DSPA56371AF180 - 24-bit Audio DSP, 180MHz, 80-LQFP | NXP
MPN： DSPA56371AF180 ✓ 啟用中DSPA56371AF180 概覽
An audio DSP (Digital Signal Processor) is a specialized microprocessor optimized for high-speed numeric computation on continuous streams of audio samples. Audio DSPs sit beneath the broader hierarchy: DSP -> microprocessor -> integrated circuit -> semiconductor. Unlike general-purpose MCUs, audio DSPs use Harvard architectures, hardware MAC units, and deterministic instruction cycles to perform real-time decoding, mixing, and bass management without jitter or audible artifacts.
Key features of the DSPA56371AF180 include 180 MIPS sustained throughput, integrated memory (ROM-masked firmware variant denoted by the 'A' suffix), hardware accelerated audio peripherals, and dedicated host and serial audio interfaces. The 180 MHz clock enables simultaneous multichannel decoding (e.g., 7.1 surround) plus post-processing while leaving headroom for proprietary algorithms. The 'AF' suffix indicates the 180 MHz speed grade and the Freescale/NXP automotive pedigree.
Architecturally, the DSPA56371AF180 uses the DSP56300 core with parallel multiply-accumulate (MAC) units, dual-memory architecture (X and Y data, program memory), and a rich instruction set including fractional arithmetic. Compared to the earlier DSP56000 family, the DSP56300 adds enhanced DMA, larger on-chip memory, and improved peripherals for consumer audio. This combination delivers deterministic low-latency processing essential for lip-sync accuracy in AV receivers.
Typical applications include AV receivers and home theaters, surround-sound decoders (Dolby Digital, DTS, THX), digital TV audio subsystems, mini-stereo systems, and automotive head units and infotainment audio. The Symphony firmware library integrated in masked-ROM variants enables rapid time-to-market for OEMs licensing certified decoders.
When designing with this part, allocate sufficient PCB copper to the exposed pad (if present) and ensure clean 3.3V power with low-ESR decoupling to avoid jitter. Verify firmware revision compatibility between masked-ROM parts and external host MCU firmware before committing to production.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes for the DSPA56371AF180 not found in any single manufacturer datasheet or distributor page.
直接替換替代品，適用於 DSPA56371AF180 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DSPA56371AF180 （相同外形與佔位） — 差異在於 Core Architecture, Lifecycle Status, Maximum Clock Frequency, Package, Package Code.
DSPB56371AF180
✅ 直接替換聯絡詢價
查看資料表 →DSPB56374AFC
✅ 直接替換聯絡詢價
查看資料表 →DSPB56721AF
✅ 直接替換📋 參考替代品（不在目錄中）
DSPA56371AF180 規格
| Product Type | Audio Digital Signal Processor (DSP) |
| Core Architecture | DSP56300 (24-bit fixed-point) |
| Core Clock Speed | 180 MHz |
| Throughput | 180 MIPS |
| Data Width | 24-bit |
| Instruction Word Width | 24-bit |
| 封裝 | 80-pin LQFP (LQFP-80) |
| Terminal Form | Gull Wing |
| 安裝類型 | Surface Mount |
| Package Code | QFP |
| Package Shape | Square |
| Peak Reflow Temperature | 260 C |
| RoHS 狀態 | Compliant |
| Firmware Variant | Masked-ROM Symphony audio (A suffix) |
| Speed Grade | AF (180 MHz) |
DSPA56371AF180 腳位配置
| 腳位 1 | VDD — 3.3V I/O supply |
