EP3SE50F484C4G - 47,500 LE FPGA | Intel | Digital Systems
MPN： EP3SE50F484C4G ✓ 啟用中EP3SE50F484C4G 概覽
A field-programmable gate array, or FPGA, is a semiconductor device containing configurable logic blocks, programmable interconnects, memory resources, and I/O elements. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing. The hierarchy is FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. Stratix III E devices combine programmable fabric with embedded resources, allowing engineers to implement parallel processing and changing interfaces without requiring a custom mask set. Their configuration flexibility is especially useful when algorithms, protocols, or system requirements are still evolving.
The EP3SE50F484C4G provides 47,500 logic elements, 19,000 adaptive logic modules, 5.49 Mbit embedded memory, and 296 I/O. It operates from a 1.1 V supply and is specified from 0 °C to +85 °C. The high logic capacity supports complex control and data-processing functions, while 296 I/O provide many connections for external memories, converters, processors, and high-speed interfaces. The package is identified as 484-BBGA, FCBGA and is suitable for surface-mount assembly.
Its architecture is built around programmable adaptive logic modules connected by configurable routing. Embedded memory supports data buffering, register files, lookup tables, packet storage, and other localized state functions. The FPGA fabric can implement parallel datapaths and deterministic control logic, but power, timing, I/O banking, configuration, signal integrity, and pin assignment must be evaluated in the target design. The 1.1 V operating supply also requires compatible voltage regulation and power sequencing.
Typical applications include industrial automation controllers, communications equipment, digital signal processing, test and measurement systems, networking equipment, and medical monitoring hardware. In these systems, the 47,500 logic elements can implement multiple control and processing blocks, while 296 I/O can connect field buses, memory, converters, and management interfaces. The commercial +85 °C maximum is suitable for controlled commercial and industrial environments, but it does not establish an extended-temperature or automotive qualification.
The principal design trade-off is that an FPGA adds configuration complexity and requires a supported design flow, power analysis, timing closure, and careful PCB implementation. A 484-ball FCBGA also demands advanced assembly and controlled routing. Designers should verify unused-pin behavior, configuration circuitry, I/O standards, memory implementation constraints, and thermal performance against the manufacturer documentation before release.
This page combines verified distributor specifications, sourcing context, package-aware comparisons, and practical engineering notes. Only exact EP3SE50F484C4G values are presented as confirmed; unprovided electrical, timing, compliance, and alternative-part details are not inferred.
直接替換替代品，適用於 EP3SE50F484C4G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SE50F484C4G （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, RoHS Status, Embedded Memory.
EP3SE50F484C4
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F484C3G
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE50F484C3N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE50F484C3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE50F484C2G
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE50F484C2N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE50F484C2
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE50F484C4G 最大額定值與電氣特性
| Product Type | Stratix III E field-programmable gate array |
| Technology | Field-programmable gate array |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules | 19,000 ALM |
| Logic Array Blocks | 1,900 LAB |
| Embedded Memory | 5.49 Mbit |
| Number of I/O | 296 I/O |
| 工作電源電壓 | 1.1 V |
| Minimum Operating Temperature | 0 °C |
| Maximum Operating Temperature | +85 °C |
| 封裝 | 484-BBGA, FCBGA |
| Ball Count | 484 balls |
| 安裝方式 | SMD/SMT |
| Manufacturer | Intel |
| Legacy Brand | Altera |
| RoHS 狀態 | unknown |
| REACH Status | unknown |
EP3SE50F484C4G 484-bbga, fcbga 腳位配置指南
EP3SE50F484C4G（484-bbga, fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SE50F484C4G.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SE50F484C4G 適用於 6 應用s: Industrial Automation Controllers, Communications and Protocol Processing, Digital Signal Processing Systems, Test and Measurement Equipment, Medical Monitoring Hardware, Networking Equipment.
