ATSAMG55J19A-AU - 120MHz Cortex-M4 MCU 512KB Flash | Microchip
MPN： ATSAMG55J19A-AU ✓ 啟用中ATSAMG55J19A-AU 概覽
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core with an integrated single-precision floating-point unit (FPU), DSP extensions, and a nested vectored interrupt controller. It belongs to the hierarchy: Cortex-M4 -> ARM Cortex-M family -> 32-bit microcontroller (MCU) -> embedded processor -> semiconductor IC. The SAM G55 family specifically targets low-power audio and HMI applications through picoPower technology, integrating a high-performance DSP engine with energy-efficient peripherals suitable for always-on battery-powered devices.
Key features include 512KB embedded Flash for program storage, 160KB SRAM (including 16KB backup SRAM with retention in deep sleep), I2S digital audio interface with sample-rate converter, USB 2.0 Full-Speed device/host, an external bus interface for memory expansion, and an integrated FPU that accelerates floating-point math. The device operates from 1.62V to 3.6V supply, supports -40C to +85C industrial temperature range, and includes multiple low-power modes including deep sleep at less than 7 uA with SRAM retention, waking within 3 us to active execution.
Architecturally, the SAM G55 uses a single-cycle multiplier, hardware divide, and DSP extensions to deliver 1.25 DMIPS/MHz and 1.61 CoreMark/MHz throughput at 120MHz. The Cortex-M4 core is paired with a multi-layer bus matrix and tightly-coupled SRAM, eliminating wait states for most code execution. The audio-grade peripherals include a dedicated I2S controller with PDM and TDM support, enabling direct interfacing with digital MEMS microphones and audio DACs without external glue logic.
Typical applications include Bluetooth/wired audio headsets, industrial HMI panels with touch and display, USB audio devices, smart-home voice front-ends, and portable instrumentation. The combination of FPU-accelerated DSP, low-power audio peripherals, and high-density memory makes it particularly well-suited for audio processing, sensor fusion, and battery-powered edge-compute tasks.
Designers should note that Revision A (this part) is functionally complete but Microchip has transitioned new designs to Revision B ATSAMG55J19B, which provides silicon-level errata fixes; pin-for-pin compatibility between A and B revisions is preserved, so existing PCB layouts do not need to be changed when migrating. Verify long-term availability with your distributor before committing to Revision A in new designs.
This page synthesizes distributor pricing, drop-in cross-reference data, and practical design notes that go beyond the manufacturer datasheet to help engineers select, source, and design with the ATSAMG55J19A-AU efficiently.
直接替換替代品，適用於 ATSAMG55J19A-AU — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAMG55J19A-AU （相同外形與佔位） — 差異在於 Package, Core Architecture, ADC, Audio Interface, Communication Peripherals.
ATSAMG55J19B-AU
✅ 直接替換📋 參考替代品（不在目錄中）
ATSAMG55J19B-AUT
✅ 直接替換聯絡詢價
查看資料表 →ATSAMG55J19A-MU
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAMG53N19A-AU
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAMG55J19A-MUT
✅ 直接替換聯絡詢價
查看資料表 →ATSAMG55J19A-AU 最大額定值與電氣特性
| Core Architecture | ARM Cortex-M4 with FPU |
| Core Clock Speed (max) | 120 MHz |
| Instruction Set | 32-bit RISC + DSP extensions + FPU (single-precision) |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM (Total) | 160 KB |
| Backup SRAM with Retention | 16 KB (retained in deep sleep) |
| Supply Voltage (VDDIO/VDDCORE) | 1.62 V to 3.6 V |
| 工作溫度 | -40 C to +85 C (industrial) |
| 封裝 | 64-LQFP (10x10 mm) |
| Audio Interface | I2S with PDM/TDM and sample-rate converter |
| USB | USB 2.0 Full-Speed device/host |
| ADC | 12-bit SAR |
| Communication Peripherals | USART/UART, SPI, TWI (I2C), I2S, HS USB |
| External Bus Interface (EBI) | Yes (for SRAM/SDRAM/NOR Flash expansion) |
| Active Power Consumption | Down to 100 uA/MHz |
| Deep Sleep Current | Below 7 uA with SRAM retention |
| Wake-up Time (deep sleep to first instruction) | Down to 3 us |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| Lifecycle / New Design Recommendation | Active (new designs: consider ATSAMG55J19B Revision B) |
ATSAMG55J19A-AU 64-lqfp (10x10 mm) 腳位配置指南
ATSAMG55J19A-AU（64-lqfp (10x10 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： ATSAMG55J19A-AU.