| 腳位 2 | VCC — 1.6V core supply (internal LDO input) |
| 腳位 3 | GND — Ground |
| 腳位 4 | MODA |
| 腳位 5 | MODB — Mode B strap pin |
| 腳位 6 | MODC — Mode C strap pin |
| 腳位 7 | RESET — Active-low hardware reset |
| 腳位 8 | EXTAL — External clock/crystal input |
| 腳位 9 | XTAL — Crystal output |
| 腳位 10 | CLKOUT — Clock output for peripherals |
| 腳位 11 | GND — Ground |
| 腳位 12 | GND — Ground |
| 腳位 13 | PCAP — PLL filter capacitor |
| 腳位 14 | PCAP — PLL filter capacitor |
| 腳位 15 | VDD — 3.3V I/O supply |
| 腳位 16 | VCC — 1.6V core supply |
| 腳位 17 | GND — Ground |
| 腳位 18 | HA0 — Host address bus bit 0 |
| 腳位 19 | HA1 — Host address bus bit 1 |
| 腳位 20 | HA2 — Host address bus bit 2 |
| 腳位 21 | HA3 — Host address bus bit 3 |
| 腳位 22 | HA4 — Host address bus bit 4 |
| 腳位 23 | HA5 — Host address bus bit 5 |
| 腳位 24 | HA6 — Host address bus bit 6 |
| 腳位 25 | HA7 — Host address bus bit 7 |
| 腳位 26 | HD0 — Host data bus bit 0 |
| 腳位 27 | HD1 — Host data bus bit 1 |
| 腳位 28 | HD2 — Host data bus bit 2 |
| 腳位 29 | HD3 — Host data bus bit 3 |
| 腳位 30 | HD4 — Host data bus bit 4 |
| 腳位 31 | HD5 — Host data bus bit 5 |
| 腳位 32 | HD6 — Host data bus bit 6 |
| 腳位 33 | HD7 — Host data bus bit 7 |
| 腳位 34 | VDD — 3.3V I/O supply |
| 腳位 35 | VCC — 1.6V core supply |
| 腳位 36 | GND — Ground |
| 腳位 37 | HRW — Host read/write strobe |
| 腳位 38 | HCS — Host chip select |
| 腳位 39 | HDS — Host data strobe |
| 腳位 40 | HRDY — Host ready (wait state) |
| 腳位 41 | HREQ — Host request interrupt |
| 腳位 42 | HACK — Host acknowledge |
| 腳位 43 | SC0 — ESAI serial clock 0 |
| 腳位 44 | SDO0 — ESAI serial data out 0 |
| 腳位 45 | SDI0 — ESAI serial data in 0 |
| 腳位 46 | SC1 — ESAI serial clock 1 |
| 腳位 47 | SDO1 — ESAI serial data out 1 |
| 腳位 48 | SDI1 — ESAI serial data in 1 |
| 腳位 49 | SC2 — ESAI serial clock 2 |
| 腳位 50 | SDO2 — ESAI serial data out 2 |
| 腳位 51 | SDI2 — ESAI serial data in 2 |
| 腳位 52 | FS — ESAI frame sync |
| 腳位 53 | HCKR — ESAI high-frequency clock receive |
| 腳位 54 | HCKT — ESAI high-frequency clock transmit |
| 腳位 55 | VDD — 3.3V I/O supply |
| 腳位 56 | VCC — 1.6V core supply |
| 腳位 57 | GND — Ground |
| 腳位 58 | SCKR — SHI serial clock receive |
| 腳位 59 | SCKT — SHI serial clock transmit |
| 腳位 60 | FSR — SHI frame sync receive |
| 腳位 61 | FST — SHI frame sync transmit |
| 腳位 62 | DR — SHI receive data |
| 腳位 63 | DT — SHI transmit data |
| 腳位 64 | TMS — JTAG test mode select |
| 腳位 65 | TCK — JTAG test clock |
| 腳位 66 | TDI — JTAG test data in |
| 腳位 67 | TDO — JTAG test data out |
| 腳位 68 | TRST — JTAG test reset (active low) |
| 腳位 69 | DE — Debug event |
| 腳位 70 | PINIT — Program initialization (NMI) |
| 腳位 71 | IRQA — External interrupt A |
| 腳位 72 | IRQB — External interrupt B |
| 腳位 73 | IRQC — External interrupt C |
| 腳位 74 | IRQD — External interrupt D |
| 腳位 75 | GND — Ground |
| 腳位 76 | PA0 — GPIO port A bit 0 |
| 腳位 77 | PA1 — GPIO port A bit 1 |
| 腳位 78 | PA2 — GPIO port A bit 2 |
| 腳位 79 | PA3 — GPIO port A bit 3 |
| 腳位 80 | PA4 — GPIO port A bit 4 |
典型應用
DSPA56371AF180 適用於 6 應用s: AV Receiver / Home Theater Decoder, Automotive Audio Head Unit, Digital TV Audio Subsystem, Mini Stereo / Soundbar System, Multichannel Mixing Console, Conference Phone Audio Processor.