Industrial Automation Controllers
EP3SE50F484C4G fits industrial automation controllers that need parallel logic, flexible interfaces, and substantial I/O capacity. Its 47,500 logic elements and 19,000 adaptive logic modules can implement motion sequencing, machine-state control, protocol conversion, sensor aggregation, and safety-related supervisory logic, while 5.49 Mbit embedded memory supports buffering and lookup data. The 296 I/O can connect encoders, analog-to-digital converters, digital outputs, communication transceivers, and host processors. Its verified 0 °C to +85 °C range makes it relevant to controlled industrial environments, but enclosure temperature, vibration, and reliability qualifications must be validated. Use deterministic state machines and vendor-supported IP, and verify the complete 1.1 V power design, configuration circuitry, and timing constraints before production.
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Communications and Protocol Processing
EP3SE50F484C4G is suitable for communications equipment that requires configurable packet handling, interface adaptation, and deterministic control. The 47,500 logic elements can support framing, channel coding, traffic classification, statistics, and multiple protocol blocks in parallel. Its 5.49 Mbit embedded memory provides local storage for packet descriptors, queues, lookup tables, and elastic buffers, while 296 I/O help connect external PHYs, memory, processors, and management devices. The FPGA can be reconfigured as protocols evolve, reducing the need for a new fixed-function device. Designers must still verify line-rate feasibility using post-route timing, memory bandwidth, I/O standards, clocking, and board-level signal integrity. The supplied data does not identify transceiver count, maximum data rate, or interface certifications, so those parameters must be confirmed from the device documentation.
推薦
Digital Signal Processing Systems
EP3SE50F484C4G can serve in digital signal processing systems requiring configurable datapaths, sample buffering, and parallel arithmetic. Its 47,500 logic elements and 19,000 adaptive logic modules provide capacity for filters, transforms, modulators, encoders, control loops, and format conversion. The 5.49 Mbit embedded memory can hold coefficients, delay-line samples, intermediate results, and channel state. The device's 296 I/O support connections to converters, memory interfaces, clock sources, and downstream processors. FPGA parallelism can deliver deterministic processing when the design is pipelined correctly, but throughput must be proven with real timing constraints and the correct device family model. The verified data does not state DSP block count, clock frequency, or converter interface capability, so engineers should not assume those values. Confirm fixed-point precision, pipeline depth, memory bandwidth, and 1.1 V supply quality before implementation.
推薦
Test and Measurement Equipment
EP3SE50F484C4G is a strong candidate for test and measurement systems that need configurable acquisition control, waveform generation, protocol analysis, and instrument interfacing. The 47,500 logic elements allow instrument functions to be customized without a custom ASIC, while 5.49 Mbit embedded memory can buffer samples and implement state or coefficient storage. With 296 I/O, the FPGA can connect analog-to-digital converters, digital-to-analog converters, trigger hardware, calibration interfaces, displays, and host processors. Deterministic control and parallel processing are useful for real-time measurement paths, but exact performance depends on clocking, converter interface mode, routing, and timing closure. The supplied data does not specify ADC/DAC count, bandwidth, jitter, or thermal limits. Establish those values from the manufacturer documentation and the selected peripherals, then budget margin for measurement accuracy and production tolerances.
推薦
Medical Monitoring Hardware
EP3SE50F484C4G can be used in medical monitoring hardware for data acquisition coordination, sensor fusion preprocessing, waveform buffering, and host-interface functions. The 47,500 logic elements support parallel signal-processing and control blocks, while 5.49 Mbit embedded memory can hold sample windows, coefficients, and intermediate results. Its 296 I/O provide connectivity for converters, sensors, display controllers, communication interfaces, and supervisory processors. The verified 0 °C to +85 °C range defines the supplied operating-temperature specification, but it is not evidence of medical-grade certification, biological safety, or AEC-Q100 qualification. Medical designs require validated components, documented risk controls, deterministic behavior, and applicable regulatory review. Confirm electrical, timing, reliability, and lifecycle requirements independently, and do not use marketplace stock as a substitute for a controlled quality or traceability assessment.