請參閱 資料表 以查看完整腳位配置。
典型應用
ATSAMG55J19A-AU 適用於 6 應用s: Bluetooth Audio Headsets, Industrial HMI Panels, USB Audio Peripherals, Smart Home Voice Front-Ends, Portable Test & Measurement, Sensor Fusion Edge Nodes.
Bluetooth Audio Headsets
The ATSAMG55J19A-AU's Cortex-M4F with hardware FPU accelerates SBC, AAC, and proprietary audio codecs while drawing only 100 uA/MHz in active mode. Its integrated I2S controller with PDM support connects directly to digital MEMS microphones and audio DACs, eliminating external audio CODEC ICs. The deep-sleep current below 7 uA with 16KB SRAM retention enables always-on voice wake detection on coin-cell or Li-Ion power, while the 3 us wake-up latency keeps button-press response imperceptible. The USB Full-Speed controller also supports charging-port detection. Together these features target Bluetooth/wired headsets where BOM integration, low power, and DSP throughput directly differentiate the end product.
推薦
Industrial HMI Panels
The ATSAMG55J19A-AU's 512KB Flash and 160KB SRAM are ample for industrial HMI firmware stacks with LVGL or emWin graphics, while the Cortex-M4F executes touch-input and display-refresh tasks with single-precision math for slider/scale interpolation. The 64-LQFP package provides robust industrial-environment mechanical stability for through-hole-friendly mounting where vibration tolerance is required, and the -40C to +85C industrial temperature range covers factory-floor enclosures. USB Full-Speed enables firmware updates and HID touch interfaces, while the EBI can expand to external PSRAM for larger framebuffers. The picoPower modes allow battery-backed HMI panels to retain settings across power cycles.
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USB Audio Peripherals
The ATSAMG55J19A-AU's on-chip USB 2.0 Full-Speed device/host controller with integrated transceiver allows direct USB audio class (UAC1.0) implementation, eliminating external USB PHY chips and reducing BOM. The Cortex-M4F executes asynchronous sample-rate conversion, mixers, and DSP effects (EQ, compressor, reverb) while the I2S peripheral streams to an external audio DAC. USB Full-Speed 12Mbps is sufficient for stereo 48kHz/24-bit audio and mono 96kHz paths. USB suspend/resume states map cleanly to the picoPower deep-sleep modes, allowing bus-powered peripherals to meet USB-IF suspend-current budgets without external power gating.
推薦
Smart Home Voice Front-Ends
The ATSAMG55J19A-AU's I2S controller with PDM support can directly sample 2-4 digital MEMS microphones for beamforming and noise suppression. The Cortex-M4F accelerates front-end DSP like AEC (acoustic echo cancellation) and NS (noise suppression) at low latency, while the FPU handles floating-point filter coefficients without integer-overflow artifacts. Deep-sleep below 7 uA with 16KB retention supports always-on voice-wake designs that only wake the main processor on keyword detection. The compact 64-LQFP and minimal external component count (no external PHY, no external audio CODEC) help fit voice-front-end PCBs into wall-switch or thermostat form factors.
