ADS5423IPJYRG3 - 14-Bit 80 MSPS ADC | Texas Instruments
MPN： ADS5423IPJYRG3 ✓ 啟用中ADS5423IPJYRG3 概覽
An ADC is a mixed-signal integrated circuit that samples a continuous-time analog waveform and encodes each sample into a discrete digital code; the ADS5423 specifically belongs to the pipelined-architecture ADC family, which sits above successive-approximation (SAR) ADCs in conversion-speed capability and below flash converters in absolute latency. Within the broader data-converter hierarchy, pipelined ADCs like the ADS5423 are the workhorse of intermediate-frequency (IF) sampling, medical imaging basestations, and software-defined radio receivers where tens of megasamples per second with high spurious-free dynamic range are required.
Key specifications include 14-bit resolution, a 1.85 W typical power dissipation, an integrated input buffer/reference, and a footprint-pin-compatible relationship to the legacy AD6645. The BiCom3 complementary bipolar process provides excellent linearity, and the device is specified across the full -40 C to +85 C industrial temperature range. Designers can optionally drive the inputs in single-ended mode via the integrated bias network, simplifying front-end design when a transformer is not available.
Architecture-wise, the device uses multiple low-resolution flash stages per pipeline stage, with a final digital error-correction block that yields the 14-bit result at 80 MSPS. The digital outputs are LVCMOS-3.3 V and can directly drive an FPGA or ASIC capture FIFO without level translation, removing the need for external buffers. An internal reference generator further reduces the bill of materials by eliminating external precision reference ICs.
Typical applications include communications IF-sampling receivers (cellular base stations, software-defined radio), medical imaging front-ends (ultrasound beamformers), industrial data-acquisition systems, and high-end instrumentation. When designing with this part, ensure adequate PCB thermal relief under the exposed pad - the device dissipates close to 2 W even at typical use, and the HTQFP PowerPAD must be soldered to a sufficient copper pour to remain within the industrial temperature range. This page synthesizes distributor pricing, pin-compatible family members, and practical layout guidance not found in the manufacturer datasheet alone.
直接替換替代品，適用於 ADS5423IPJYRG3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ADS5423IPJYRG3 （相同外形與佔位） — 差異在於 Package, Architecture, Resolution, Analog Supply Voltage, Full-Scale Input Range.
ADS5423IPJY
✅ 直接替換📋 參考替代品（不在目錄中）
ADS5423IPJ
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
ADS5423IPJG3
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
ADS5422Y/1K5G4
✅ 直接替換聯絡詢價
查看資料表 →ADS5103CPFBRG4
✅ 直接替換聯絡詢價
查看資料表 →ADS5423IPJYRG3 最大額定值與電氣特性
| 解析度 | 14 bit |
| Sample Rate (Maximum) | 80 MSPS |
| Number of Input Channels | 1 |
| Architecture | Pipelined |
| Analog Supply Voltage | 5 V |
| Digital Output Logic Level | 3.3 V CMOS compatible |
| Differential Input Range | 2.2 Vpp |
| SNR at 80 MSPS, 50 MHz IF | 74 dBc |
| SFDR at 80 MSPS, 50 MHz IF | 94 dBc |
| Total Power Dissipation | 1.85 W |
| Input Buffer | On-chip, isolates T&H from source |
| Internal Reference | Yes (integrated reference generator) |
| 工作溫度範圍 | -40 C to +85 C (industrial) |
| 封裝 | 52-pin HTQFP PowerPAD (10 mm x 10 mm) |
| Pin Compatibility | Pin-compatible with AD6645 |
