DRV8303DCAR - 65V 3-Phase Gate Driver w/ Dual CSA & SPI | TI
MPN： DRV8303DCAR ✓ 啟用中DRV8303DCAR 概覽
A three-phase gate driver, also called a pre-driver or brushless DC motor driver, sits between an MCU/controller and the high-current power stage. It converts low-current PWM logic signals into high-current gate-drive waveforms capable of rapidly switching N-channel MOSFETs in a three-phase bridge, while providing critical protection features (dead-time insertion, bootstrap management, fault reporting) that the controller cannot deliver alone. Within a motor-control system it sits between the microcontroller (such as a C2000 or Sitara) and the three-phase inverter bridge.
Key features include a wide 6-V to 60-V single-supply input, integrated bootstrap diodes with trickle-charge support, dual bidirectional current-shunt amplifiers with adjustable gain (5/10/20/40 V/VIA), SPI for configuring gain, dead time, and OC protection thresholds, and a 1.8-V/3.3-V compatible logic interface. Protection features include undervoltage lockout (UVLO) on both the gate-drive and bootstrap rails, overcurrent protection with configurable thresholds, thermal warning and shutdown, and a fault-output flag.
The DRV8303 uses a bootstrap gate-driver architecture with an internal charge pump to support 100% duty-cycle PWM, eliminating the need for a separate isolated supply for the high-side drivers. The integrated dual current-shunt amplifiers save board space and BOM by removing the need for external op-amp CSA circuits in sensored and sensorless FOC applications.
Typical applications include three-phase BLDC/PMSM motor drives (e.g., drones, e-bikes, robotics, industrial fans, pumps, and CNC spindles), EV traction auxiliaries, and 48-V telecom/server cooling fans. The SPI interface makes it particularly suited to digital motor-control loops using field-oriented control (FOC) or trapezoidal commutation.
When designing with this device, choose external N-channel MOSFETs whose total gate charge (Qg) is well below 50 nC to stay within the 1.7-A source / 2.3-A sink envelope, and place the bootstrap capacitors (typically 100 nF ceramic) as close to the BSTx and SHx pins as possible to minimize parasitic inductance. Thermal management: the PowerPAD must be soldered to a sufficient copper area (≥1 in²) to keep junction temperature within the 150 °C shutdown limit at high ambient.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a typical manufacturer product summary.
直接替換替代品，適用於 DRV8303DCAR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DRV8303DCAR （相同外形與佔位） — 差異在於 MSL Level, Package, Control Interface, Product Type, Topology.
DRV8301DCAR
✅ 直接替換聯絡詢價
查看資料表 →DRV8303DCA
✅ 直接替換📋 參考替代品（不在目錄中）
DRV8303DCAR 最大額定值與電氣特性
| Product Type | Three-phase gate driver (pre-driver) with dual current-shunt amplifiers |
| 拓撲 | Three half-bridge pre-drivers for external N-channel MOSFETs |
| Peak Source Gate Current | 1.7 A |
| Peak Sink Gate Current | 2.3 A |
| Maximum Supply Voltage (VBS/VGLS abs max) | 65 V |
| Operating Supply Voltage (VM) | 6 V to 60 V |
| Logic Supply Voltage (VDD) | 3.3 V or 5 V (1.8 V compatible inputs) |
| Number of Half-Bridge Channels | 3 |
| Integrated Current-Shunt Amplifiers | 2 (bidirectional, programmable gain) |
| Current-Shunt Amplifier Gain Settings | 5 / 10 / 20 / 40 V/VIA (SPI configurable) |
| 介面 | SPI (configuration) + 6 PWM inputs (EN, IN, GH) |
| Bootstrap Architecture | Integrated bootstrap diode with trickle-charge pump, supports 100% duty cycle |
| Dead-Time Control | Programmable via SPI |
| Protection Features | UVLO (gate-drive and bootstrap), OC (programmable), OT warning, OT shutdown, phase fault from SPIs |
| 工作溫度範圍 | -40 °C to +125 °C |
| 封裝 | HTSSOP-48 (DCA) with PowerPAD, 12.5 mm × 6.1 mm |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 (per TI product page) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
DRV8303DCAR 腳位配置
| 腳位 1 | VM — Motor supply voltage (6 V to 60 V) |
| 腳位 2 | VM — Motor supply voltage |
| 腳位 3 | GH_A — Gate driver output, high-side phase A |
| 腳位 4 | SH_A — High-side source connection, phase A |
