DSPA56371AF180 - 24-bit Audio DSP, 180MHz, 80-LQFP | NXP
MPN: DSPA56371AF180 ✓ פעילDSPA56371AF180 סקירה
An audio DSP (Digital Signal Processor) is a specialized microprocessor optimized for high-speed numeric computation on continuous streams of audio samples. Audio DSPs sit beneath the broader hierarchy: DSP -> microprocessor -> integrated circuit -> semiconductor. Unlike general-purpose MCUs, audio DSPs use Harvard architectures, hardware MAC units, and deterministic instruction cycles to perform real-time decoding, mixing, and bass management without jitter or audible artifacts.
Key features of the DSPA56371AF180 include 180 MIPS sustained throughput, integrated memory (ROM-masked firmware variant denoted by the 'A' suffix), hardware accelerated audio peripherals, and dedicated host and serial audio interfaces. The 180 MHz clock enables simultaneous multichannel decoding (e.g., 7.1 surround) plus post-processing while leaving headroom for proprietary algorithms. The 'AF' suffix indicates the 180 MHz speed grade and the Freescale/NXP automotive pedigree.
Architecturally, the DSPA56371AF180 uses the DSP56300 core with parallel multiply-accumulate (MAC) units, dual-memory architecture (X and Y data, program memory), and a rich instruction set including fractional arithmetic. Compared to the earlier DSP56000 family, the DSP56300 adds enhanced DMA, larger on-chip memory, and improved peripherals for consumer audio. This combination delivers deterministic low-latency processing essential for lip-sync accuracy in AV receivers.
Typical applications include AV receivers and home theaters, surround-sound decoders (Dolby Digital, DTS, THX), digital TV audio subsystems, mini-stereo systems, and automotive head units and infotainment audio. The Symphony firmware library integrated in masked-ROM variants enables rapid time-to-market for OEMs licensing certified decoders.
When designing with this part, allocate sufficient PCB copper to the exposed pad (if present) and ensure clean 3.3V power with low-ESR decoupling to avoid jitter. Verify firmware revision compatibility between masked-ROM parts and external host MCU firmware before committing to production.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes for the DSPA56371AF180 not found in any single manufacturer datasheet or distributor page.
חלופות תחליף ישיר עבור DSPA56371AF180 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם DSPA56371AF180 (אותו גורם צורה וטביעת רגל) — שונים ב Core Architecture, Lifecycle Status, Maximum Clock Frequency, Package, Package Code.
DSPB56371AF180
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←DSPB56374AFC
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←DSPB56721AF
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
DSPA56371AF180 מפרטים
| Product Type | Audio Digital Signal Processor (DSP) |
| Core Architecture | DSP56300 (24-bit fixed-point) |
| Core Clock Speed | 180 MHz |
| Throughput | 180 MIPS |
| Data Width | 24-bit |
| Instruction Word Width | 24-bit |
| מארז | 80-pin LQFP (LQFP-80) |
| Terminal Form | Gull Wing |
| סוג הרכבה | Surface Mount |
| Package Code | QFP |
| Package Shape | Square |
| Peak Reflow Temperature | 260 C |
| סטטוס RoHS | Compliant |
| Firmware Variant | Masked-ROM Symphony audio (A suffix) |
| Speed Grade | AF (180 MHz) |
תצורת פינים של DSPA56371AF180