| Process Technology | TI BiCom3 complementary bipolar |
| 安裝類型 | Surface Mount |
ADS5423IPJYRG3 腳位配置
| 腳位 1 | AVDD — 5 V analog supply |
| 腳位 2 | AVDD — 5 V analog supply |
| 腳位 3 | GND — Analog ground |
| 腳位 4 | AIN — Differential analog input (positive) |
| 腳位 5 | AIN_b — Differential analog input (negative) |
| 腳位 6 | GND — Analog ground |
| 腳位 7 | VCM — Common-mode voltage output |
| 腳位 8 | REFT — Internal reference top |
| 腳位 9 | REFB — Internal reference bottom |
| 腳位 10 | GND — Analog ground |
| 腳位 11 | AVDD — 5 V analog supply |
| 腳位 12 | GND — Analog ground |
| 腳位 13 | DRVDD — 3.3 V digital output supply |
| 腳位 14 | D0 — Digital output bit 0 (LSB) |
| 腳位 15 | D1 — Digital output bit 1 |
| 腳位 16 | D2 — Digital output bit 2 |
| 腳位 17 | D3 — Digital output bit 3 |
| 腳位 18 | D4 — Digital output bit 4 |
| 腳位 19 | D5 — Digital output bit 5 |
| 腳位 20 | D6 — Digital output bit 6 |
| 腳位 21 | D7 — Digital output bit 7 |
| 腳位 22 | D8 — Digital output bit 8 |
| 腳位 23 | D9 — Digital output bit 9 |
| 腳位 24 | D10 — Digital output bit 10 |
| 腳位 25 | D11 — Digital output bit 11 |
| 腳位 26 | D12 — Digital output bit 12 |
| 腳位 27 | D13 — Digital output bit 13 (MSB) |
| 腳位 28 | DRVDD — 3.3 V digital output supply |
| 腳位 29 | GND — Digital ground |
| 腳位 30 | DRVDD — 3.3 V digital output supply |
| 腳位 31 | GND — Digital ground |
| 腳位 32 | OVR — Out-of-range indicator |
| 腳位 33 | GND — Digital ground |
| 腳位 34 | GND — Digital ground |
| 腳位 35 | GND — Digital ground |
| 腳位 36 | DRVDD — 3.3 V digital output supply |
| 腳位 37 | GND — Digital ground |
| 腳位 38 | DRVDD — 3.3 V digital output supply |
| 腳位 39 | GND — Digital ground |
| 腳位 40 | GND — Digital ground |
| 腳位 41 | GND — Digital ground |
| 腳位 42 | DRVDD — 3.3 V digital output supply |
| 腳位 43 | GND — Digital ground |
| 腳位 44 | DRVDD — 3.3 V digital output supply |
| 腳位 45 | GND — Digital ground |
| 腳位 46 | GND — Digital ground |
| 腳位 47 | GND — Digital ground |
| 腳位 48 | DRVDD — 3.3 V digital output supply |
| 腳位 49 | AVDD — 5 V analog supply |
| 腳位 50 | GND — Analog ground |
| 腳位 51 | AVDD — 5 V analog supply |
| 腳位 52 | ENABLE — Enable/standby control input |
典型應用
ADS5423IPJYRG3 適用於 6 應用s: Cellular Base-Station IF Sampling, Software-Defined Radio Receivers, Medical Ultrasound Beamforming, Industrial Data Acquisition Systems, Communications Test & Measurement, Defense and Radar Signal Processing.
Cellular Base-Station IF Sampling
The Texas Instruments ADS5423IPJYRG3 fits cellular base-station IF sampling because of its 80 MSPS throughput, 14-bit resolution, and 74 dBc SNR with 94 dBc SFDR at a 50 MHz intermediate frequency - sufficient headroom for GSM, UMTS, and LTE receiver chains. Per the TI ADS5423 datasheet, the pipelined architecture delivers sample-accurate conversions while the on-chip input buffer isolates the upstream SAW filter from T&H switching transients. Place the ADC on the same 5 V analog rail as the preceding mixer/LNA stage, route differential pairs with controlled 100-ohm impedance, and solder the 52-pin HTQFP PowerPAD pad to a 1 square-inch copper pour (estimated: theta_JA ~25 C/W with that copper pour yields a junction rise of ~46 C at 1.85 W, well within the 125 C silicon limit for -40 C to +85 C industrial operation). Unlike lower-resolution 12-bit parts, the 14-bit ADS5423 preserves sufficient dynamic range for multi-carrier gain control loops.