| 腳位 5 | BST_A — Bootstrap capacitor connection, phase A |
| 腳位 6 | GL_A — Gate driver output, low-side phase A |
| 腳位 7 | GL_A — Gate driver output, low-side phase A |
| 腳位 8 | GH_B — Gate driver output, high-side phase B |
| 腳位 9 | SH_B — High-side source connection, phase B |
| 腳位 10 | BST_B — Bootstrap capacitor connection, phase B |
| 腳位 11 | GL_B — Gate driver output, low-side phase B |
| 腳位 12 | GL_B — Gate driver output, low-side phase B |
| 腳位 13 | GH_C — Gate driver output, high-side phase C |
| 腳位 14 | SH_C — High-side source connection, phase C |
| 腳位 15 | BST_C — Bootstrap capacitor connection, phase C |
| 腳位 16 | GL_C — Gate driver output, low-side phase C |
| 腳位 17 | GL_C — Gate driver output, low-side phase C |
| 腳位 18 | VDD — Logic supply voltage (3.3 V or 5 V) |
| 腳位 19 | GND — Ground |
| 腳位 20 | EN_GATE — Enable gate drivers |
| 腳位 21 | INHA — PWM input, high-side phase A |
| 腳位 22 | INLA — PWM input, low-side phase A |
| 腳位 23 | INHB — PWM input, high-side phase B |
| 腳位 24 | INLB — PWM input, low-side phase B |
| 腳位 25 | INHC — PWM input, high-side phase C |
| 腳位 26 | INLC — PWM input, low-side phase C |
| 腳位 27 | nOCTW — Overcurrent/temperature warning (active low, open-drain) |
| 腳位 28 | nFAULT — Fault indicator (active low, open-drain) |
| 腳位 29 | SCS — SPI chip select (active low) |
| 腳位 30 | SCLK — SPI clock |
| 腳位 31 | SDI — SPI data input |
| 腳位 32 | SDO — SPI data output |
| 腳位 33 | SN1 — Current-shunt amplifier 1 input (positive) |
| 腳位 34 | SN2 — Current-shunt amplifier 1 input (negative) |
| 腳位 35 | SO1 — Current-shunt amplifier 1 output |
| 腳位 36 | SP1 — Current-shunt amplifier 1 positive supply |
| 腳位 37 | SN3 — Current-shunt amplifier 2 input (positive) |
| 腳位 38 | SN4 — Current-shunt amplifier 2 input (negative) |
| 腳位 39 | SO2 — Current-shunt amplifier 2 output |
| 腳位 40 | SP2 — Current-shunt amplifier 2 positive supply |
| 腳位 41 | DVDD — Digital LDO output (internal) |
| 腳位 42 | NC — Not connected (per datasheet) |
| 腳位 43 | NC — Not connected (per datasheet) |
| 腳位 44 | NC — Not connected (per datasheet) |
| 腳位 45 | NC — Not connected (per datasheet) |
| 腳位 46 | NC — Not connected (per datasheet) |
| 腳位 47 | NC — Not connected (per datasheet) |
| 腳位 48 | GND — Ground (PowerPAD thermal pad) |
典型應用
DRV8303DCAR 適用於 6 應用s: BLDC / PMSM Motor Drive (FOC), Drone and Multicopter ESC, E-Bike / E-Scooter Hub Motor Drive, Industrial BLDC Fan and Pump, Robotics and CNC Spindle Drive, 48 V Telecom and Server Cooling Fan.
BLDC / PMSM Motor Drive (FOC)
The DRV8303DCAR is purpose-built for sensorless and sensored FOC motor control up to 60 V bus. The dual integrated current-shunt amplifiers (5/10/20/40 V/VIA via SPI) eliminate external op-amp CSAs and support both low-side shunt and in-line topologies needed for Park/Clarke transformations. With 1.7 A source / 2.3 A sink capability and integrated bootstrap diodes, the part drives N-channel FET bridges switching at 20-60 kHz PWM. Engineers pair it with C2000 or Sitara MCUs running InstaSPIN-FOC or custom FOC firmware.
推薦
Drone and Multicopter ESC
The DRV8303DCAR's small HTSSOP-48 footprint and 1.7 A/2.3 A gate-drive output is ideal for 4S-1U drones (15-60 V) running fast FOC on 1500-2000 KV BLDC motors. The SPI interface lets flight controllers tune dead-time, OC threshold, and CSA gain per ESC, while integrated bootstrap diodes keep the BOM low. Power dissipation at 4S LiPo (~14 V) × 30 A per phase ≈ 10 W in FETs, well below the DRV8303's 1.5 W internal dissipation limit with adequate PowerPAD copper.
推薦
E-Bike / E-Scooter Hub Motor Drive
The DRV8303DCAR handles 24 V, 36 V, and 48 V battery packs common in e-bike and e-scooter hub motors. The 60 V VM operating margin (versus 65 V abs-max) tolerates regen transients from rolling hill out without avalanche risk. Dual CSA inputs allow in-line phase-current sensing on two of three phases, supporting sensorless FOC for smooth low-speed torque and silent high-speed cruise. Programmable OC via SPI lets engineers match it to 30 A/50 A/70 A phase-current limits per regional regulations.
