EP3SE50F780C3 - Stratix III E FPGA 47.5K LE 780-FBGA | Intel / Altera
MPN： EP3SE50F780C3 ✗ 停產EP3SE50F780C3 概覽
An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, block RAM (BRAM), PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs) within digital semiconductors, sitting alongside CPLDs and structured ASICs. The Stratix III E variant emphasizes high logic density and DSP throughput for compute-bound applications where microcontrollers or DSP processors cannot keep pace.
Key features include up to 47,500 logic elements, 5,760 Kbits of embedded memory (BRAM), dedicated 18x18 multipliers and DSP blocks for fixed/floating-point acceleration, integrated PLLs for clock management, and 488 general-purpose user I/Os supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential I/O standards. The Stratix III E architecture introduces adaptive logic modules (ALMs) for finer-grained packing efficiency compared to the previous Stratix II generation.
The EP3SE50F780C3 also integrates transceiver capabilities and partial reconfiguration support, allowing portions of the fabric to be reprogrammed while the remainder of the device continues operation. This is particularly useful for systems requiring firmware updates, A/B redundancy, or runtime algorithm switching. The 65 nm process node balances performance and leakage, though later Intel FPGA families (Stratix IV, V, 10) have since migrated to finer nodes.
Typical applications include high-speed digital signal processing for communications infrastructure, military radar and electronic warfare, medical imaging accelerators (CT, MRI, ultrasound), ASIC prototyping, and high-throughput video broadcast equipment. The combination of logic density and DSP blocks makes the device suitable for parallel filter banks, FFT pipelines, and forward-error-correction engines.
When designing with this part, verify that the Quartus II design software version (typically Quartus II 9.1 to 13.1 depending on Service Pack) supports the specific device and is licensed for SignalTap or Logic Analyzer features if needed. The 780-ball FC-FBGA package requires a multi-layer PCB with controlled-impedance routing and matched-length traces for high-speed I/O.
This page synthesizes distributor pricing, drop-in Stratix III E same-family alternatives, lifecycle notes, and practical design considerations not consolidated in the manufacturer datasheet, supporting engineering and procurement teams working with legacy Altera/Intel FPGA inventory.
直接替換替代品，適用於 EP3SE50F780C3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SE50F780C3 （相同外形與佔位） — 差異在於 Package, Family, Speed Grade, Operating Temperature, Embedded Memory (bits).
EP3SE50F780C3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780C4
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780I3
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F780C2
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F780C3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE50F484C3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE50F780C3 最大額定值與電氣特性
| Family | Stratix III E |
| Logic Elements (LE) | 47,500 |
| Embedded Memory (BRAM) | 5,760 Kbits |
| User I/Os | 488 |
| 封裝 | 780-ball FC-FBGA (FineLine BGA) |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Logic Voltage | 0.9 V |
| Transceiver Speed (max) | 500 MHz |
| Total LABs/CLBs | 1900 |
| 安裝類型 | Surface Mount (BGA) |
| 工作溫度 | 0C to +85C (Commercial grade, 'C' suffix) |
EP3SE50F780C3 780-ball fc-fbga (fineline bga) 腳位配置指南
EP3SE50F780C3（780-ball fc-fbga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SE50F780C3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SE50F780C3 適用於 6 應用s: High-Speed Digital Signal Processing, Telecommunications Infrastructure, Military Radar and Electronic Warfare, Medical Imaging Acceleration, ASIC Prototyping, Video Broadcast and Image Processing.
High-Speed Digital Signal Processing
The EP3SE50F780C3 is well-suited for high-throughput DSP pipelines such as FFT engines, channelizers, and digital up/down converters. Its 47,500 logic elements combined with dedicated Stratix III DSP blocks (18x18 multipliers with accumulate) deliver hundreds of GMACs of compute density, while 5,760 Kbits of embedded BRAM supports large coefficient tables and sample buffering. The 780-ball FC-FBGA package exposes 488 user I/Os for parallel data paths. Placed on the signal-processing daughter card, it typically runs alongside external DDR2/QDR memory controllers instantiated in HDL for streaming data ingest. The 500 MHz transceiver capability also enables direct interfacing to high-speed serial ADCs/DACs.
推薦
Telecommunications Infrastructure
The EP3SE50F780C3 serves as a fabric engine for baseband processing, forward-error-correction (Turbo, LDPC), and framer/mapper functions in wireless base stations and optical transport platforms. The 488 user I/Os handle CPRI/OBSAI backhaul interfaces and multiple SFP+/XFP transceiver channels, while the built-in PLLs generate jitter-compliant clocks. The 65 nm process node provides deterministic timing closure required for carrier-grade telecom equipment. In typical designs, the FPGA is paired with a host processor running control-plane software and external PHY chips. Power consumption and thermal design should be validated against the Stratix III power calculator early in the design flow.