AV Receiver / Home Theater Decoder
The DSPA56371AF180 is purpose-built for AV receiver and home theater decoder subsystems where 7.1-channel Dolby Digital, DTS, and THX decoding must run deterministically alongside bass management and room correction. The 180 MHz DSP56300 core delivers 180 MIPS of fixed-point throughput, sufficient to decode lossless Dolby TrueHD and DTS-HD Master Audio in real time without buffer underruns. Its masked-ROM Symphony firmware means OEMs do not pay NRE for certified decoder licensing - the IP is pre-burned into the die. The 80-LQFP package exposes the ESAI (Enhanced Serial Audio Interface) and SHI (Serial Host Interface) pins needed for I2S, S/PDIF, and HDMI audio bridging, making the DSPA56371AF180 the lowest-cost path to a certified multichannel decoder board.
推薦
Automotive Audio Head Unit
The DSPA56371AF180 serves automotive head units and infotainment audio subsystems requiring proven DSP56300 reliability in a -40C to +85C ambient environment. The 180 MHz core decodes multi-channel audio for cabin tuning, active noise cancellation front-end, and speed-compensated volume while leaving MIPS headroom for telematics audio routing. The 'A' suffix denotes the masked-ROM firmware variant qualified for automotive OEM platforms. The 80-LQFP gull-wing package supports automated SMT assembly at automotive EMS lines, with 260 C peak reflow compatible with lead-free PCB finishes. NXP's automotive longevity program maintains supply for 10+ years, critical for vehicle production cycles spanning 2020 through 2030 model years.
推薦
Digital TV Audio Subsystem
The DSPA56371AF180 powers digital TV audio processing where AC-3, MPEG-1 Layer 2, and HE-AAC decoding must run in lockstep with lip-sync correction and dynamic range compression. The 180 MHz DSP56300 core processes 2-channel stereo and 5.1 surround simultaneously while sustaining sub-frame latency for accurate AV synchronization. Its masked-ROM firmware includes NXP-certified ATSC and DVB audio decoders, eliminating OEM-side royalty accounting for A/52 and BS.1199 streams. The 80-LQFP package integrates cleanly into slim TV mainboard layouts with 0.5 mm pitch compatible with consumer-grade PCB manufacturing. Engineers can pair the DSPA56371AF180 with a low-cost HDMI receiver to extract and decode broadcast audio before routing to TV speakers or S/PDIF output.
推薦
Mini Stereo / Soundbar System
The DSPA56371AF180 is well suited to mini stereo and soundbar products that need virtual surround, Dolby Pro Logic II, and DTS Neo:6 processing without the BOM cost of a multicore decoder. The 180 MIPS budget sustains virtualizer algorithms plus bass enhancement and speaker EQ in a single chip, eliminating an external effects processor. Its small 80-LQFP footprint (12x12 mm) fits soundbar mainboards constrained by cabinet width, while the masked-ROM firmware removes external flash BOM. Engineers commonly pair it with a Class-D amplifier IC such as TPA3116 for subwoofer channels and a 4-channel DAC for surround virtualization, achieving THX-like immersion at consumer price points.
推薦
Multichannel Mixing Console
The DSPA56371AF180 handles multichannel live and studio mixing consoles where 24-bit fixed-point precision is required for summing, dynamics, and effects without quantization noise. The DSP56300's fractional arithmetic preserves 24-bit headroom even after 30+ stages of processing, crucial for mastering-grade signal chains. Its deterministic instruction timing (one instruction per cycle at 180 MHz) eliminates audio glitches during complex scene changes. The masked-ROM firmware can be customized via NXP for OEM-specific effects libraries such as reverb or de-essing. The 80-LQFP package gives design access to the ESAI and GPIO buses needed to connect AD/DA converters and motorized fader controllers on the console surface.
