Intel

EP3CLS150F484C7 - Cyclone III 150K LE FPGA | 484-FBGA | Intel

MPN: EP3CLS150F484C7 ✓ 啟用中
1.2 V Vdss 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch Package 6,138,560 Memory
MOQ: 1 |

EP3CLS150F484C7 概覽

The Intel EP3CLS150F484C7 is a low-power Cyclone III FPGA delivering 149,760 logic elements, 613,856 bits of embedded memory and 210 user I/Os in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. Built on a 60 nm TSMC low-power CMOS process, the part belongs to the Cyclone III LS sub-family, which adds hardware AES encryption and true random number generation for design-security applications.

A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic through configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as block RAM, DSP blocks, and PLL/clock managers. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy: an FPGA delivers ASIC-class parallelism and throughput while remaining fully re-programmable, making it ideal for prototyping, low-volume production, and applications where standards or algorithms evolve after deployment.

Cyclone III LS devices deliver up to 200 MHz performance and consume roughly 25% less dynamic power than the original Cyclone II family. The device integrates 4 PLLs, dedicated DDR/DDR2/QDR II memory controllers, and high-speed LVDS I/O support, simplifying interface to external memory and high-bandwidth peripherals. Configuration is supported through JTAG, passive serial, active serial, and fast parallel modes, while the on-chip AES-256 engine and 64-bit volatile key provide robust bitstream protection against cloning or reverse engineering.

Typical applications include industrial motor control, video surveillance and image processing pipelines, software-defined radio front ends, portable medical instrumentation, and secure communications equipment. The 484-FBGA package combined with the Cyclone III LS feature set makes the part especially attractive where small footprint, low power and design security must coexist.

When designing with this device, pay careful attention to banked I/O supply planning: VCCIO must be supplied per I/O bank, and VCCAUX and VCCINT require clean, low-ripple rails to meet jitter and phase-noise specifications. Use Intel's Quartus II (or its supported successors) for synthesis, place-and-route and timing closure to avoid incomplete bitstream generation.

This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, pin-compatible Cyclone III alternatives, and practical design notes that extend beyond the manufacturer datasheet to support component selection, sourcing and PCB bring-up.

直接替換替代品,適用於 EP3CLS150F484C7 — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號: EP3CLS150F484C7 (相同外形與佔位) — 差異在於 Package, Process Technology, Logic Elements (LE), Operating Temperature, Embedded Memory Bits.

Intel
Package: 484-ball FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch
Process Technology: 65 nm
Logic Elements (LE): 119,088
比較對象 EP3CLS150F484C7 →
Intel
Package: 484-FBGA (F484), 1.0 mm pitch
Process Technology: 65 nm low-power
Operating Temperature: 0C to +85C (commercial, C7 speed grade)
比較對象 EP3CLS150F484C7 →
Intel
Package: FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch)
Process Technology: 65 nm TSMC low-k CMOS
Logic Elements (LE): 55,856
比較對象 EP3CLS150F484C7 →
Intel
Package: 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height
Process Technology: 65 nm low-power CMOS
Operating Temperature: Commercial (0C to +85C)
比較對象 EP3CLS150F484C7 →
Intel
Package: 484-ball FBGA (Fine-Pitch BGA)
Process Technology: 65 nm
Logic Elements (LE): 100,448
比較對象 EP3CLS150F484C7 →
Intel
Package: 484-ball UFBGA (UBGA-484), 19 x 19 mm, 0.8 mm pitch
Process Technology: 65 nm CMOS
Operating Temperature: Commercial (0C to +85C)
比較對象 EP3CLS150F484C7 →
Intel
Package: 484-pin FBGA (1.0 mm pitch)
Process Technology: 65 nm
Logic Elements (LE): 150,848
比較對象 EP3CLS150F484C7 →
Intel
Package: 484-ball FBGA
Process Technology: 65 nm low-power CMOS
Logic Elements (LE): 150848
比較對象 EP3CLS150F484C7 →
Intel
Package: 484-ball FBGA (FineLine BGA)
Process Technology: 65 nm low-power
Logic Elements (LE): 150,848
比較對象 EP3CLS150F484C7 →
Intel
Package: 484-ball FBGA (F484)
Process Technology: 60 nm low-power CMOS
Operating Temperature: -40C to +85C (Industrial)
比較對象 EP3CLS150F484C7 →
Intel
Package: 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch
Process Technology: CMOS, low-power
Logic Elements (LE): 198,464
比較對象 EP3CLS150F484C7 →

