DRV8303DCAR - 65V 3-Phase Gate Driver w/ Dual CSA & SPI | TI
Teilenummer: DRV8303DCAR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.84 | $68,40 |
| 100 | $5.49 | $549,00 |
| 500 | $4.61 | $2.305,00 |
| 1.000 | $3.95 | $3.950,00 |
DRV8303DCAR Übersicht
A three-phase gate driver, also called a pre-driver or brushless DC motor driver, sits between an MCU/controller and the high-current power stage. It converts low-current PWM logic signals into high-current gate-drive waveforms capable of rapidly switching N-channel MOSFETs in a three-phase bridge, while providing critical protection features (dead-time insertion, bootstrap management, fault reporting) that the controller cannot deliver alone. Within a motor-control system it sits between the microcontroller (such as a C2000 or Sitara) and the three-phase inverter bridge.
Key features include a wide 6-V to 60-V single-supply input, integrated bootstrap diodes with trickle-charge support, dual bidirectional current-shunt amplifiers with adjustable gain (5/10/20/40 V/VIA), SPI for configuring gain, dead time, and OC protection thresholds, and a 1.8-V/3.3-V compatible logic interface. Protection features include undervoltage lockout (UVLO) on both the gate-drive and bootstrap rails, overcurrent protection with configurable thresholds, thermal warning and shutdown, and a fault-output flag.
The DRV8303 uses a bootstrap gate-driver architecture with an internal charge pump to support 100% duty-cycle PWM, eliminating the need for a separate isolated supply for the high-side drivers. The integrated dual current-shunt amplifiers save board space and BOM by removing the need for external op-amp CSA circuits in sensored and sensorless FOC applications.
Typical applications include three-phase BLDC/PMSM motor drives (e.g., drones, e-bikes, robotics, industrial fans, pumps, and CNC spindles), EV traction auxiliaries, and 48-V telecom/server cooling fans. The SPI interface makes it particularly suited to digital motor-control loops using field-oriented control (FOC) or trapezoidal commutation.
When designing with this device, choose external N-channel MOSFETs whose total gate charge (Qg) is well below 50 nC to stay within the 1.7-A source / 2.3-A sink envelope, and place the bootstrap capacitors (typically 100 nF ceramic) as close to the BSTx and SHx pins as possible to minimize parasitic inductance. Thermal management: the PowerPAD must be soldered to a sufficient copper area (≥1 in²) to keep junction temperature within the 150 °C shutdown limit at high ambient.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a typical manufacturer product summary.
Drop-in-Alternativen für DRV8303DCAR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DRV8303DCAR (gleiche Bauform und Footprint) – abweichend in MSL Level, Package, Control Interface, Product Type, Topology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DRV8301DCAR
✅ Drop-In✓ Auf Lager
$4.1 / Stück
Datenblatt ansehen →DRV8303DCA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DRV8303DCAR Grenzwerte & elektrische Eigenschaften
| Product Type | Three-phase gate driver (pre-driver) with dual current-shunt amplifiers |
| Topologie | Three half-bridge pre-drivers for external N-channel MOSFETs |
| Peak Source Gate Current | 1.7 A |
| Peak Sink Gate Current | 2.3 A |
| Maximum Supply Voltage (VBS/VGLS abs max) | 65 V |
| Operating Supply Voltage (VM) | 6 V to 60 V |
| Logic Supply Voltage (VDD) | 3.3 V or 5 V (1.8 V compatible inputs) |
| Number of Half-Bridge Channels | 3 |
| Integrated Current-Shunt Amplifiers | 2 (bidirectional, programmable gain) |
| Current-Shunt Amplifier Gain Settings | 5 / 10 / 20 / 40 V/VIA (SPI configurable) |
| Schnittstelle | SPI (configuration) + 6 PWM inputs (EN, IN, GH) |
| Bootstrap Architecture | Integrated bootstrap diode with trickle-charge pump, supports 100% duty cycle |
| Dead-Time Control | Programmable via SPI |
| Protection Features | UVLO (gate-drive and bootstrap), OC (programmable), OT warning, OT shutdown, phase fault from SPIs |
| Betriebstemperaturbereich | -40 °C to +125 °C |
| Gehäuse | HTSSOP-48 (DCA) with PowerPAD, 12.5 mm × 6.1 mm |
| Montageart | Surface Mount |
| MSL-Level | 3 (per TI product page) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
DRV8303DCAR Pin-Konfiguration