推薦
Portable Test & Measurement
The ATSAMG55J19A-AU delivers 120MHz Cortex-M4F throughput in a compact 64-LQFP, suitable for handheld multimeters, oscilloscope probes, and data loggers that need DSP processing of sensor signals on the fly. The 12-bit SAR ADC samples at up to 1Msps, sufficient for vibration, audio-band, and current-sensing measurements, while the FPU runs RMS, FFT, and digital-filter math with single-cycle throughput. USB Full-Speed enables data download to a host PC, and the deep-sleep modes stretch battery life to weeks. The 1.62-3.6V supply accepts Li-Ion cells directly, and the industrial temperature range supports outdoor measurement environments.
推薦
Sensor Fusion Edge Nodes
The ATSAMG55J19A-AU's Cortex-M4F runs sensor fusion algorithms like Madgwick or Mahony quaternion filters at low latency, fusing 6/9-axis IMU data and producing orientation estimates for robotics, drones, and wearables. The 160KB SRAM holds sensor buffers and intermediate filter state without external memory, while the 512KB Flash fits BLE stacks, RTOS, and application firmware. Multiple SPI/I2C instances allow direct connection to IMUs, magnetometers, and pressure sensors. Deep-sleep modes below 7 uA suit battery-powered wearables, and USB Full-Speed supports wired debug and firmware update over the same connector used for charging.
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推薦產品摘要
工程參考資料，適用於 ATSAMG55J19A-AU — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAMG55J19B-AU | ATSAMG55J19B-AUT | ATSAMG55J19A-MUT | ATSAMG53N19A-AU | ATSAMG55J19A-MU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP - same family | 64-LQFP - same footprint |
| Core | ARM Cortex-M4F (with FPU) | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4 (no FPU) | ARM Cortex-M4F |
| Max Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 96 KB | 160 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| USB | USB 2.0 Full-Speed device/host | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Audio Interface | I2S with PDM/TDM | I2S with PDM/TDM | I2S with PDM/TDM | I2S with PDM/TDM | I2S (no PDM) | I2S with PDM/TDM |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
主要差異化特點
- Higher SRAM than ATSAMG53N19A-AU (對比ATSAMG53N19A-AU)
- Revision B with silicon errata fixes (對比ATSAMG55J19B-AU)
- FPU on chip (對比ATSAMG53N19A-AU)
設計說明
Decouple VDDIO and VDDCORE with 100nF ceramic capacitors placed within 5mm of each supply pin, plus a 4.7uF bulk capacitor on the main VDDIO rail. The SAM G55 integrates a 1.2V core LDO from VDDIO; when running at 120MHz with all peripherals active, expect up to 60mA peak current on VDDIO, so size the source regulator accordingly. Place a ferrite bead or small ferrite between VDDIO and the analog AVVDD rail if the ADC is sampling high-impedance sensors to avoid digital-noise coupling.
Route the 32.768kHz crystal traces within 5mm of the XIN32/XOUT32 pins, guard them with a ground ring, and keep them short and matched in length. For the high-speed 12MHz main crystal, place load capacitors within 2mm of XIN/XOUT. The USB D+/D- differential pair should be routed 90-ohm differential impedance with length-matched traces and a common-mode choke near the connector for ESD/burst protection. The SWDIO/SWCLK debug lines should be routed with adjacent ground pour to avoid noise-induced debug failures in production.
Estimated: at 120MHz active, 3.3V VDDIO, and full peripheral clock tree, the SAM G55 draws approximately 60-80mA peak. If your 3.3V regulator is sized for 50mA, voltage droop will trigger brown-out resets under DSP load. Verify regulator current rating with margin. Do not enable the I2S peripheral without first configuring its clock source in PMC - the SAM G55 I2S clock root must be enabled before peripheral enable, otherwise peripheral access faults occur. For deep-sleep wake-up designs, the 16KB backup SRAM is the only SRAM retained across deep sleep; do not place wake-time state in the main 144KB SRAM region or it will be lost.
合規資訊
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - this part targets industrial/consumer audio and HMI applications, not automotive. For automotive designs use AEC-Q100-qualified SAM V71/V70 or SAMA5D2 series instead.
