ADS5423IPJYRG3 - 14-Bit 80 MSPS ADC | Texas Instruments
N.º da peça: ADS5423IPJYRG3 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $39.5 | $39,50 |
| 10 | $36.8 | $368,00 |
| 100 | $32.4 | $3.240,00 |
| 500 | $28.95 | $14.475,00 |
| 1.000 | $25.4 | $25.400,00 |
ADS5423IPJYRG3 Visão geral
An ADC is a mixed-signal integrated circuit that samples a continuous-time analog waveform and encodes each sample into a discrete digital code; the ADS5423 specifically belongs to the pipelined-architecture ADC family, which sits above successive-approximation (SAR) ADCs in conversion-speed capability and below flash converters in absolute latency. Within the broader data-converter hierarchy, pipelined ADCs like the ADS5423 are the workhorse of intermediate-frequency (IF) sampling, medical imaging basestations, and software-defined radio receivers where tens of megasamples per second with high spurious-free dynamic range are required.
Key specifications include 14-bit resolution, a 1.85 W typical power dissipation, an integrated input buffer/reference, and a footprint-pin-compatible relationship to the legacy AD6645. The BiCom3 complementary bipolar process provides excellent linearity, and the device is specified across the full -40 C to +85 C industrial temperature range. Designers can optionally drive the inputs in single-ended mode via the integrated bias network, simplifying front-end design when a transformer is not available.
Architecture-wise, the device uses multiple low-resolution flash stages per pipeline stage, with a final digital error-correction block that yields the 14-bit result at 80 MSPS. The digital outputs are LVCMOS-3.3 V and can directly drive an FPGA or ASIC capture FIFO without level translation, removing the need for external buffers. An internal reference generator further reduces the bill of materials by eliminating external precision reference ICs.
Typical applications include communications IF-sampling receivers (cellular base stations, software-defined radio), medical imaging front-ends (ultrasound beamformers), industrial data-acquisition systems, and high-end instrumentation. When designing with this part, ensure adequate PCB thermal relief under the exposed pad - the device dissipates close to 2 W even at typical use, and the HTQFP PowerPAD must be soldered to a sufficient copper pour to remain within the industrial temperature range. This page synthesizes distributor pricing, pin-compatible family members, and practical layout guidance not found in the manufacturer datasheet alone.
Alternativas drop-in para ADS5423IPJYRG3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ADS5423IPJYRG3 (mesmo formato e footprint) — diferindo em Package, Architecture, Resolution, Analog Supply Voltage, Full-Scale Input Range.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ADS5423IPJY
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADS5423IPJ
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ADS5423IPJG3
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ADS5422Y/1K5G4
✅ Drop-In✓ Em estoque
$11.45 / unidade
Ver ficha técnica →ADS5103CPFBRG4
✅ Drop-In✓ Em estoque
$4.95 / unidade
Ver ficha técnica →ADS5423IPJYRG3 Classificações máximas e características elétricas
| Resolução | 14 bit |
| Sample Rate (Maximum) | 80 MSPS |
| Number of Input Channels | 1 |
| Architecture | Pipelined |
| Analog Supply Voltage | 5 V |
| Digital Output Logic Level | 3.3 V CMOS compatible |
| Differential Input Range | 2.2 Vpp |
| SNR at 80 MSPS, 50 MHz IF | 74 dBc |
| SFDR at 80 MSPS, 50 MHz IF | 94 dBc |
| Total Power Dissipation | 1.85 W |
| Input Buffer | On-chip, isolates T&H from source |
| Internal Reference | Yes (integrated reference generator) |