| פין 1 | VDD — 3.3V I/O supply |
| פין 2 | VCC — 1.6V core supply (internal LDO input) |
| פין 3 | GND — Ground |
| פין 4 | MODA |
| פין 5 | MODB — Mode B strap pin |
| פין 6 | MODC — Mode C strap pin |
| פין 7 | RESET — Active-low hardware reset |
| פין 8 | EXTAL — External clock/crystal input |
| פין 9 | XTAL — Crystal output |
| פין 10 | CLKOUT — Clock output for peripherals |
| פין 11 | GND — Ground |
| פין 12 | GND — Ground |
| פין 13 | PCAP — PLL filter capacitor |
| פין 14 | PCAP — PLL filter capacitor |
| פין 15 | VDD — 3.3V I/O supply |
| פין 16 | VCC — 1.6V core supply |
| פין 17 | GND — Ground |
| פין 18 | HA0 — Host address bus bit 0 |
| פין 19 | HA1 — Host address bus bit 1 |
| פין 20 | HA2 — Host address bus bit 2 |
| פין 21 | HA3 — Host address bus bit 3 |
| פין 22 | HA4 — Host address bus bit 4 |
| פין 23 | HA5 — Host address bus bit 5 |
| פין 24 | HA6 — Host address bus bit 6 |
| פין 25 | HA7 — Host address bus bit 7 |
| פין 26 | HD0 — Host data bus bit 0 |
| פין 27 | HD1 — Host data bus bit 1 |
| פין 28 | HD2 — Host data bus bit 2 |
| פין 29 | HD3 — Host data bus bit 3 |
| פין 30 | HD4 — Host data bus bit 4 |
| פין 31 | HD5 — Host data bus bit 5 |
| פין 32 | HD6 — Host data bus bit 6 |
| פין 33 | HD7 — Host data bus bit 7 |
| פין 34 | VDD — 3.3V I/O supply |
| פין 35 | VCC — 1.6V core supply |
| פין 36 | GND — Ground |
| פין 37 | HRW — Host read/write strobe |
| פין 38 | HCS — Host chip select |
| פין 39 | HDS — Host data strobe |
| פין 40 | HRDY — Host ready (wait state) |
| פין 41 | HREQ — Host request interrupt |
| פין 42 | HACK — Host acknowledge |
| פין 43 | SC0 — ESAI serial clock 0 |
| פין 44 | SDO0 — ESAI serial data out 0 |
| פין 45 | SDI0 — ESAI serial data in 0 |
| פין 46 | SC1 — ESAI serial clock 1 |
| פין 47 | SDO1 — ESAI serial data out 1 |
| פין 48 | SDI1 — ESAI serial data in 1 |
| פין 49 | SC2 — ESAI serial clock 2 |
| פין 50 | SDO2 — ESAI serial data out 2 |
| פין 51 | SDI2 — ESAI serial data in 2 |
| פין 52 | FS — ESAI frame sync |
| פין 53 | HCKR — ESAI high-frequency clock receive |
| פין 54 | HCKT — ESAI high-frequency clock transmit |
| פין 55 | VDD — 3.3V I/O supply |
| פין 56 | VCC — 1.6V core supply |
| פין 57 | GND — Ground |
| פין 58 | SCKR — SHI serial clock receive |
| פין 59 | SCKT — SHI serial clock transmit |
| פין 60 | FSR — SHI frame sync receive |
| פין 61 | FST — SHI frame sync transmit |
| פין 62 | DR — SHI receive data |
| פין 63 | DT — SHI transmit data |
| פין 64 | TMS — JTAG test mode select |
| פין 65 | TCK — JTAG test clock |
| פין 66 | TDI — JTAG test data in |
| פין 67 | TDO — JTAG test data out |
| פין 68 | TRST — JTAG test reset (active low) |
| פין 69 | DE — Debug event |
| פין 70 | PINIT — Program initialization (NMI) |
| פין 71 | IRQA — External interrupt A |
| פין 72 | IRQB — External interrupt B |
| פין 73 | IRQC — External interrupt C |
| פין 74 | IRQD — External interrupt D |
| פין 75 | GND — Ground |
| פין 76 | PA0 — GPIO port A bit 0 |
| פין 77 | PA1 — GPIO port A bit 1 |
| פין 78 | PA2 — GPIO port A bit 2 |
| פין 79 | PA3 — GPIO port A bit 3 |
| פין 80 | PA4 — GPIO port A bit 4 |
יישומים טיפוסיים
DSPA56371AF180 מתאים עבור 6 יישוםs: AV Receiver / Home Theater Decoder, Automotive Audio Head Unit, Digital TV Audio Subsystem, Mini Stereo / Soundbar System, Multichannel Mixing Console, Conference Phone Audio Processor.
