs. The U256 BGA thermal pad must be soldered to a continuous ground plane with thermal vias for proper heat dissipation; without this, junction temperature can exceed 125C in enclosed industrial enclosures. Add 4-9 thermal vias (0.3 mm drill, 1 oz copper) directly under the package thermal pad.
Use microvia-in-pad technology (laser-drilled, 0.1 mm capture pad) on the 0.8 mm BGA balls to ensure reliable assembly yield on standard 6-layer FR-4 stackup. Route all signal escapes on the top layer with dog-bone fanout, and dedicate inner layers to ground/power planes. Decouple each power rail with 100nF X7R capacitors placed within 2 mm of the BGA balls, plus 10uF bulk capacitors on each supply island (1.2V VCCINT, 2.5V VCCA, 3.3V VCCIO).
Do not mix Cyclone 10 LP pin assignments between U256 (256-ball BGA) and E144 (144-pin EQFP) packages - I/O bank assignments and pin names differ entirely. Always re-run Quartus Prime Pin Planner for the U256 package when porting designs from other Cyclone 10 LP packages. Confirm MSL3 moisture sensitivity handling per J-STD-033 before reflow assembly - U256 BGA requires pre-bake if floor life exposure exceeds 168 hours.
合規資訊
RoHS and lead-free compliance per Intel/Altera product page. Commercial temperature grade (0C to +85C); industrial/automotive variants available in I7G and A7G suffixes.