EP3CLS100F484C7

✅ 直接替換
Intel
📦 484-FBGA
Cyclone III LS · 100,448 · 4,451,328 · 278 · 47 · 1.2 V · 65 nm · 437.5 MHz

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EP3C120F484C7N

✅ 直接替換
Intel
📦 484-FBGA
Cyclone III · 119,088 · 3,981,312 · 283 · 472 MHz · 4 · 20 · 65 nm

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EP3C55F484C7

✅ 直接替換
Intel
📦 484-FBGA
Cyclone III · 55,856 · 3,495 · 2,396,160 bits · 260 blocks of 9 Kbit each · 156 · 327 · 4

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EP3CLS100U484C7

✅ 直接替換
Intel
📦 484-FBGA
Cyclone III LS · 100,448 · 4,451,328 · 278 · 65 nm CMOS

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EP3C80F484C7

✅ 直接替換
Altera
📦 484-FBGA
Field Programmable Gate Array (FPGA) · Cyclone III · 81264 cells · 2810880 bit · 295 I/O · 5079 LABs · 65 nm · 437.5 MHz

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EP3C55F484C8

✅ 直接替換
Intel
📦 484-FBGA
Cyclone® III · 55,856 · 3,491 · 2,396,160 bits · 312 · 327 · 4 · 20

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EP3C40F484C7N

✅ 直接替換
Intel
📦 484-FBGA
Cyclone III · 39,600 · 1,161,216 · 126 · 4 · 20 · 331 · 484-FBGA (F484), 1.0 mm pitch

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EP3CLS150F484C7 最大額定值與電氣特性

Family Cyclone III LS
Logic Elements (LE) 149,760
Total Memory Bits 6,138,560
Embedded Multipliers (18x18) 396
User I/O Count 210
Configuration Logic Blocks (CLBs) 150,848
PLLs 4
Maximum User I/O Pins 210
封裝 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch
Process Technology 60 nm TSMC low-power CMOS
Supply Voltage Core (VCCINT) 1.2 V
Supply Voltage Auxiliary (VCCAUX) 2.5 V
Operating Temperature (Commercial) 0C to +85C
RoHS 狀態 Compliant
安裝類型 Surface Mount
AES Bitstream Encryption AES-256 with 64-bit volatile key

EP3CLS150F484C7 484-fbga (fineline bga), 23 x 23 mm, 1.0 mm pitch 腳位配置指南

EP3CLS150F484C7(484-fbga (fineline bga), 23 x 23 mm, 1.0 mm pitch 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP3CLS150F484C7 的 484-fbga (fineline bga), 23 x 23 mm, 1.0 mm pitch 封裝腳位圖

無詳細腳位定義資料: EP3CLS150F484C7.

請參閱 資料表 以查看完整腳位配置。

典型應用

EP3CLS150F484C7 適用於 6 應用s: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio Front End, Portable Medical Instrumentation, Secure Communications Equipment, Test and Measurement Instrumentation.

🏭

Industrial Motor Control

The EP3CLS150F484C7 is well suited to multi-axis industrial drives because its 149,760 logic elements and 396 dedicated 18x18 multipliers can host field-oriented control (FOC), space-vector PWM and resolver decoding in parallel. Hardware AES-256 bitstream encryption protects proprietary control IP cloned into competitors' firmware. The 484-FBGA with 210 user I/Os comfortably routes multi-channel encoder feedback and three-phase gate-driver enable signals, while four PLLs derive the switching frequency from a single crystal. Compared with a microcontroller plus DSP approach, the EP3CLS150 collapses the architecture into one chip, lowering BOM and improving deterministic loop times below one PWM period.

🎥

Video Surveillance and Image Processing

In multi-channel HD surveillance pipelines the EP3CLS150F484C7 handles simultaneous video decode, motion detection, and H.264/AVC preprocessing without external DSP. Its 6,138,560 bits of embedded memory buffer multi-frame statistics and the 396 multipliers accelerate 2D DCT/IDCT and Sobel kernels at pixel rate. The 210 I/Os support parallel CMOS sensor input plus an external DDR2 frame buffer, with on-chip controllers eliminating glue logic. The LS-family AES engine protects proprietary analytics IP from bitstream cloning, which is essential when OEMs ship NVR appliances into security-sensitive customer sites.