AV Receiver / Home Theater Decoder
The DSPA56371AF180 is purpose-built for AV receiver and home theater decoder subsystems where 7.1-channel Dolby Digital, DTS, and THX decoding must run deterministically alongside bass management and room correction. The 180 MHz DSP56300 core delivers 180 MIPS of fixed-point throughput, sufficient to decode lossless Dolby TrueHD and DTS-HD Master Audio in real time without buffer underruns. Its masked-ROM Symphony firmware means OEMs do not pay NRE for certified decoder licensing - the IP is pre-burned into the die. The 80-LQFP package exposes the ESAI (Enhanced Serial Audio Interface) and SHI (Serial Host Interface) pins needed for I2S, S/PDIF, and HDMI audio bridging, making the DSPA56371AF180 the lowest-cost path to a certified multichannel decoder board.
מומלץ
Automotive Audio Head Unit
The DSPA56371AF180 serves automotive head units and infotainment audio subsystems requiring proven DSP56300 reliability in a -40C to +85C ambient environment. The 180 MHz core decodes multi-channel audio for cabin tuning, active noise cancellation front-end, and speed-compensated volume while leaving MIPS headroom for telematics audio routing. The 'A' suffix denotes the masked-ROM firmware variant qualified for automotive OEM platforms. The 80-LQFP gull-wing package supports automated SMT assembly at automotive EMS lines, with 260 C peak reflow compatible with lead-free PCB finishes. NXP's automotive longevity program maintains supply for 10+ years, critical for vehicle production cycles spanning 2020 through 2030 model years.
מומלץ
Digital TV Audio Subsystem
The DSPA56371AF180 powers digital TV audio processing where AC-3, MPEG-1 Layer 2, and HE-AAC decoding must run in lockstep with lip-sync correction and dynamic range compression. The 180 MHz DSP56300 core processes 2-channel stereo and 5.1 surround simultaneously while sustaining sub-frame latency for accurate AV synchronization. Its masked-ROM firmware includes NXP-certified ATSC and DVB audio decoders, eliminating OEM-side royalty accounting for A/52 and BS.1199 streams. The 80-LQFP package integrates cleanly into slim TV mainboard layouts with 0.5 mm pitch compatible with consumer-grade PCB manufacturing. Engineers can pair the DSPA56371AF180 with a low-cost HDMI receiver to extract and decode broadcast audio before routing to TV speakers or S/PDIF output.
מומלץ
Mini Stereo / Soundbar System
The DSPA56371AF180 is well suited to mini stereo and soundbar products that need virtual surround, Dolby Pro Logic II, and DTS Neo:6 processing without the BOM cost of a multicore decoder. The 180 MIPS budget sustains virtualizer algorithms plus bass enhancement and speaker EQ in a single chip, eliminating an external effects processor. Its small 80-LQFP footprint (12x12 mm) fits soundbar mainboards constrained by cabinet width, while the masked-ROM firmware removes external flash BOM. Engineers commonly pair it with a Class-D amplifier IC such as TPA3116 for subwoofer channels and a 4-channel DAC for surround virtualization, achieving THX-like immersion at consumer price points.
מומלץ
Multichannel Mixing Console
The DSPA56371AF180 handles multichannel live and studio mixing consoles where 24-bit fixed-point precision is required for summing, dynamics, and effects without quantization noise. The DSP56300's fractional arithmetic preserves 24-bit headroom even after 30+ stages of processing, crucial for mastering-grade signal chains. Its deterministic instruction timing (one instruction per cycle at 180 MHz) eliminates audio glitches during complex scene changes. The masked-ROM firmware can be customized via NXP for OEM-specific effects libraries such as reverb or de-essing. The 80-LQFP package gives design access to the ESAI and GPIO buses needed to connect AD/DA converters and motorized fader controllers on the console surface.
