EP3SE80F1152C4N - 80K Cell Stratix III E FPGA | Intel / Altera
MPN： EP3SE80F1152C4N ✗ 停產EP3SE80F1152C4N 概覽
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy a unique position in the digital IC hierarchy: programmable logic device (PLD) -> FPGA -> high-density programmable logic, enabling hardware reconfiguration that ASICs cannot match. Stratix III E is engineered for high-performance, power-optimized applications such as DSP, baseband processing, and high-throughput data pipelines.
Key features include 717 MHz maximum internal operating frequency, 1.1 V core supply, integrated DSP blocks for high-throughput arithmetic, 12 transceivers supporting multi-gigabit serial I/O, and a low-power FPGA fabric optimized for power efficiency. The 1152-ball FC-FBGA package provides 744 user I/Os, making it ideal for high-pin-count designs requiring dense signal fan-out.
Architecturally, Stratix III E uses a 65 nm process and combines hard DSP blocks, M9K/M144K block RAM, and dedicated memory interfaces (DDR2/DDR3/QDRII/RLDRAM) on a programmable interconnect fabric. The C4 speed grade and industrial temperature grading make this part suitable for demanding signal-processing applications.
Typical applications include telecom baseband processing, high-performance digital signal processing, ASIC prototyping, test and measurement instrumentation, and high-speed serial interface aggregation. The device integrates transceivers up to 6.375 Gbps depending on configuration.
When designing with the EP3SE80F1152C4N, ensure the PCB layout follows Intel/Altera's recommended power plane stacking, decoupling capacitor guidelines, and JTAG chain configuration to fully leverage the Stratix III architecture's signal integrity.
This page synthesizes distributor pricing, drop-in Stratix III E alternatives within the same 1152-FBGA footprint, and practical FPGA design notes that complement the manufacturer datasheet.
直接替換替代品，適用於 EP3SE80F1152C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SE80F1152C4N （相同外形與佔位） — 差異在於 Package, Operating Temperature, Configuration Method, Process Technology, Family.
EP3SE80F1152C4LN
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE80F1152C4L
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE80F1152C4
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE80F1152C3N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE80F1152C3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE80F1152C2N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SE110F1152C4N
✅ 直接替換聯絡詢價
查看資料表 →EP3SE110F1152C4LN
✅ 直接替換聯絡詢價
查看資料表 →EP3SE80F1152C4N 最大額定值與電氣特性
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Number of LABs/CLBs | 3,200 |
| Total RAM Bits | 6,843,392 |
| Number of I/O | 744 |
| Voltage - Supply | 1.1 V core |
| Operating Frequency (Max) | 717 MHz |
| Process Technology | 65 nm CMOS |
| 安裝類型 | Surface Mount |
| 封裝 / 外殼 | 1152-BBGA, FCBGA |
| 工作溫度 | 0C to +85C (Commercial) |
| Speed Grade | C4 |
| Lead Free | Yes |
| RoHS 狀態 | Compliant |
| Transceivers | 12 high-speed transceivers (per Stratix III E datasheet family) |
EP3SE80F1152C4N 1152-bbga, fcbga 腳位配置指南
EP3SE80F1152C4N（1152-bbga, fcbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SE80F1152C4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SE80F1152C4N 適用於 7 應用s: Telecom Baseband Processing, High-Performance DSP Signal Processing, ASIC Prototyping and Emulation, High-Speed Memory Interface Aggregation, Test and Measurement Instrumentation, Industrial Imaging and Video Processing, Aerospace and Defense Signal Intelligence.
Telecom Baseband Processing
The EP3SE80F1152C4N's 80,000 logic elements and integrated DSP blocks make it well-suited for wireless baseband signal processing. The Stratix III E architecture provides dedicated multiplier blocks and DSP slices that accelerate FFT/IFFT, channelization, and modulation/demodulation operations in LTE and WiMAX base stations. Operating at up to 717 MHz with 1.1 V core supply, the EP3SE80F1152C4N delivers deterministic throughput for real-time baseband tasks while keeping power consumption in check. The 744 user I/Os and integrated high-speed transceivers aggregate antenna data streams, baseband samples, and CPRI/OBSAI backhaul interfaces on one device. Companion parts include EPCQ128 configuration devices and external DDR3 memory buffers.
推薦
High-Performance DSP Signal Processing
Stratix III E devices like the EP3SE80F1152C4N integrate hundreds of dedicated DSP blocks (18x18 multipliers with adders and accumulators), enabling high-throughput FIR filters, matrix operations, and radar processing. The 6,843,392 bits of embedded block RAM (M9K/M144K) hold filter coefficients and intermediate samples on-chip, eliminating off-chip memory bottlenecks in long-tap filter chains. At 717 MHz fabric speed, the device sustains tens of GMACs of DSP throughput, suiting medical imaging front-ends, software-defined radio (SDR), and test-and-measurement digitizer back-ends. The C4 commercial speed grade provides timing margin for production timing closure.
