DSPIC33CK256MC502-I/SS - 16-bit 100MIPS DSC, CAN FD | Microchip
MPN： DSPIC33CK256MC502-I/SS ✓ 啟用中DSPIC33CK256MC502-I/SS 概覽
A Digital Signal Controller combines the compute architecture of a microcontroller with the math acceleration of a DSP. In the embedded hierarchy, the dsPIC33CK sits above general-purpose MCUs (such as PIC16) for control loops requiring fast multiply-accumulate operations, positioning it as a power-management and motor-control oriented member of Microchip's broader DSC portfolio.
Key features include a 16-bit 100 MIPS dsPIC DSC core with DSP engine, integrated CAN Flexible Data-Rate (CAN FD) for modern in-vehicle and industrial networking, a high-speed 12-bit ADC, multiple high-resolution PWM outputs for digital power conversion, and on-chip operational amplifiers (OpAmps) that reduce external component count in current-sense paths. The 'MC' peripheral set targets motor control applications, while 'I' suffix denotes the industrial -40C to +85C temperature range.
Architecturally, the dsPIC33CK core supports single-cycle MAC, barrel shifting, and hardware looping, with multiple internal buses and four DMA channels for efficient data movement. The high-speed PWM module supports complementary outputs, dead-time insertion, and fault protection essential for DC-DC converters and 3-phase inverters. According to Microchip, the dsPIC33CK256MC50X family is optimized for motor control, high-performance general embedded control, and digital power applications.
Typical applications include BLDC/PMSM motor drives, solar micro-inverters and DC-DC converters, battery management and charging systems, and CAN FD-connected industrial nodes.
Design consideration: the 100 MHz core requires careful supply decoupling (0.1 uF per VDD pin plus bulk capacitance) and a clean, low-ESR VDD/AVDD layout; use PGECx/PGEDx pairs as matched pairs for ICSP programming.
This page synthesizes distributor pricing, drop-in alternatives within the dsPIC33CK family, and practical design notes not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 DSPIC33CK256MC502-I/SS — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： DSPIC33CK256MC502-I/SS （相同外形與佔位） — 差異在於 CAN Interface, Operating Temperature, RoHS Status, Core, Core Architecture.
DSPIC33CK256MC502-E/SS
✅ 直接替換📋 參考替代品（不在目錄中）
DSPIC33CK256MP502-I/SS
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33CK128MC502-I/SS
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →DSPIC33CK64MC502-I/SS
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
DSPIC33CK32MC102T-I/SS
✅ 直接替換聯絡詢價
查看資料表 →DSPIC33CK256MC502-I/SS 最大額定值與電氣特性
| Core | dsPIC33CK 16-bit DSC |
| Core Speed | 100 MHz (100 MIPS) |
| Program Memory (Flash) | 256 KB |
| RAM | 32 KB |
| DMA Channels | 4 |
| CAN Interface | CAN FD |
| ADC Resolution | 12-bit |
| 封裝 | 28-SSOP |
| 工作溫度 | -40C to +85C (industrial, I suffix) |
| On-chip OpAmps | Yes |
| High-Speed PWM | Yes |
| 安裝類型 | Surface Mount |
| Communication Peripherals | CAN FD, UART, SPI, I2C (per family description) |
DSPIC33CK256MC502-I/SS 28-ssop 腳位配置指南
DSPIC33CK256MC502-I/SS（28-ssop 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： DSPIC33CK256MC502-I/SS.
請參閱 資料表 以查看完整腳位配置。
典型應用
DSPIC33CK256MC502-I/SS 適用於 6 應用s: BLDC / PMSM Motor Control, Digital Power Conversion (DC-DC and PFC), Industrial CAN FD Networking Nodes, Solar Micro-Inverters and Renewable Energy Converters, Battery Management and Charging Systems, High-Performance General Embedded Control.
BLDC / PMSM Motor Control
The DSPIC33CK256MC502-I/SS is purpose-built for field-oriented control (FOC) of BLDC and PMSM motors: its 100 MHz, 100 MIPS DSP core executes the Clarke/Park transforms and PI current loops in microsecond-scale loop times, while the high-speed PWM module generates complementary gate signals with hardware dead-time insertion and cycle-by-cycle current limiting. On-chip OpAmps amplify shunt-resistor phase currents before the 12-bit ADC samples them, removing external amplifiers from the BOM. In a typical FOC drive, the ADC triggers from the PWM center point for synchronized current sampling, and 32 KB RAM holds the observer, state machine, and CAN FD diagnostics stack concurrently.
推薦
Digital Power Conversion (DC-DC and PFC)
In switch-mode power supplies, the 100 MHz core plus high-resolution PWM of the DSPIC33CK256MC502-I/SS closes voltage and current loops with switching frequencies well above 100 kHz. The four DMA channels stream ADC results to RAM without CPU intervention, keeping loop jitter low, and the CAN FD interface provides PMBus-style telemetry for rack-level management. Typical uses include LLC resonant converters, totem-pole PFC stages, and battery chargers. A key trade-off versus a dedicated digital-power controller is firmware effort: the DSC offers design flexibility across topologies, but compensation and protection routines must be written and validated by the engineer rather than taken from fixed hardware.