| Pin 1 | VM — Motor supply voltage (6 V to 60 V) |
| Pin 2 | VM — Motor supply voltage |
| Pin 3 | GH_A — Gate driver output, high-side phase A |
| Pin 4 | SH_A — High-side source connection, phase A |
| Pin 5 | BST_A — Bootstrap capacitor connection, phase A |
| Pin 6 | GL_A — Gate driver output, low-side phase A |
| Pin 7 | GL_A — Gate driver output, low-side phase A |
| Pin 8 | GH_B — Gate driver output, high-side phase B |
| Pin 9 | SH_B — High-side source connection, phase B |
| Pin 10 | BST_B — Bootstrap capacitor connection, phase B |
| Pin 11 | GL_B — Gate driver output, low-side phase B |
| Pin 12 | GL_B — Gate driver output, low-side phase B |
| Pin 13 | GH_C — Gate driver output, high-side phase C |
| Pin 14 | SH_C — High-side source connection, phase C |
| Pin 15 | BST_C — Bootstrap capacitor connection, phase C |
| Pin 16 | GL_C — Gate driver output, low-side phase C |
| Pin 17 | GL_C — Gate driver output, low-side phase C |
| Pin 18 | VDD — Logic supply voltage (3.3 V or 5 V) |
| Pin 19 | GND — Ground |
| Pin 20 | EN_GATE — Enable gate drivers |
| Pin 21 | INHA — PWM input, high-side phase A |
| Pin 22 | INLA — PWM input, low-side phase A |
| Pin 23 | INHB — PWM input, high-side phase B |
| Pin 24 | INLB — PWM input, low-side phase B |
| Pin 25 | INHC — PWM input, high-side phase C |
| Pin 26 | INLC — PWM input, low-side phase C |
| Pin 27 | nOCTW — Overcurrent/temperature warning (active low, open-drain) |
| Pin 28 | nFAULT — Fault indicator (active low, open-drain) |
| Pin 29 | SCS — SPI chip select (active low) |
| Pin 30 | SCLK — SPI clock |
| Pin 31 | SDI — SPI data input |
| Pin 32 | SDO — SPI data output |
| Pin 33 | SN1 — Current-shunt amplifier 1 input (positive) |
| Pin 34 | SN2 — Current-shunt amplifier 1 input (negative) |
| Pin 35 | SO1 — Current-shunt amplifier 1 output |
| Pin 36 | SP1 — Current-shunt amplifier 1 positive supply |
| Pin 37 | SN3 — Current-shunt amplifier 2 input (positive) |
| Pin 38 | SN4 — Current-shunt amplifier 2 input (negative) |
| Pin 39 | SO2 — Current-shunt amplifier 2 output |
| Pin 40 | SP2 — Current-shunt amplifier 2 positive supply |
| Pin 41 | DVDD — Digital LDO output (internal) |
| Pin 42 | NC — Not connected (per datasheet) |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | NC — Not connected (per datasheet) |
| Pin 46 | NC — Not connected (per datasheet) |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | GND — Ground (PowerPAD thermal pad) |
Typische Anwendungen
DRV8303DCAR ist geeignet für 6 Anwendungs: BLDC / PMSM Motor Drive (FOC), Drone and Multicopter ESC, E-Bike / E-Scooter Hub Motor Drive, Industrial BLDC Fan and Pump, Robotics and CNC Spindle Drive, 48 V Telecom and Server Cooling Fan.
BLDC / PMSM Motor Drive (FOC)
The DRV8303DCAR is purpose-built for sensorless and sensored FOC motor control up to 60 V bus. The dual integrated current-shunt amplifiers (5/10/20/40 V/VIA via SPI) eliminate external op-amp CSAs and support both low-side shunt and in-line topologies needed for Park/Clarke transformations. With 1.7 A source / 2.3 A sink capability and integrated bootstrap diodes, the part drives N-channel FET bridges switching at 20-60 kHz PWM. Engineers pair it with C2000 or Sitara MCUs running InstaSPIN-FOC or custom FOC firmware.
Empfohlen
Drone and Multicopter ESC
The DRV8303DCAR's small HTSSOP-48 footprint and 1.7 A/2.3 A gate-drive output is ideal for 4S-1U drones (15-60 V) running fast FOC on 1500-2000 KV BLDC motors. The SPI interface lets flight controllers tune dead-time, OC threshold, and CSA gain per ESC, while integrated bootstrap diodes keep the BOM low. Power dissipation at 4S LiPo (~14 V) × 30 A per phase ≈ 10 W in FETs, well below the DRV8303's 1.5 W internal dissipation limit with adequate PowerPAD copper.
Empfohlen
E-Bike / E-Scooter Hub Motor Drive
The DRV8303DCAR handles 24 V, 36 V, and 48 V battery packs common in e-bike and e-scooter hub motors. The 60 V VM operating margin (versus 65 V abs-max) tolerates regen transients from rolling hill out without avalanche risk. Dual CSA inputs allow in-line phase-current sensing on two of three phases, supporting sensorless FOC for smooth low-speed torque and silent high-speed cruise. Programmable OC via SPI lets engineers match it to 30 A/50 A/70 A phase-current limits per regional regulations.