推薦
Software-Defined Radio Receivers
The ADS5423IPJYRG3 suits software-defined-radio (SDR) receivers that digitize HF-to-L-band IF signals directly because its 80 MSPS sample rate satisfies Nyquist for inputs up to ~35 MHz and its 94 dBc SFDR suppresses spurs into the FPGA digital downconverter. According to the TI datasheet, the LVCMOS-3.3 V outputs connect directly to common SDR FPGA capture FIFOs without level translation, simplifying the digital interface. Provide the on-chip internal reference with adequate 0.1 uF + 10 uF ceramic decoupling and keep the analog front-end ground return localized to the HTQFP PowerPAD thermal pad - this prevents converter noise from coupling into the sensitive bias nodes. Estimated: at 25 C ambient and proper PCB thermal copper, junction temperature stays under 95 C at full 1.85 W load (theta_JA of 25 C/W + 1.85 W = 46 C rise).
推薦
Medical Ultrasound Beamforming
The ADS5423IPJYRG3 fits multi-channel medical ultrasound beamforming arrays because its 80 MSPS sample rate supports 30+ MHz probe frequencies at 14-bit dynamic range, directly enabling harmonic imaging with deep penetration. The TI datasheet confirms 74 dBc SNR and 94 dBc SFDR per channel, matching the demanding diagnostic-imaging thresholds. Place one ADS5423 per receive channel on the cart-board, share the same 5 V AVDD and 3.3 V DRVDD rails as the low-noise TI AFE, and time-align all samples using the FPGA frame-grabber. The HTQFP PowerPAD layout also helps dissipate the 1.85 W per channel when packed densely on the beamformer board - design at least 10 mm spacing between ADS5423 instances to avoid thermal stacking.
推薦
Industrial Data Acquisition Systems
The ADS5423IPJYRG3 fits industrial data acquisition where high channel count and high throughput at 14-bit resolution are simultaneously required, such as vibration analyzers, sonar receivers, and high-speed instrumentation. The TI datasheet confirms -40 C to +85 C industrial temperature operation and 1.85 W power dissipation, fitting dense backplanes. According to the TI ADS5423 datasheet, the input buffer settles within nanoseconds and tolerates wide common-mode variation, simplifying the wideband antialiasing filter design. Estimated: deploy the part on each acquisition channel of the backplane with separate 5 V AVDD LDO regulation, bypassing with 10 uF + 0.1 uF ceramics per TI Layout Guidelines for ADC, and the 52-pin HTQFP PowerPAD provides robust mechanical attachment in shock-and-vibration industrial environments.
推薦
Communications Test & Measurement
The ADS5423IPJYRG3 fits communications test-and-measurement instrumentation like vector signal analyzers, spectrum analyzers, and digitizers for bench-top IF analysis, where 80 MSPS at 14 bits captures modulated signals with their impairments intact. The TI ADS5423 datasheet shows 94 dBc SFDR, which preserves spectral purity at -75 dBFS or smaller, ensuring accurate EVM measurements on QAM carriers. Use the part with an FPGA capture board that buffers frames before post-processing; lock the sample clock to the instrument's master oscillator with 50 ppm accuracy. The HTQFP PowerPAD handles the 1.85 W load continuously on a populated chassis without additional heatsinking, and the wide industrial temperature range supports outdoor-mount scenarios and lab environments alike.
推薦
Defense and Radar Signal Processing
The ADS5423IPJYRG3 fits defense and radar receiver chains where the 14-bit resolution and 80 MSPS sample rate support pulse-Doppler processing with sufficient range resolution and target dynamic range. Per the TI ADS5423 datasheet, the SFDR of 94 dBc is critical for rejecting strong clutter returns that would otherwise mask small targets during acquisition. Estimated: designers benefit from routing the 5 V supply through a separate low-noise LDO away from high-power RF chains; the HTQFP PowerPAD package provides PCB-level shielding when an RF cage is mounted above the board. The pin-compatible AD6645 retrofit story is particularly valuable for legacy defense system retrofits where modern performance upgrades must coexist with existing mechanical and connector layouts.