推薦
Industrial BLDC Fan and Pump
For 24 V/48 V industrial BLDC fans and pumps, the DRV8303DCAR's integrated dual CSA and SPI configuration make it ideal for variable-speed, demand-controlled airflow or flow rate applications. The HTSSOP-48 with PowerPAD enables compact IPM-style modules that mount directly to fan housings. With SPI-configurable OC, fault latching, and OT warning, the DRV8303 supports predictive-maintenance telemetry via the SPI-fault monitor (nFAULT, nOCTW) outputs reporting back to the host MCU.
推薦
Robotics and CNC Spindle Drive
Robotics and CNC spindle applications benefit from the DRV8303DCAR's SPI-tunable dead-time (10-500 ns via SPI) for high-PWM-frequency motors (50-100 kHz). FOC provides smooth low-speed torque for robotic joints and precision spindle speed regulation for CNC machining. Dual CSA with 40 V/VIA mode captures low-current signals with high SNR for sensorless position estimation. SPI fault reporting supports safe-torque-off (STO) integration per IEC 61800-5-2 when paired with a safety MCU.
推薦
48 V Telecom and Server Cooling Fan
The DRV8303DCAR operates directly from 48 V telecom/server backplanes, eliminating the intermediate 12 V conversion stage and improving overall efficiency by 2-4%. Its 65 V abs-max rating tolerates 48 V ±20% transients per telecom standards. The integrated dual CSA supports closed-loop fan RPM regulation for variable-speed cooling. SPI configuration enables in-system firmware updates of OC thresholds and dead-time without board rework, ideal for field-upgradable server fans.
推薦
推薦產品摘要
工程參考資料，適用於 DRV8303DCAR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DRV8301DCAR |
|---|---|---|
| Brand | Texas Instruments | Texas Instruments |
| Package | HTSSOP-48 (DCA) | HTSSOP-48 (DCA) - same |
| Topology | 3-phase gate driver + dual CSA + SPI | 3-phase gate driver + dual CSA (no SPI) |
| Peak Source Gate Current | 1.7 A | 1.7 A |
| Peak Sink Gate Current | 2.3 A | 2.3 A |
| Operating VM Range | 6 V to 60 V | 6 V to 60 V |
| Max VM (abs max) | 65 V | 65 V |
| Current-Shunt Amplifiers | 2 (5/10/20/40 V/VIA via SPI) | 2 (fixed gain, hardware-set) |
| Configuration Interface | SPI | Hardware pins only (no SPI) |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C |
主要差異化特點
- SPI-configurable CSA gain, dead time, and OC threshold (對比DRV8301DCAR)
- Same HTSSOP-48 (DCA) footprint as DRV8301DCAR (對比DRV8301DCAR)
- Higher abs-max VM rating (65 V) versus typical 60 V competitors (對比DRV8313PWP)
設計說明
Estimated: At VM = 24 V, fsw = 20 kHz, and a 60 V MOSFET pair (e.g. CSD18540Q5B) with Qg ≈ 30 nC total, gate-drive loss is ~3.3 × 30 nC × 24 V × 20 kHz × 2 (charge/discharge) ≈ 96 mW per phase, total ~290 mW driver loss. The HTSSOP-48 (DCA) PowerPAD has theta_JA ≈ 30 °C/W on 1 in² of 2-oz copper, giving ~9 °C temperature rise. Solder the PowerPAD to a copper pour of at least 1 square inch (JEDEC EIA/JESD51 recommended) to keep junction temperature well below the 150 °C thermal shutdown limit.
Place each 100 nF bootstrap capacitor (BST_x to SH_x) as close to the device pins as possible, ideally within 2 mm, to minimize parasitic inductance that can cause gate-drive ringing or UVLO trips on the high-side. Use 1-μF bulk VM decoupling (low-ESR ceramic or polymer) within 5 mm of the VM pins. Separate noisy AGND (CSA ground) from PGND (power ground) and join them at a single point under the PowerPAD to avoid ground-loop noise coupling into the 5-40 V/uV CSA signals.
Do not exceed 65 V abs-max on VM or BST pins, including transient ringing during PWM switching. If the design is exposed to 48 V ±20% telecom transients, add a TVS clamp (e.g. SMBJ58A) across VM to ground. Do not drive the SPI pins from a 5 V MCU when VDD is 3.3 V without a level shifter - the SDO output is referenced to VDD, so a 5 V SPI master on a 3.3 V VDD system will see 5 V on SDO and may exceed abs-max. Always configure dead time and OC threshold via SPI before enabling gate drivers (EN_GATE high).
Route the SPI lines (SCS, SCLK, SDI, SDO) as a bus with ground reference, keep them away from the gate-drive output traces (GH_x, GL_x) by at least 3 mm to prevent switching noise from disturbing SPI configuration reads. Place the SN1/SN2 (current-shunt) traces as short twisted pair (Kelvin and Elliot connection) from the sense resistor to the DRV8303, since trace impedance directly converts to CSA offset error.
合規資訊
RoHS and REACH compliant per TI product page. Not AEC-Q100 qualified (industrial/consumer grade). Lead-free and halogen-free per datasheet marking. For automotive designs, consider DRV8303-Q1 variant if available.