推薦
Industrial CAN FD Networking Nodes
With its integrated CAN Flexible Data-Rate controller, the DSPIC33CK256MC502-I/SS serves as a compact industrial node for sensor aggregation, actuator control, and condition monitoring on modern CAN FD buses, where data rates beyond classical CAN are required. The 256 KB Flash accommodates protocol stacks, bootloader, and application logic simultaneously, while the 12-bit ADC digitizes analog sensor channels locally and DMA moves samples to memory for filtering before transmission. Industrial -40C to +85C operation suits factory-floor enclosures. Compared with MCU-plus-external-CAN-controller solutions, the integrated transceiver-side controller saves board area and eliminates SPI-based CAN interface latency and software complexity.
推薦
Solar Micro-Inverters and Renewable Energy Converters
Micro-inverter and MPPT converter designs benefit from the DSPIC33CK256MC502-I/SS combination of fast DSP math and high-resolution PWM: the 100 MIPS core runs MPPT search algorithms and grid-synchronization (PLL) routines in real time, while the ADC samples panel voltage/current and grid waveforms for anti-islanding and power-quality compliance. Hardware fault protection in the PWM module shuts down gates within a PWM cycle on overcurrent events, protecting power stages during grid transients. The device's low-cost 28-SSOP footprint supports the aggressive BOM targets of per-panel electronics, where cost per watt directly affects system economics and the controller must combine performance with minimal pin count.
推薦
Battery Management and Charging Systems
Battery chargers and BMS nodes use the DSPIC33CK256MC502-I/SS to implement CC/CV charging profiles, cell balancing decisions, and safety supervision. The 12-bit ADC measures pack voltage, current, and temperature through the on-chip OpAmps and external dividers; software state machines handle constant-current, constant-voltage, and trickle phases with termination criteria computed in firmware. The CAN FD link reports state-of-charge and fault data to vehicle or UPS controllers, and the industrial temperature grade covers engine-bay and outdoor enclosures. Estimated charge-loop latency stays in the tens of microseconds thanks to ADC-to-PWM hardware triggering, enabling cycle-by-cycle overcurrent protection during the critical constant-current phase.
推薦
High-Performance General Embedded Control
Beyond power electronics, the DSPIC33CK256MC502-I/SS works as a general 16-bit embedded controller where DSP instructions matter: audio effects processing, sensor fusion, barcode decoding, and closed-loop positioning in laboratory and test equipment. The 256 KB Flash and 32 KB RAM allow C-based application logic plus DSP filtering libraries (Microchip DSP Library) in one device, and single-cycle MAC operations outperform classic 8-bit PIC architectures by an order of magnitude on filtering workloads. UART, SPI, and I2C peripherals interface with displays, memory, and sensors. Compared with a 32-bit Cortex-M alternative, the dsPIC33CK wins on deterministic single-cycle DSP execution and Microchip tool-chain continuity from legacy PIC designs.
推薦
推薦產品摘要
工程參考資料，適用於 DSPIC33CK256MC502-I/SS — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | DSPIC33CK256MC502-E/SS | DSPIC33CK256MP502-I/SS | DSPIC33CK32MC102T-I/SS |
|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 32 KB |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Functional Safety (FuSa) Support | No | Yes | No | No |
主要差異化特點
- On-chip operational amplifiers for current sensing (對比DSPIC33CK256MP502-I/SS)
- Extended temperature and Functional Safety variant available (對比DSPIC33CK256MC502-E/SS)
- 256 KB Flash headroom over low-memory family members (對比DSPIC33CK32MC102T-I/SS)
設計說明
At a 100 MHz core clock the dsPIC33CK draws peak current through VDD; place one 0.1 uF X7R ceramic capacitor at each VDD pin within 2-3 mm of the pin plus one 4.7-10 uF bulk capacitor per device. Power VDD and AVDD from the same nominal rail; connect AVDD through a ferrite bead plus local 0.1 uF/1 uF pair when ADC accuracy matters. Estimated: even at full MIPS throughput, internal dissipation remains in the tens of mA range on 3.3 V, so the 28-SSOP needs no heatsinking.
Route high-speed PWM outputs to gate drivers as short, matched traces and keep them away from ADC phase-current sense lines to prevent switching noise coupling into current-loop measurements. Use Kelvin-connected shunt grounds for the OpAmp inputs. Provide ICSP headers for at least one PGECx/PGEDx pair (pair them - do not mix PGEC1 with PGED2, per Microchip programming documentation). Exposed decoupling directly under the SSOP body on a dedicated ground layer yields the cleanest ADC results.
Common pitfalls: (1) Using mismatched PGEC/PGED pins for ICSP - the programmer will fail to identify the device; (2) Omitting VCAP/VDDCORE capacitor requirements of the dsPIC33CK core - check the latest datasheet for the required core capacitor value and ESR; (3) Assuming the MC502 includes the MP variant's enhanced digital-power PWM features - the peripheral sets differ; verify feature mapping before porting firmware between MC and MP suffixes; (4) Exceeding the -I grade +85C in sealed motor-drive enclosures - choose the -E/SS grade instead.
合規資訊
Verified web data does not include explicit RoHS/REACH statements for this ordering code. Confirm via Microchip's product page environmental documentation before use in regulated products.