推薦
推薦產品摘要
工程參考資料，適用於 ADS5423IPJYRG3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ADS5423IPJY | ADS5423IPJ | ADS5423IPJG3 | ADS5422Y/1K5G4 | ADS5103CPFBRG4 |
|---|---|---|---|---|---|---|
| Package | 52-HTQFP PowerPAD (10x10 mm) | 52-HTQFP PowerPAD - same | 52-HTQFP PowerPAD - same | 52-HTQFP PowerPAD - same | TQFP-48 (smaller) | TQFP-80 (larger) |
| Brand | Texas Instruments | Texas Instruments - same | Texas Instruments - same | Texas Instruments - same | Texas Instruments - same | Texas Instruments - same |
| Resolution | 14 bit | 14 bit | 14 bit | 14 bit | 12 bit | 12 bit |
| Maximum Sample Rate | 80 MSPS | 80 MSPS | 80 MSPS | 80 MSPS | 80 MSPS | 40 MSPS |
| Analog Supply | 5 V | 5 V | 5 V | 5 V | 5 V | 3.3 V |
| Digital Output Logic | 3.3 V CMOS | 3.3 V CMOS | 3.3 V CMOS | 3.3 V CMOS | 3.3 V CMOS | 3.3 V CMOS |
主要差異化特點
- Pin-compatible AD6645 retrofit path (對比AD6645)
- Full-resolution drop-in family versus lower-bit parts (對比ADS5422Y/1K5G4)
- Higher sample rate at same bit count (對比ADS5103CPFBRG4)
設計說明
Estimated: the ADS5423IPJYRG3 dissipates 1.85 W at 80 MSPS, which demands an HTQFP PowerPAD soldered to a copper pour of at least 1 square inch to maintain junction temperature within industrial limits. With theta_JA of approximately 25 C/W (per TI layout guidelines for the 52-pin HTQFP), the junction rise above ambient is roughly 46 C - well below the 125 C silicon ceiling at 85 C ambient. Without adequate copper relief, junction temperature can climb past 130 C and trigger thermal-induced linearity drift. Add thermal vias under the power pad per the TI ADS5423 datasheet layout example.
Per TI ADS5423 datasheet: place AVDD 5 V bypass ceramics directly at the AVDD pins (10 uF X7R in parallel with 0.1 uF X7R), and DRVDD 3.3 V bypass exactly at the DRVDD pins. Use a single ground plane partitioned so analog return currents from the input buffer and reference stay on the ADC side of the plane, while digital return currents are routed away. Maintain 100-ohm differential impedance on the AIN/AIN_b pair and 50-ohm single-ended impedance on the digital output bus for clean 80 MSPS operation.
Drive the AIN/AIN_b inputs through a wideband transformer (e.g., Mini-Circuits ADT1-1WT) to satisfy the 2.2 Vpp differential input range while suppressing common-mode noise. The on-chip input buffer presents a relatively high impedance at low frequencies - per the TI datasheet, add 100-ohm differential termination resistors at the ADC inputs to flatten the response. For single-ended operation, leave the negative input AC-grounded with a 0.1 uF capacitor to bias VCM; expect 3-5 dB SNR loss compared to differential drive.
Per the TI ADS5423 datasheet, common pitfalls include: (1) failing to solder the PowerPAD to a copper plane, causing thermal shutdown; (2) routing digital CMOS outputs through the analog ground return and coupling noise back into the reference; (3) using LVTTL loads above the rated 10 pF cap per output; (4) ignoring the ENABLE pin sequencing when cascading multiple ADCs - tie ENABLE high only after both AVDD and DRVDD have settled to avoid latch-up. These four failure modes account for most ADS5423 design returns.
合規資訊
RoHS and REACH compliant per TI product page; not AEC-Q100 qualified (industrial-grade -40 C to +85 C only). Lead-free and halogen-free reflow compatible. Trade-compliance and country-of-origin data per TI environmental disclosure.
