EP3CLS150F484C8 - 150K LE Cyclone III LS FPGA, 484-FBGA | Intel
MPN： EP3CLS150F484C8 ✗ 停產EP3CLS150F484C8 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, embedded memory, and DSP blocks that can be re-programmed by the designer after manufacture. FPGAs belong to the broader category of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-defined processing. The Cyclone III LS family specifically targets low-static-power applications that previously required discrete glue logic or low-density ASICs.
Key features include 150,848 logic elements, 6137856 bits (about 6.14 Mbit) of embedded SRAM, four phase-locked loops (PLLs), and high-speed LVDS I/O support. The device also integrates dedicated hardware multipliers for DSP, a configuration controller supporting multiple boot modes (including external flash and JTAG), and security features such as configuration bitstream encryption via AES. Operating junction temperature is 0 C to 85 C (commercial grade).
The Cyclone III LS architecture uses an SRAM-based configuration cell and a low-k 65 nm process, which reduces dynamic power by roughly 50 percent compared to the prior-generation Cyclone II family. The 484-ball FBGA package exposes 8 dedicated clock/PLL pins, multi-standard I/O banks that support LVCMOS, LVTTL, SSTL, and LVDS signaling, and a footprint compatible with the wider Cyclone III LS density ladder (EP3C5/16/25/40/55/80/120/150).
Typical applications include industrial motor control, factory automation I/O expansion, low-power video processing bridges, machine-to-machine gateways, and portable instrumentation. The combination of mid-range logic capacity and low static power makes it well suited to battery-backed or fan-less embedded systems.
When designing with this FPGA, plan I/O bank assignments before PCB layout, since each bank has a fixed VCCIO rail that constrains compatible logic levels. Use the Altera (now Intel) Quartus II design suite, version 13.0 or later in the 13.x legacy line, for synthesis, place-and-route, and bitstream generation; later Quartus versions may require a Cyclone III device-library update.
This page synthesizes distributor pricing, package-level alternatives that share the 484-FBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 EP3CLS150F484C8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3CLS150F484C8 （相同外形與佔位） — 差異在於 Package, Logic Elements (LE), Process Technology, Embedded Memory, Speed Grade.
EP3CLS150F484C7N
✅ 直接替換聯絡詢價
查看資料表 →EP3CLS150F484C7
✅ 直接替換聯絡詢價
查看資料表 →EP3C120F484C8
✅ 直接替換📋 參考替代品（不在目錄中）
EP3C120F484C7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C120F484I7
✅ 直接替換聯絡詢價
查看資料表 →EP3C80F484C8
✅ 直接替換聯絡詢價
查看資料表 →EP3CLS150F484C8 最大額定值與電氣特性
| Family | Cyclone III LS |
| Logic Elements (LE) | 150848 |
| Embedded Memory Bits | 6137856 |
| User I/O Count | 210 |
| PLLs | 4 |
| Process Technology | 65 nm low-power CMOS |
| Core Voltage | 1.2 V |
| 工作溫度 | 0 C to +85 C (commercial) |
| Speed Grade | C8 |
| Maximum Internal Frequency | 402 MHz |
| 封裝 | 484-ball FBGA |
| 安裝類型 | Surface Mount (BGA) |
| Configuration Memory | SRAM-based, AES bitstream encryption supported |
| RoHS 狀態 | Compliant |
EP3CLS150F484C8 484-ball fbga 腳位配置指南
EP3CLS150F484C8（484-ball fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3CLS150F484C8.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3CLS150F484C8 適用於 6 應用s: Industrial Motor Control, Factory Automation I/O Expansion, Low-Power Video Processing Bridge, Machine-to-Machine (M2M) Gateway, Portable Test and Measurement Instrumentation, Aerospace Avionics Data Concentrator.
Industrial Motor Control
The EP3CLS150F484C8 is well suited to industrial motor-control designs, where 150,848 logic elements and 4 PLLs provide the headroom to implement multi-axis field-oriented control (FOC), sigma-delta ADC interfaces for current sensing, and encoder feedback decoding on a single device. Its 210 user I/Os comfortably handle the parallel GPIO, PWM channels, and quadrature-decoder inputs required for three-phase inverter stages driving AC induction or permanent-magnet motors. The Cyclone III LS subfamily's reduced static power compared to standard Cyclone III helps meet thermal budgets in sealed cabinet installations without active cooling. AES bitstream encryption protects IP in deployed equipment. Industrial designers pair the FPGA with companion gate drivers (e.g. IR2110) and isolated I/O modules.
推薦
Factory Automation I/O Expansion
In factory-automation I/O concentrators and protocol-bridge cards, the EP3CLS150F484C8 acts as a programmable glue layer between legacy field buses (RS-485, RS-232, CAN, SPI-based sensor networks) and modern Ethernet backbones. Its 6,137,856 bits of embedded SRAM buffer high-rate sensor bursts, while the 4 PLLs derive the multiple reference clocks needed by Ethernet MACs, USB ULPI transceivers, and CAN controllers. The 484-FBGA package keeps the device on a small footprint suitable for compact DIN-rail modules. AES encryption and JTAG-based configuration support secure remote firmware updates. Companion components include Ethernet PHYs, isolated transceivers, and watchdog supervisors.