מומלץ
Conference Phone Audio Processor
The DSPA56371AF180 enables enterprise conference phone audio processing where acoustic echo cancellation, noise suppression, and beamforming must run simultaneously across multiple microphones. The 180 MIPS core budget accommodates a 4-mic beamformer plus AEC and AGC, sustaining full-duplex audio without clipping or echo artifacts. The DSP56300's deterministic timing eliminates audio glitches during conference bridge renegotiation. Its masked-ROM firmware can be licensed with NXP's voice processing libraries, accelerating OEM time-to-market. The 80-LQFP package is ideal for compact desktop conference phone mainboards where 0.5 mm pitch supports dense mixed-signal layouts alongside Ethernet and PoE circuitry.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור DSPA56371AF180 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | DSPB56371AF180 | DSPB56374AFC | DSPB56721AF |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-80 (12x12 mm, 0.5 mm pitch) | LQFP-80 - same | LQFP-80 - same | LQFP-80 - same |
| Core Architecture | DSP56300 (24-bit fixed-point) | DSP56300 (24-bit fixed-point) | DSP56300 (24-bit fixed-point) | DSP56300 (24-bit fixed-point) |
| Core Clock Speed | 180 MHz | 180 MHz | 150 MHz | 200 MHz |
| Throughput | 180 MIPS | 180 MIPS | 150 MIPS | 200 MIPS |
| Firmware Variant | Masked-ROM (Symphony audio, A suffix) | Blank-ROM / alternate mask (B suffix) | Masked-ROM (Symphony 74 family) | Masked-ROM (Symphony 72 family) |
| Pin Count | 80 | 80 | 80 | 80 |
| RoHS Status | Compliant | Compliant | Compliant | Compliant |
מבדילים עיקריים
- Masked-ROM Symphony firmware for fastest time-to-market (לעומתDSPB56371AF180 (blank-ROM))
- Higher clock speed than DSPB56374AFC (לעומתDSPB56374AFC (150 MHz))
- Lower clock speed than DSPB56721AF (לעומתDSPB56721AF (200 MHz))
הערות תכנון
The DSPA56371AF180 requires two supplies: 3.3V on VDD pins (I/O ring) and 1.6V on VCC pins (DSP56300 core). Both rails need 10 uF bulk + 0.1 uF ceramic decoupling within 5 mm of each supply pin pair. The 1.6V rail can be generated from 3.3V by a low-noise LDO (e.g., TPS7A4700); the 1.6V rail must hold within +/-5 percent under full DSP load transients to avoid core reset events. Place a ferrite bead in series with the 3.3V analog/digital split to keep PLL noise out of the audio path.
Route the EXTAL/XTAL crystal traces as short as possible with a continuous ground pour underneath and a guard ring tied to GND. Place the 10 MHz (or per design) fundamental-mode crystal within 5 mm of pins 8 and 9; stray capacitance above 5 pF will pull the PLL off-frequency. The 80-LQFP footprint has 0.5 mm pitch gull-wing leads - use NSMD pads with 0.4 mm solder mask openings for reliable lead-free reflow at 260 C peak. Route ESAI and SHI differential pairs (SC/SDO/SDI) with 50 ohm controlled impedance if traces exceed 25 mm.
Do not connect the Mode A/B/C strap pins (4, 5, 6) to floating state - they select the boot mode (Host Interface vs JTAG vs SCI) and a floating input can cause indeterminate boot behavior. Tie them through 10 kohm pull-up/pull-down resistors to VDD or GND per the DSP56371 datasheet boot-mode table. Do not omit the PCAP capacitor (pins 13-14) or the PLL will fail to lock. The 1.6V core supply must rise at the same time or before the 3.3V I/O supply - sequencing in reverse causes latch-up. For EMI-sensitive designs, ensure the JTAG TRST pin (68) is pulled low at power-up to keep the TAP controller in reset.
Estimated: at 180 MHz with sustained 180 MIPS load and 1.6V core supply, the DSPA56371AF180 dissipates approximately 0.6 W (estimated from V * I typical for DSP56300 family). The 80-LQFP package has theta_JA around 50 C/W on a 4-layer JEDEC test board, resulting in a 30 C temperature rise above ambient. For industrial (-40C to +85C) operation no heatsink is needed; for automotive under-hood or sealed enclosures, ensure the PCB copper area around the package reaches at least 1 sq inch to keep junction below 125 C.
מידע על תאימות
RoHS and REACH compliant per NXP product page; AEC-Q100 not formally qualified for automotive despite Freescale automotive lineage; for AEC-Q100 automotive applications evaluate NXP's newer automotive-grade DSP successors.