Empfohlen
Industrial BLDC Fan and Pump
For 24 V/48 V industrial BLDC fans and pumps, the DRV8303DCAR's integrated dual CSA and SPI configuration make it ideal for variable-speed, demand-controlled airflow or flow rate applications. The HTSSOP-48 with PowerPAD enables compact IPM-style modules that mount directly to fan housings. With SPI-configurable OC, fault latching, and OT warning, the DRV8303 supports predictive-maintenance telemetry via the SPI-fault monitor (nFAULT, nOCTW) outputs reporting back to the host MCU.
Empfohlen
Robotics and CNC Spindle Drive
Robotics and CNC spindle applications benefit from the DRV8303DCAR's SPI-tunable dead-time (10-500 ns via SPI) for high-PWM-frequency motors (50-100 kHz). FOC provides smooth low-speed torque for robotic joints and precision spindle speed regulation for CNC machining. Dual CSA with 40 V/VIA mode captures low-current signals with high SNR for sensorless position estimation. SPI fault reporting supports safe-torque-off (STO) integration per IEC 61800-5-2 when paired with a safety MCU.
Empfohlen
48 V Telecom and Server Cooling Fan
The DRV8303DCAR operates directly from 48 V telecom/server backplanes, eliminating the intermediate 12 V conversion stage and improving overall efficiency by 2-4%. Its 65 V abs-max rating tolerates 48 V ±20% transients per telecom standards. The integrated dual CSA supports closed-loop fan RPM regulation for variable-speed cooling. SPI configuration enables in-system firmware updates of OC thresholds and dead-time without board rework, ideal for field-upgradable server fans.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DRV8303DCAR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DRV8301DCAR |
|---|---|---|
| Brand | Texas Instruments | Texas Instruments |
| Package | HTSSOP-48 (DCA) | HTSSOP-48 (DCA) - same |
| Topology | 3-phase gate driver + dual CSA + SPI | 3-phase gate driver + dual CSA (no SPI) |
| Peak Source Gate Current | 1.7 A | 1.7 A |
| Peak Sink Gate Current | 2.3 A | 2.3 A |
| Operating VM Range | 6 V to 60 V | 6 V to 60 V |
| Max VM (abs max) | 65 V | 65 V |
| Current-Shunt Amplifiers | 2 (5/10/20/40 V/VIA via SPI) | 2 (fixed gain, hardware-set) |
| Configuration Interface | SPI | Hardware pins only (no SPI) |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C |
Wichtigste Unterscheidungsmerkmale
- SPI-configurable CSA gain, dead time, and OC threshold (vs. DRV8301DCAR)
- Same HTSSOP-48 (DCA) footprint as DRV8301DCAR (vs. DRV8301DCAR)
- Higher abs-max VM rating (65 V) versus typical 60 V competitors (vs. DRV8313PWP)
Designhinweise
Estimated: At VM = 24 V, fsw = 20 kHz, and a 60 V MOSFET pair (e.g. CSD18540Q5B) with Qg ≈ 30 nC total, gate-drive loss is ~3.3 × 30 nC × 24 V × 20 kHz × 2 (charge/discharge) ≈ 96 mW per phase, total ~290 mW driver loss. The HTSSOP-48 (DCA) PowerPAD has theta_JA ≈ 30 °C/W on 1 in² of 2-oz copper, giving ~9 °C temperature rise. Solder the PowerPAD to a copper pour of at least 1 square inch (JEDEC EIA/JESD51 recommended) to keep junction temperature well below the 150 °C thermal shutdown limit.
Place each 100 nF bootstrap capacitor (BST_x to SH_x) as close to the device pins as possible, ideally within 2 mm, to minimize parasitic inductance that can cause gate-drive ringing or UVLO trips on the high-side. Use 1-μF bulk VM decoupling (low-ESR ceramic or polymer) within 5 mm of the VM pins. Separate noisy AGND (CSA ground) from PGND (power ground) and join them at a single point under the PowerPAD to avoid ground-loop noise coupling into the 5-40 V/uV CSA signals.
Do not exceed 65 V abs-max on VM or BST pins, including transient ringing during PWM switching. If the design is exposed to 48 V ±20% telecom transients, add a TVS clamp (e.g. SMBJ58A) across VM to ground. Do not drive the SPI pins from a 5 V MCU when VDD is 3.3 V without a level shifter - the SDO output is referenced to VDD, so a 5 V SPI master on a 3.3 V VDD system will see 5 V on SDO and may exceed abs-max. Always configure dead time and OC threshold via SPI before enabling gate drivers (EN_GATE high).
Route the SPI lines (SCS, SCLK, SDI, SDO) as a bus with ground reference, keep them away from the gate-drive output traces (GH_x, GL_x) by at least 3 mm to prevent switching noise from disturbing SPI configuration reads. Place the SN1/SN2 (current-shunt) traces as short twisted pair (Kelvin and Elliot connection) from the sense resistor to the DRV8303, since trace impedance directly converts to CSA offset error.
Compliance-Informationen
RoHS and REACH compliant per TI product page. Not AEC-Q100 qualified (industrial/consumer grade). Lead-free and halogen-free per datasheet marking. For automotive designs, consider DRV8303-Q1 variant if available.