推薦
Conference Phone Audio Processor
The DSPA56371AF180 enables enterprise conference phone audio processing where acoustic echo cancellation, noise suppression, and beamforming must run simultaneously across multiple microphones. The 180 MIPS core budget accommodates a 4-mic beamformer plus AEC and AGC, sustaining full-duplex audio without clipping or echo artifacts. The DSP56300's deterministic timing eliminates audio glitches during conference bridge renegotiation. Its masked-ROM firmware can be licensed with NXP's voice processing libraries, accelerating OEM time-to-market. The 80-LQFP package is ideal for compact desktop conference phone mainboards where 0.5 mm pitch supports dense mixed-signal layouts alongside Ethernet and PoE circuitry.
推薦
推薦產品摘要
工程參考資料，適用於 DSPA56371AF180 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DSPB56371AF180 | DSPB56374AFC | DSPB56721AF |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-80 (12x12 mm, 0.5 mm pitch) | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same |
| Core Architecture | DSP56300 (24-bit fixed-point) | DSP56300 (24-bit fixed-point) | DSP56300 (24-bit fixed-point) | DSP56300 (24-bit fixed-point) |
| Core Clock Speed | 180 MHz | 180 MHz | 150 MHz | 200 MHz |
| Throughput | 180 MIPS | 180 MIPS | 150 MIPS | 200 MIPS |
| Firmware Variant | Masked-ROM (Symphony audio, A suffix) | Blank-ROM / alternate mask (B suffix) | Masked-ROM (Symphony 74 family) | Masked-ROM (Symphony 72 family) |
| Pin Count | 80 | 80 | 80 | 80 |
| RoHS Status | Compliant | Compliant | Compliant | Compliant |
主要差異化特點
- Masked-ROM Symphony firmware for fastest time-to-market (對比DSPB56371AF180 (blank-ROM))
- Higher clock speed than DSPB56374AFC (對比DSPB56374AFC (150 MHz))
- Lower clock speed than DSPB56721AF (對比DSPB56721AF (200 MHz))
設計說明
The DSPA56371AF180 requires two supplies: 3.3V on VDD pins (I/O ring) and 1.6V on VCC pins (DSP56300 core). Both rails need 10 uF bulk + 0.1 uF ceramic decoupling within 5 mm of each supply pin pair. The 1.6V rail can be generated from 3.3V by a low-noise LDO (e.g., TPS7A4700); the 1.6V rail must hold within +/-5 percent under full DSP load transients to avoid core reset events. Place a ferrite bead in series with the 3.3V analog/digital split to keep PLL noise out of the audio path.
Route the EXTAL/XTAL crystal traces as short as possible with a continuous ground pour underneath and a guard ring tied to GND. Place the 10 MHz (or per design) fundamental-mode crystal within 5 mm of pins 8 and 9; stray capacitance above 5 pF will pull the PLL off-frequency. The 80-LQFP footprint has 0.5 mm pitch gull-wing leads - use NSMD pads with 0.4 mm solder mask openings for reliable lead-free reflow at 260 C peak. Route ESAI and SHI differential pairs (SC/SDO/SDI) with 50 ohm controlled impedance if traces exceed 25 mm.
Do not connect the Mode A/B/C strap pins (4, 5, 6) to floating state - they select the boot mode (Host Interface vs JTAG vs SCI) and a floating input can cause indeterminate boot behavior. Tie them through 10 kohm pull-up/pull-down resistors to VDD or GND per the DSP56371 datasheet boot-mode table. Do not omit the PCAP capacitor (pins 13-14) or the PLL will fail to lock. The 1.6V core supply must rise at the same time or before the 3.3V I/O supply - sequencing in reverse causes latch-up. For EMI-sensitive designs, ensure the JTAG TRST pin (68) is pulled low at power-up to keep the TAP controller in reset.
Estimated: at 180 MHz with sustained 180 MIPS load and 1.6V core supply, the DSPA56371AF180 dissipates approximately 0.6 W (estimated from V * I typical for DSP56300 family). The 80-LQFP package has theta_JA around 50 C/W on a 4-layer JEDEC test board, resulting in a 30 C temperature rise above ambient. For industrial (-40C to +85C) operation no heatsink is needed; for automotive under-hood or sealed enclosures, ensure the PCB copper area around the package reaches at least 1 sq inch to keep junction below 125 C.
合規資訊
RoHS and REACH compliant per NXP product page; AEC-Q100 not formally qualified for automotive despite Freescale automotive lineage; for AEC-Q100 automotive applications evaluate NXP's newer automotive-grade DSP successors.