推薦
ASIC Prototyping and Emulation
With 80,000 logic elements and 744 user I/Os, the EP3SE80F1152C4N is widely used as an ASIC prototyping vehicle. Designers partition large ASIC RTL across multiple Stratix III E devices, using the FPGA's high logic density and abundant I/O for multi-FPGA partition bridges. The 1152-FBGA package supports high-bandwidth interconnect between FPGAs in a multi-device emulation farm. Integrated transceivers provide high-speed serial chip-to-chip links for time-domain multiplexing of prototype signals. Industrial speed grade and JTAG-based configuration simplify bring-up in production ASIC bring-up labs.
推薦
High-Speed Memory Interface Aggregation
Stratix III E devices integrate dedicated memory PHY blocks supporting DDR2, DDR3, QDRII, and RLDRAM II interfaces. The EP3SE80F1152C4N's 744 I/Os allow designers to aggregate multiple external memory banks - for example, parallel DDR3 channels for high-bandwidth data buffering in video processing or networking line cards. The device's IOE structure and PLL-based clock tree provide the low-jitter clocks required for DDR3-1600 operation. Embedded M9K/M144K blocks provide on-chip ping-pong buffers to bridge between memory and DSP fabric.
推薦
Test and Measurement Instrumentation
The EP3SE80F1152C4N's combination of high logic density, abundant I/O, and DSP blocks makes it a fit for high-end digitizers, protocol analyzers, and arbitrary waveform generators. The 717 MHz fabric supports multi-GSPS acquisition systems, while embedded transceivers push acquisition data upstream at multi-gigabit rates. Hardware engineers use the FPGA to implement real-time triggering, deep memory management, and protocol-aware pattern generation. Commercial C4 speed grade is widely accepted in test equipment, where production volumes are modest and design flexibility is critical.
推薦
Industrial Imaging and Video Processing
In machine vision and broadcast video applications, the EP3SE80F1152C4N's DSP blocks accelerate pixel-level operations such as color space conversion, image scaling, and edge detection. The 6,843,392 bits of block RAM hold line buffers and frame buffers locally, supporting real-time HD-SDI and SDI video processing at full frame rates. The 744 user I/Os aggregate multiple camera sensors (MIPI, LVDS, parallel CMOS) into a single processing pipeline. The C4 commercial speed grade and Stratix III E low-power fabric make this variant suitable for vision systems with thermal constraints.
推薦
Aerospace and Defense Signal Intelligence
The EP3SE80F1152C4N is commonly used in SIGINT, EW (electronic warfare), and radar systems where reconfigurable processing is essential. Stratix III E's high logic density allows real-time implementation of wideband digital receivers, adaptive beamforming, and signal classification algorithms. The 1152-FBGA package provides rugged mechanical mounting for vibration-prone environments, and the device's deterministic fabric timing supports low-latency decision paths required in threat detection. Per Altera's qualification data, extended temperature and MIL-STD screening variants are available in the same die family for defense applications.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SE80F1152C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SE80F1152C4LN | EP3SE80F1152C4L | EP3SE80F1152C3N | EP3SE80F1152C2N | EP3SE110F1152C4N | EP3SE110F1152C4LN |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 (+37.5%) | 110,000 (+37.5%) |
| Number of LABs | 3,200 | 3,200 | 3,200 | 3,200 | 3,200 | 4,400 | 4,400 |
| Number of I/O | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | C4 | C4 | C4 | C3 (slower) | C2 (slowest) | C4 | C4 |
| Max Operating Frequency | 717 MHz | 717 MHz | 717 MHz | lower (C3 speed) | lower (C2 speed) | 717 MHz | 717 MHz |
主要差異化特點
- Higher logic capacity in same F1152 footprint (對比EP3SE80F1152C2N)
- Direct upgrade path within same package (對比EP3SE110F1152C4N)
- Lead-free manufacturing finish (對比EP3SE80F1152C4L)
設計說明
The Stratix III E EP3SE80F1152C4N requires multiple power rails: 1.1 V core, 2.5 V/3.3 V auxiliary, and per-bank I/O voltages (1.2 V to 3.3 V). Per Altera's Stratix III handbook, a minimum of 16 decoupling capacitors per bank plus bulk capacitance on each rail is required. Use Altera's PowerPlay Early Power Estimator (EPE) to size regulators before layout. Estimated: at 717 MHz with full DSP utilization, the EP3SE80 draws approximately 6-8 A from the 1.1 V rail.
The 1152-FBGA package requires high-density PCB with at least 6 routing layers for fanout, microvia (laser-drilled) stackups, and matched-length routing on differential pairs for high-speed transceivers. Per Altera's Stratix III board design guidelines, keep trace lengths within 0.5 mm tolerance for clocks above 250 MHz, and use length-matched serpentine routing on DDR3 interfaces.
Do not assume pin compatibility between EP3SE80F1152 and EP3SE80F780 packages - the F780 variant has only 488 I/Os in a smaller 780-ball FBGA. Per the Stratix III device handbook, ball maps differ significantly, so any cross-package migration requires PCB redesign. Stay within the F1152 family for drop-in compatibility. The 'N' suffix indicates lead-free finish; non-N variants may have SnPb ball finish and require special PCB assembly profiles.
合規資訊
RoHS compliant per Altera/Intel product page. Lead-free finish confirmed by 'N' suffix in MPN. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. NRND lifecycle status per Altera/Intel product notice.