推薦
Networking Equipment
EP3SE50F484C4G fits networking equipment where packet classification, traffic management, interface adaptation, and hardware-accelerated control are required. The 47,500 logic elements can implement forwarding logic, protocol parsing, counters, filtering, and management functions, while 5.49 Mbit embedded memory supports packet descriptors, lookup structures, queues, and burst buffering. The 296 I/O are useful for connecting processors, memory devices, Ethernet PHYs, clocking components, and service interfaces. Its reconfigurable architecture allows protocol updates and feature changes without a new silicon design. The supplied data does not state embedded transceiver count, lane rate, security features, or packet-processing capacity, so those requirements must be checked in the device family documentation. Validate throughput with representative traffic, worst-case utilization, post-route timing, and board-level signal-integrity simulations before selecting it for a production network platform.
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推薦產品摘要
工程參考資料，適用於 EP3SE50F484C4G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SE50F484C4 | EP3SE50F484C3G | EP3SE50F484C3N | EP3SE50F484C3 | EP3SE50F484C2G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA |
主要差異化特點
- Verified high logic capacity (對比EP3SE50F484C3G)
- Verified embedded memory capacity (對比EP3SE50F484C3N)
- Verified I/O resource count (對比EP3SE50F484C3)
- Commercial operating range (對比EP3SE50F484C2G)
設計說明
EP3SE50F484C4G operates at a verified 1.1 V, so the power tree must be designed from the exact family documentation rather than from a generic FPGA assumption. Determine core current, I/O-bank demand, transient response, startup sequencing, and permissible ripple using the selected configuration and operating conditions. Place local decoupling close to the appropriate supply balls, provide a low-impedance ground return, and verify regulator stability with the actual load profile. The supplied data contains no current, power, tolerance, or sequencing specification; those values remain intentionally unestimated.
The 484-ball FCBGA package requires the manufacturer land pattern, ball map, escape geometry, and layer stackup. Do not derive ball assignments from the 296-I/O count because power, configuration, clocking, and dedicated functions also occupy package positions. Confirm the exact ball orientation and pin-1 location from the official package drawing. Use appropriate via-in-pad or dog-bone fanout, controlled impedance for high-speed routes, solid reference planes, and enough vias around the BGA power and ground fields to support current and return paths.
Thermal design must be based on actual FPGA activity and environmental conditions. Start with estimated utilization, clock rates, toggle rates, memory use, and I/O loading, then replace estimates with measured or documented values where possible. The verified device range is 0 °C to +85 °C, but the supplied excerpts do not provide junction-to-air, junction-to-case, or junction-to-board thermal resistance. Use board copper, thermal vias, airflow, and enclosure modeling appropriate to the assembled system, and monitor temperature during worst-case testing without presenting derived values as datasheet specifications.
For external memory, converters, clocks, and high-speed interfaces, define each I/O standard, voltage, termination, direction, and timing constraint before routing. EP3SE50F484C4G has 296 I/O, but that number does not identify the number or performance of high-speed lanes. Validate differential-pair geometry, reference-plane continuity, crosstalk budgets, clock distribution, and connector or PHY requirements. Use post-route timing analysis and board-level measurements; the verified excerpts do not provide maximum frequency, transceiver count, jitter, or supported I/O standards.
Do not treat a closely related Intel MPN as an automatic drop-in replacement without checking the complete ordering-code definition. EP3SE50F484C4 is listed with the same verified 47,500 logic elements, 19,000 ALMs, 5.49 Mbit memory, 296 I/O, and 484-ball FCBGA format, but the supplied data does not establish the meaning of the G suffix or every timing, temperature, and electrical equivalence. Also confirm configuration memory, JTAG or alternate configuration paths, boot mode pins, unused-ball requirements, and the availability of the exact device files in the intended design toolchain.
合規資訊
The supplied verified web excerpts do not establish RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 status. The operating-temperature range is verified, but formal qualification is not stated.