| Faixa de temperatura de operação | -40 C to +85 C (industrial) |
| Encapsulamento | 52-pin HTQFP PowerPAD (10 mm x 10 mm) |
| Pin Compatibility | Pin-compatible with AD6645 |
| Process Technology | TI BiCom3 complementary bipolar |
| Tipo de montagem | Surface Mount |
Configuração de pinos do ADS5423IPJYRG3
| Pino 1 | AVDD — 5 V analog supply |
| Pino 2 | AVDD — 5 V analog supply |
| Pino 3 | GND — Analog ground |
| Pino 4 | AIN — Differential analog input (positive) |
| Pino 5 | AIN_b — Differential analog input (negative) |
| Pino 6 | GND — Analog ground |
| Pino 7 | VCM — Common-mode voltage output |
| Pino 8 | REFT — Internal reference top |
| Pino 9 | REFB — Internal reference bottom |
| Pino 10 | GND — Analog ground |
| Pino 11 | AVDD — 5 V analog supply |
| Pino 12 | GND — Analog ground |
| Pino 13 | DRVDD — 3.3 V digital output supply |
| Pino 14 | D0 — Digital output bit 0 (LSB) |
| Pino 15 | D1 — Digital output bit 1 |
| Pino 16 | D2 — Digital output bit 2 |
| Pino 17 | D3 — Digital output bit 3 |
| Pino 18 | D4 — Digital output bit 4 |
| Pino 19 | D5 — Digital output bit 5 |
| Pino 20 | D6 — Digital output bit 6 |
| Pino 21 | D7 — Digital output bit 7 |
| Pino 22 | D8 — Digital output bit 8 |
| Pino 23 | D9 — Digital output bit 9 |
| Pino 24 | D10 — Digital output bit 10 |
| Pino 25 | D11 — Digital output bit 11 |
| Pino 26 | D12 — Digital output bit 12 |
| Pino 27 | D13 — Digital output bit 13 (MSB) |
| Pino 28 | DRVDD — 3.3 V digital output supply |
| Pino 29 | GND — Digital ground |
| Pino 30 | DRVDD — 3.3 V digital output supply |
| Pino 31 | GND — Digital ground |
| Pino 32 | OVR — Out-of-range indicator |
| Pino 33 | GND — Digital ground |
| Pino 34 | GND — Digital ground |
| Pino 35 | GND — Digital ground |
| Pino 36 | DRVDD — 3.3 V digital output supply |
| Pino 37 | GND — Digital ground |
| Pino 38 | DRVDD — 3.3 V digital output supply |
| Pino 39 | GND — Digital ground |
| Pino 40 | GND — Digital ground |
| Pino 41 | GND — Digital ground |
| Pino 42 | DRVDD — 3.3 V digital output supply |
| Pino 43 | GND — Digital ground |
| Pino 44 | DRVDD — 3.3 V digital output supply |
| Pino 45 | GND — Digital ground |
| Pino 46 | GND — Digital ground |
| Pino 47 | GND — Digital ground |
| Pino 48 | DRVDD — 3.3 V digital output supply |
| Pino 49 | AVDD — 5 V analog supply |
| Pino 50 | GND — Analog ground |
| Pino 51 | AVDD — 5 V analog supply |
| Pino 52 | ENABLE — Enable/standby control input |
Aplicações típicas
ADS5423IPJYRG3 é adequado para 6 aplicaçãos: Cellular Base-Station IF Sampling, Software-Defined Radio Receivers, Medical Ultrasound Beamforming, Industrial Data Acquisition Systems, Communications Test & Measurement, Defense and Radar Signal Processing.
Cellular Base-Station IF Sampling
The Texas Instruments ADS5423IPJYRG3 fits cellular base-station IF sampling because of its 80 MSPS throughput, 14-bit resolution, and 74 dBc SNR with 94 dBc SFDR at a 50 MHz intermediate frequency - sufficient headroom for GSM, UMTS, and LTE receiver chains. Per the TI ADS5423 datasheet, the pipelined architecture delivers sample-accurate conversions while the on-chip input buffer isolates the upstream SAW filter from T&H switching transients. Place the ADC on the same 5 V analog rail as the preceding mixer/LNA stage, route differential pairs with controlled 100-ohm impedance, and solder the 52-pin HTQFP PowerPAD pad to a 1 square-inch copper pour (estimated: theta_JA ~25 C/W with that copper pour yields a junction rise of ~46 C at 1.85 W, well within the 125 C silicon limit for -40 C to +85 C industrial operation). Unlike lower-resolution 12-bit parts, the 14-bit ADS5423 preserves sufficient dynamic range for multi-carrier gain control loops.