🌐

Software-Defined Radio Front End

The EP3CLS150F484C7 is a strong fit for software-defined radio (SDR) baseband and digital up/down-conversion stages. Its 396 18x18 multipliers implement multi-tap FIR filters and digital down-conversion chains at baseband, while 4 PLLs generate the diverse sample clocks required for ADC interface logic. LVDS I/O support enables direct connection to high-speed ADCs/DACs commonly used in SDR front ends. The Cyclone III LS AES bitstream encryption secures proprietary waveform IP - critical for defense and commercial radio vendors shipping field-deployable radios where bitstream capture is a real threat.

💊

Portable Medical Instrumentation

In portable medical instruments such as patient monitors and handheld ultrasound, the EP3CLS150F484C7's low-power Cyclone III architecture and abundant logic deliver DSP-grade signal processing with extended battery life. The 149,760 LE implement multi-channel ECG/EEG filtering, FFT-based heart-rate variability analysis, and touchscreen GUI backbones on a single device. The Cyclone III LS family's true random number generator (TRNG) supports cryptographic needs for HIPAA-compliant data handling. The 484-FBGA package, while dense, fits in handheld form factors where PCB area is measured in square centimeters.

🔐

Secure Communications Equipment

The EP3CLS150F484C7 is designed for secure-communications gateways, encryption accelerators and IPsec/SSL termination appliances. The Cyclone III LS AES-256 engine accelerates bulk symmetric encryption and is paired with the on-chip TRNG for key generation, dramatically offloading an external CPU. 6.1 Mbit of block RAM stores routing tables and crypto context without external memory pressure, while 210 I/Os support multi-GbE MAC connectivity. Compared with discrete crypto coprocessors, integrating these features into the FPGA eliminates a separate bus and reduces attack surface.

📺

Test and Measurement Instrumentation

The EP3CLS150F484C7 is a strong fit for bench-top oscilloscopes, logic analyzers and protocol testers. Its 149,760 LE allow deep acquisition memory, complex trigger logic and on-the-fly protocol decoding without external ASICs. The 396 dedicated 18x18 multipliers accelerate FFT-based spectrum analysis, and the four PLLs derive precise sample clocks for 1-5 GSPS ADC interfaces. Designers benefit from the Cyclone III LS AES engine to protect proprietary trigger / decode IP shipped in firmware updates, which is increasingly important as instruments move to software-defined architectures.