推薦
Low-Power Video Processing Bridge
The EP3CLS150F484C8 functions as a low-power video bridge between camera sensors (parallel CMOS, MIPI-CSI via external deserializer, or LVDS) and display controllers, ASICs, or processors. Its dedicated hardware multipliers and 6.14 Mbit embedded SRAM enable real-time pixel processing such as color-space conversion, deinterlacing, and on-screen display (OSD) overlay. Compared with the standard-power Cyclone III, the LS variant reduces static power, allowing fan-less operation in compact video appliances. The 210 user I/Os accommodate wide parallel video buses and sideband control channels. Designers typically pair it with HDMI transmitters and external DDR2 SDRAM for frame buffering.
推薦
Machine-to-Machine (M2M) Gateway
The EP3CLS150F484C8 fits M2M and edge-gateway applications that aggregate data from multiple sensor buses and pre-process it before forwarding over LTE, Wi-Fi, or wired Ethernet. The Cyclone III LS subfamily's lower static power extends battery and solar-backed operation, while 150,848 logic elements comfortably host small protocol stacks and DSP front-ends. Four PLLs derive the diverse reference clocks required by LTE modems, Wi-Fi modules, and external memory interfaces. The 484-FBGA footprint is compatible with lower-density Cyclone III LS variants, allowing PCB reuse for cost-optimized SKUs. AES bitstream encryption prevents IP theft in deployed field units.
推薦
Portable Test and Measurement Instrumentation
Portable bench instruments such as logic analyzers, protocol analyzers, and data-acquisition front-ends benefit from the EP3CLS150F484C8's logic capacity combined with the low-static-power profile of the LS subfamily. Designers can integrate deep capture buffers in the 6.14 Mbit embedded SRAM, run real-time protocol decoders (I2C, SPI, UART, CAN, LIN) in soft logic, and drive high-resolution LCD or OLED displays through the abundant user I/Os. The 484-FBGA package keeps the digital section compact so the analog front-end and power-tree can occupy the rest of the board. AES encryption safeguards proprietary measurement IP.
推薦
Aerospace Avionics Data Concentrator
In commercial and unmanned-aerial avionics data concentrators, the EP3CLS150F484C8 aggregates ARINC 429, RS-422, and discrete I/O lines from multiple subsystems into a single stream forwarded to mission processors. The Cyclone III LS architecture's reduced static power supports the thermal envelope of unpressurized enclosures, while the 150,848 logic elements implement multiple protocol channels and built-in-self-test (BIST) routines. Designers leverage 4 PLLs for independent channel clocking, 6.14 Mbit of embedded SRAM for circular capture buffers, and the 484-FBGA package's fine-pitch routing to fit dense I/O into compact line-replaceable units. Companion components include ARINC transceivers and isolated DC-DC converters.
推薦
推薦產品摘要
工程參考資料，適用於 EP3CLS150F484C8 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3CLS150F484C7N | EP3CLS150F484C7 | EP3C120F484C8 | EP3C120F484C7 | EP3C120F484I7 | EP3C80F484C8 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Family / Subfamily | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III (standard power) | Cyclone III (standard power) | Cyclone III (standard power, industrial) | Cyclone III (standard power) |
| Logic Elements | 150848 | 150848 | 150848 | 119088 (-21%) | 119088 (-21%) | 119088 (-21%) | 81264 (-46%) |
| Embedded Memory (bits) | 6137856 | 6137856 | 6137856 | 3981312 (-35%) | 3981312 (-35%) | 3981312 (-35%) | 2810880 (-54%) |
| User I/Os | 210 | 210 | 210 | 213 | 213 | 213 | 295 |
| Speed Grade | C8 | C7 (faster) | C7 (faster) | C8 | C7 (faster) | I7 (industrial) | C8 |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C (industrial) | 0 C to +85 C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Top-of-family Cyclone III LS logic capacity in 484-FBGA (對比EP3C120F484C8)
- AES bitstream encryption for IP protection (對比EP3C80F484C8)
- Faster speed grade available in same package (對比EP3CLS150F484C7N)
設計說明
The EP3CLS150F484C8 in the 484-FBGA package dissipates power as a function of toggle rate, utilization, and clock frequency. While the Cyclone III LS subfamily reduces static power versus the standard Cyclone III, designs at high toggle rates can still require thermal management. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet before final schematic commitment, then validate on the bench with the PowerPlay Power Analyzer inside Quartus II. The 484-FBGA exposes a thermal pad that should be soldered to a copper pour with thermal vias to a back-side plane for optimal heat spreading.
Estimated: a 484-ball FBGA with 1.0 mm ball pitch requires PCB fabrication with microvia or staggered via structures; standard 0.2 mm drill via-in-pad may be needed for full breakout. Plan a minimum 6-layer stackup with dedicated ground and power planes. Keep all decoupling capacitors within 1-2 mm of the FPGA power balls, and route all VCCINT and VCCA pairs through short, wide traces to plane regions. Differential I/O pairs should be length-matched within 5 mils and reference a continuous ground plane for the full routing length.
Do not confuse the Cyclone III LS subfamily (EP3CLS...) with the standard-power Cyclone III (EP3C...). The LS suffix means lower static power and adds AES bitstream encryption, but I/O bank counts and PLL counts can differ across density points. Also note that Cyclone III FPGAs are not 5V-tolerant on any I/O bank; level translation is required when interfacing to legacy 5V logic. Quartus II 13.0/13.1 is the recommended legacy toolchain; later Quartus Prime editions require the legacy Cyclone III device library to be installed via the Add-On package.
合規資訊
RoHS and REACH compliance per Intel FPGA product page. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free status of the 484-FBGA package should be confirmed via Intel MDDS (Material Declaration Data Sheet). The Cyclone III family is not 5V-tolerant on any I/O bank.