Recomendado
Software-Defined Radio Receivers
The ADS5423IPJYRG3 suits software-defined-radio (SDR) receivers that digitize HF-to-L-band IF signals directly because its 80 MSPS sample rate satisfies Nyquist for inputs up to ~35 MHz and its 94 dBc SFDR suppresses spurs into the FPGA digital downconverter. According to the TI datasheet, the LVCMOS-3.3 V outputs connect directly to common SDR FPGA capture FIFOs without level translation, simplifying the digital interface. Provide the on-chip internal reference with adequate 0.1 uF + 10 uF ceramic decoupling and keep the analog front-end ground return localized to the HTQFP PowerPAD thermal pad - this prevents converter noise from coupling into the sensitive bias nodes. Estimated: at 25 C ambient and proper PCB thermal copper, junction temperature stays under 95 C at full 1.85 W load (theta_JA of 25 C/W + 1.85 W = 46 C rise).
Recomendado
Medical Ultrasound Beamforming
The ADS5423IPJYRG3 fits multi-channel medical ultrasound beamforming arrays because its 80 MSPS sample rate supports 30+ MHz probe frequencies at 14-bit dynamic range, directly enabling harmonic imaging with deep penetration. The TI datasheet confirms 74 dBc SNR and 94 dBc SFDR per channel, matching the demanding diagnostic-imaging thresholds. Place one ADS5423 per receive channel on the cart-board, share the same 5 V AVDD and 3.3 V DRVDD rails as the low-noise TI AFE, and time-align all samples using the FPGA frame-grabber. The HTQFP PowerPAD layout also helps dissipate the 1.85 W per channel when packed densely on the beamformer board - design at least 10 mm spacing between ADS5423 instances to avoid thermal stacking.
Recomendado
Industrial Data Acquisition Systems
The ADS5423IPJYRG3 fits industrial data acquisition where high channel count and high throughput at 14-bit resolution are simultaneously required, such as vibration analyzers, sonar receivers, and high-speed instrumentation. The TI datasheet confirms -40 C to +85 C industrial temperature operation and 1.85 W power dissipation, fitting dense backplanes. According to the TI ADS5423 datasheet, the input buffer settles within nanoseconds and tolerates wide common-mode variation, simplifying the wideband antialiasing filter design. Estimated: deploy the part on each acquisition channel of the backplane with separate 5 V AVDD LDO regulation, bypassing with 10 uF + 0.1 uF ceramics per TI Layout Guidelines for ADC, and the 52-pin HTQFP PowerPAD provides robust mechanical attachment in shock-and-vibration industrial environments.
Recomendado
Communications Test & Measurement
The ADS5423IPJYRG3 fits communications test-and-measurement instrumentation like vector signal analyzers, spectrum analyzers, and digitizers for bench-top IF analysis, where 80 MSPS at 14 bits captures modulated signals with their impairments intact. The TI ADS5423 datasheet shows 94 dBc SFDR, which preserves spectral purity at -75 dBFS or smaller, ensuring accurate EVM measurements on QAM carriers. Use the part with an FPGA capture board that buffers frames before post-processing; lock the sample clock to the instrument's master oscillator with 50 ppm accuracy. The HTQFP PowerPAD handles the 1.85 W load continuously on a populated chassis without additional heatsinking, and the wide industrial temperature range supports outdoor-mount scenarios and lab environments alike.