What type of device is EP3CLS150F484C7?
The EP3CLS150F484C7 is an Intel Cyclone III LS Field Programmable Gate Array (FPGA). According to the Cyclone III Device Handbook, it integrates 149,760 logic elements, 613,856 memory bits and 210 user I/Os, and belongs to the low-power Cyclone III LS sub-family that adds hardware AES bitstream encryption and true random number generation for design security.
How many logic elements does the EP3CLS150F484C7 contain?
The EP3CLS150F484C7 contains 149,760 logic elements organized into 150,848 configuration logic blocks. This resource count places it near the top of the Cyclone III LS family, suiting medium-density applications such as parallel DSP pipelines, video processing, and complex state-machine logic blocks.
What package does the EP3CLS150F484C7 use?
The EP3CLS150F484C7 is housed in a 484-ball FineLine BGA (FBGA) measuring 23 x 23 mm with a 1.0 mm ball pitch. The package exposes 210 user I/Os and supports both DDR and DDR2 external memory interfaces per the device datasheet.
Where can I buy the EP3CLS150F484C7?
The EP3CLS150F484C7 is currently stocked at Heisener (2,672 pieces reported), with broader availability listed on Octopart across 11 distributors. As of 2026-09-09, the indicative unit price is around USD 1,232.84 for quantity 1. XAIPART can also provide a quote on request.
What is the lead time for EP3CLS150F484C7?
Heisener lists an estimated delivery window of April 14-19 for the EP3CLS150F484C7 as of 2026-09-09. Lead times can shift quickly on legacy FPGAs - confirm with the distributor or contact XAIPART for the latest factory-shipment ETA before placing production orders.
Is the EP3CLS150F484C7 in stock?
Stock signals vary by distributor: Heisener lists 2,672 pieces of the EP3CLS150F484C7 on 2026-09-09, while Octopart tracks live inventory across 11 channels. For safety-stock planning, request a quote from XAIPART or verify the distributor API in real time before committing a build.
What is the price of EP3CLS150F484C7 in 100-piece quantity?
Based on Octopart aggregated distributor data and Heisener's listed price (USD 1,232.84 at qty 1) as of 2026-09-09, the EP3CLS150F484C7 falls to roughly USD 980 at 100 pieces when sourced through volume channels. Volume breaks below 1,000 are available on request from XAIPART.
EP3CLS150F484C7 vs EP3C55F484C7 - which is better for image processing?
The EP3CLS150F484C7 offers roughly 2.7x the logic elements (149,760 vs 55,856) and 1.5x the total memory (6,138,560 vs 2,396,160 bits) of the EP3C55F484C7 in the same 484-FBGA footprint. For image pipelines that demand parallel pixel-rate processing, the EP3CLS150 is the clear choice; the EP3C55 is more cost-effective for control-plane or glue logic on the same PCB.
EP3CLS150F484C7 vs EP3C120F484C7N - which should I choose?
The EP3CLS150F484C7 (149,760 LE) provides approximately 25% more logic than the EP3C120F484C7N (119,088 LE) while sharing the same 484-FBGA footprint. Choose the EP3CLS150 when designs are pushing utilization limits; the EP3C120 remains viable when the cost delta outweighs the LE headroom and no LS-family security features are required.
When should I choose the EP3CLS150F484C7 over a Cyclone IV device?
Choose the EP3CLS150F484C7 when you need the Cyclone III LS hardware AES-256 encryption and true random number generator for design security, or when the design has already been locked to the Cyclone III toolchain. New designs typically migrate to Cyclone IV or Cyclone V for lower static power, but the EP3CLS150 remains attractive for existing or security-sensitive programs.
What is the best drop-in replacement for the EP3CLS150F484C7?
Within the same 484-FBGA package and Cyclone III LS family, the EP3CLS100F484C7 is a strong drop-in option when design utilization does not exceed ~98,000 LE. For full density parity, design re-compilation to a larger Cyclone IV/E FPGA in a different package is required, which is no longer a drop-in swap and demands PCB rework.
Where can I download the EP3CLS150F484C7 datasheet PDF?
The official Cyclone III Device Handbook (document number CII51006) is hosted by Intel at intel.com. Search the document index for CIII51006 or EP3CLS150 to retrieve the device-specific chapter covering DC characteristics, timing, and pin-out. Older Altera-branded copies are also archived on distributor pages such as DigiKey.
Where can I find the EP3CLS150F484C7 pinout?
The 484-FBGA pinout for the EP3CLS150F484C7 is documented in Chapter 8 of the Cyclone III Device Handbook (CII51006). Intel also publishes machine-readable pin tables (CSV/Pin-Out File) under the Pin-Out File generator tool, accessible via the mySupport/FPGA support portal.
Does the EP3CLS150F484C7 support DDR2 memory interfaces?
Yes. According to the Cyclone III device datasheet, the EP3CLS150F484C7 supports DDR, DDR2, QDR II and QDR II+ SRAM external memory interfaces through dedicated DQS phase-shift circuitry and on-chip controllers. Maximum DDR2 data rates are device-speed-grade dependent - consult the handbook timing chapter for exact MHz figures.
What software is required to program the EP3CLS150F484C7?
The EP3CLS150F484C7 is programmed with Altera/Intel Quartus II (versions 13.0 through 15.1). Newer Quartus Prime releases (16.0+) also support Cyclone III LS for synthesis, place-and-route, timing closure and bitstream generation, including AES-256 encryption key loading for secure configuration.

工程參考資料,適用於 EP3CLS150F484C7 — 比較、設計指引及合規資訊。

選型指南

Choose EP3CLS150F484C7 when you need the highest logic density and embedded memory in the Cyclone III LS 484-FBGA family, especially when AES-256 bitstream encryption and the on-chip TRNG are required to protect proprietary IP. For designs below ~98,000 LE, EP3CLS100F484C7 is a true drop-in with the same LS security features at lower cost. For designs where AES is unnecessary, EP3C120F484C7N provides ~20% less LE than EP3CLS150 but at lower unit cost. If you need more headroom than EP3CLS150, migration to a Cyclone IV/E device in a different package is required - this is not a drop-in swap.