推薦
Military Radar and Electronic Warfare
The EP3SE50F780C3 is widely deployed in radar signal-processing subsystems (pulse compression, MTI filtering, beamforming) and electronic-warfare receiver chains (DF, deinterleaving). Its DSP and BRAM density enable real-time processing of wideband IF samples, while 488 user I/Os handle ADC/DAC data and synchronization with RF front ends. The 780-ball FC-FBGA package supports ruggedized board assemblies. For harsh environments, the industrial-grade EP3SE50F780I3 variant extends the temperature range to -40C to +100C. Designers typically use Quartus II with SignalTap II logic analyzer for in-system debug, paired with VITA-49 or proprietary sample-stream protocols.
推薦
Medical Imaging Acceleration
In CT, MRI, and ultrasound imaging systems, the EP3SE50F780C3 accelerates back-projection, image reconstruction, and beamforming algorithms. Its parallel logic and DSP slices dramatically reduce reconstruction latency versus CPU-only pipelines, while 5,760 Kbits of BRAM holds intermediate image data and lookup tables. The device's reliability and medical-grade life-cycle support make it appropriate for long-lived diagnostic equipment. Designers typically implement custom filter back-projection or iterative reconstruction in HDL, with external DDR2/QDR memory buffers. PCBs often pair the FPGA with high-speed ADCs and high-bandwidth PCIe links to the host CPU.
推薦
ASIC Prototyping
The EP3SE50F780C3 serves as a hardware vehicle for verifying ASIC/SoC designs before tape-out. Its 47,500 logic elements, generous BRAM, and 488 I/Os provide a realistic run-time environment for testing register-transfer-level (RTL) code with real-world I/O stress. Multi-FPGA partitioning tools (Synopsys Certify, Mentor Graphics Precision) map large ASIC designs across multiple Stratix III E devices. Designers typically use the 780-ball FC-FBGA for high-pin-count ASIC prototypes and pair the FPGA with high-speed memory and protocol bridges. Comprehensive in-system debug is supported via SignalTap II and external logic analyzers attached to the prototype board.
推薦
Video Broadcast and Image Processing
The EP3SE50F780C3 drives high-resolution video processing for broadcast routers, video-wall controllers, and professional AV equipment. Its 488 user I/Os accommodate multiple SDI/HDMI/DVI input-output streams, while DSP blocks accelerate color-space conversion, scaling, and overlay blending. The 5,760 Kbits of embedded BRAM line-buffers full-HD frames in real time. Broadcast-grade designs often implement genlocking, frame synchronization, and ancillary-data processing in HDL. Designers typically pair the FPGA with external video PHYs and frame buffers (DDR2 SDRAM). The 780-ball FC-FBGA supports the high pin count needed for multi-channel I/O fanout.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SE50F780C3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SE50F780C3N | EP3SE50F780C4 | EP3SE50F780I3 | EP3SE50F780C2 | EP3SE110F780C3 | EP3SE50F484C3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 484-ball FC-FBGA - smaller package, same family |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 107,500 | 47,500 |
| Speed Grade | C3 (commercial) | C3N (Pb-free) | C4 (faster) | I3 (industrial, slower) | C2 (slower) | C3 | C3 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
主要差異化特點
- Stratix III E family - high-density DSP and parallel logic engine (對比EP3SE50F484C3)
- C3 speed grade - balance of cost and performance (對比EP3SE50F780C4)
- Pb-free (C3N) option for reflow production (對比EP3SE50F780C3)
設計說明
Estimated: The 780-ball FC-FBGA package of EP3SE50F780C3 has a typical ball pitch of 1.0 mm. PCB design requires a high-layer-count stack-up (10+ layers) with microvia or via-in-pad technology, plus matched-length impedance-controlled routing for high-speed I/O banks. Use the Altera/Altera pinout file in Quartus II 13.1 or earlier to generate the land pattern and verify against the manufacturer's package specification before committing to PCB fabrication.
Estimated: At full fabric utilization with sustained DSP activity, the EP3SE50F780C3 can dissipate 5-8 W. Designers should attach a heatsink or thermal interface material (TIM) and provide at least 4 oz copper pours beneath the package's exposed thermal regions to keep junction temperature within the 0C to +85C commercial range. Use the Stratix III PowerPlay Early Power Estimator to model worst-case power before PCB layout.
Do not assume Quartus Prime supports Stratix III E - the final Quartus II release that supports Stratix III is version 13.1 (and earlier with service packs). Newer Quartus versions dropped support. Also verify MSEL[3:0] configuration mode strap pins (AS, PS, JTAG, FPP) match your configuration EPCS/EPCQ flash and JTAG chain. Misconfigured MSEL can cause silent configuration failures that look like dead boards.
Estimated: For DDR2/QDR II memory interfaces in EP3SE50F780C3 designs, use the Altera External Memory Interface Toolkit to validate read/write margins. Match address/command and clock trace lengths within +/- 25 ps for 400 Mbps operation. Series-termination resistors may be required on high-fanout clock nets to control overshoot. Always perform post-layout simulation with IBIS models before tape-out.
合規資訊
RoHS/REACH compliance status for EP3SE50F780C3 not explicitly stated in the verified web data; lead-free variant (EP3SE50F780C3N suffix 'N') is typically available for RoHS-compliant assembly. AEC-Q100 not applicable for FPGAs in this family.