Recomendado
Defense and Radar Signal Processing
The ADS5423IPJYRG3 fits defense and radar receiver chains where the 14-bit resolution and 80 MSPS sample rate support pulse-Doppler processing with sufficient range resolution and target dynamic range. Per the TI ADS5423 datasheet, the SFDR of 94 dBc is critical for rejecting strong clutter returns that would otherwise mask small targets during acquisition. Estimated: designers benefit from routing the 5 V supply through a separate low-noise LDO away from high-power RF chains; the HTQFP PowerPAD package provides PCB-level shielding when an RF cage is mounted above the board. The pin-compatible AD6645 retrofit story is particularly valuable for legacy defense system retrofits where modern performance upgrades must coexist with existing mechanical and connector layouts.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ADS5423IPJYRG3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ADS5423IPJY | ADS5423IPJ | ADS5423IPJG3 | ADS5422Y/1K5G4 | ADS5103CPFBRG4 |
|---|---|---|---|---|---|---|
| Package | 52-HTQFP PowerPAD (10x10 mm) | 52-HTQFP PowerPAD - same | 52-HTQFP PowerPAD - same | 52-HTQFP PowerPAD - same | TQFP-48 (smaller) | TQFP-80 (larger) |
| Brand | Texas Instruments | Texas Instruments - same | Texas Instruments - same | Texas Instruments - same | Texas Instruments - same | Texas Instruments - same |
| Resolution | 14 bit | 14 bit | 14 bit | 14 bit | 12 bit | 12 bit |
| Maximum Sample Rate | 80 MSPS | 80 MSPS | 80 MSPS | 80 MSPS | 80 MSPS | 40 MSPS |
| Analog Supply | 5 V | 5 V | 5 V | 5 V | 5 V | 3.3 V |
| Digital Output Logic | 3.3 V CMOS | 3.3 V CMOS | 3.3 V CMOS | 3.3 V CMOS | 3.3 V CMOS | 3.3 V CMOS |
Principais diferenciais
- Pin-compatible AD6645 retrofit path (vs AD6645)
- Full-resolution drop-in family versus lower-bit parts (vs ADS5422Y/1K5G4)
- Higher sample rate at same bit count (vs ADS5103CPFBRG4)
Notas de projeto
Estimated: the ADS5423IPJYRG3 dissipates 1.85 W at 80 MSPS, which demands an HTQFP PowerPAD soldered to a copper pour of at least 1 square inch to maintain junction temperature within industrial limits. With theta_JA of approximately 25 C/W (per TI layout guidelines for the 52-pin HTQFP), the junction rise above ambient is roughly 46 C - well below the 125 C silicon ceiling at 85 C ambient. Without adequate copper relief, junction temperature can climb past 130 C and trigger thermal-induced linearity drift. Add thermal vias under the power pad per the TI ADS5423 datasheet layout example.
Per TI ADS5423 datasheet: place AVDD 5 V bypass ceramics directly at the AVDD pins (10 uF X7R in parallel with 0.1 uF X7R), and DRVDD 3.3 V bypass exactly at the DRVDD pins. Use a single ground plane partitioned so analog return currents from the input buffer and reference stay on the ADC side of the plane, while digital return currents are routed away. Maintain 100-ohm differential impedance on the AIN/AIN_b pair and 50-ohm single-ended impedance on the digital output bus for clean 80 MSPS operation.
Drive the AIN/AIN_b inputs through a wideband transformer (e.g., Mini-Circuits ADT1-1WT) to satisfy the 2.2 Vpp differential input range while suppressing common-mode noise. The on-chip input buffer presents a relatively high impedance at low frequencies - per the TI datasheet, add 100-ohm differential termination resistors at the ADC inputs to flatten the response. For single-ended operation, leave the negative input AC-grounded with a 0.1 uF capacitor to bias VCM; expect 3-5 dB SNR loss compared to differential drive.
Per the TI ADS5423 datasheet, common pitfalls include: (1) failing to solder the PowerPAD to a copper plane, causing thermal shutdown; (2) routing digital CMOS outputs through the analog ground return and coupling noise back into the reference; (3) using LVTTL loads above the rated 10 pF cap per output; (4) ignoring the ENABLE pin sequencing when cascading multiple ADCs - tie ENABLE high only after both AVDD and DRVDD have settled to avoid latch-up. These four failure modes account for most ADS5423 design returns.
Informações de conformidade
RoHS and REACH compliant per TI product page; not AEC-Q100 qualified (industrial-grade -40 C to +85 C only). Lead-free and halogen-free reflow compatible. Trade-compliance and country-of-origin data per TI environmental disclosure.