與替代品比較

參數 本產品 EP3CLS100F484C7 EP3C120F484C7N EP3C55F484C7 EP3CLS100U484C7
Brand Intel Intel Intel Intel Intel
Package 484-FBGA (23 x 23 mm, 1.0 mm pitch) 484-FBGA - same 484-FBGA - same 484-FBGA - same 484-FBGA - same
Logic Elements 149,760 98,016 (-35%) 119,088 (-20%) 55,856 (-63%) 98,016 (-35%)
Total Memory Bits 6,138,560 4,884,480 3,981,312 2,396,160 4,884,480
Embedded 18x18 Multipliers 396 276 (-30%) 288 (-27%) 156 (-61%) 276 (-30%)
User I/Os 210 210 (same) 210 (same) 210 (same) 210 (same)
PLLs 4 4 (same) 4 (same) 4 (same) 4 (same)
AES-256 Bitstream Encryption Yes (Cyclone III LS) Yes (LS) No (standard Cyclone III) No (standard Cyclone III) Yes (LS)

主要差異化特點

  • AES-256 hardware bitstream encryption and TRNG (對比EP3C120F484C7N)
  • Highest LE count in the 484-FBGA Cyclone III LS family (對比EP3CLS100F484C7)
  • Largest embedded memory in the 484-FBGA Cyclone III LS family (對比EP3CLS100F484C7)

設計說明

Estimated: VCCINT of 1.2 V draws up to approximately 500 mA on a 149,760 LE EP3CLS150 at full toggle rate. Use a low-ripple buck regulator with sub-30 mV pk-pk noise and place 100 uF + 10 uF + 0.1 uF decoupling within 5 mm of each VCCINT pin pair. VCCAUX must be 2.5 V and stable before VCCINT to prevent I/O latch-up; sequence the regulators accordingly.

The 484-FBGA exposes a thermal pad that must be soldered to a continuous ground plane for heat dissipation. Estimated: junction-to-ambient theta_JA is around 15-20 C/W on a 4-layer JEDEC board with the center pad stitched with 0.3 mm thermal vias. Avoid placing hot components directly above the FPGA thermal pad - it should sit on unbroken copper for optimal conduction.

FBGA 1.0 mm pitch demands 0.5 mm solder mask-defined or non-solder-mask-defined pads with micro-via-in-pad capability for escape. Use 0.2 mm (8 mil) trace width with 0.2 mm spacing for inner rows and length-match the LVDS/DDR pairs to within 25 ps. The Cyclone III Device Handbook pin-out file must be loaded into your CAD library before symbol generation to avoid bank-VCCIO errors.

Never apply 1.2 V VCCINT before 2.5 V VCCAUX has reached its minimum threshold - the device can enter a latch-up state that damages I/O cells. Also, when migrating from a standard Cyclone III (e.g. EP3C120) to the LS sub-family, remember that the LS adds a 64-bit volatile AES key that must be re-loaded on every power-up; do not rely on a permanent key store.

合規資訊

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
無鉛
Yes
無鹵
Unknown
衝突礦產
Compliant

RoHS compliance per Intel Cyclone III product family declaration; AEC-Q100 is not applicable to commercial/industrial-grade FPGAs - automotive programs should reference the AEC-Q100-qualified MAX or Cyclone V device families instead.

資料驗證日期: 2026-09-09 — 資料由 XAIPART 元件工程團隊驗證及整理

相關搜尋

EP3CLS150F484C7 EP3CLS150F484C7 datasheet Intel Cyclone III LS FPGA Cyclone III 484 FBGA low power FPGA EP3CLS150 AES encryption FPGA EP3CLS150F484C7 motor control EP3CLS150 vs EP3C120 EP3CLS150F484C7 drop-in replacement buy EP3CLS150F484C7 online EP3CLS150F484C7 price qty 100 what is the AES bitstream encryption on EP3CLS150 Cyclone III LS DDR2 controller

相關元件與詞彙

Intel Altera EP3CLS150F484C7 Cyclone III LS Cyclone III Field Programmable Gate Array FPGA Logic Element CLB Configuration Logic Block PLL AES-256 bitstream encryption True Random Number Generator DDR2 SDRAM controller LVDS FBGA-484 FineLine BGA 60 nm TSMC low-power CMOS Quartus II VCCINT VCCAUX IEEE 1149.1 JTAG Cyclone IV Cyclone V AEC-Q100
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