EP3SE80F1152C4N - 80K Cell Stratix III E FPGA | Intel / Altera
부품 번호: EP3SE80F1152C4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1822.78 | $1,822.78 |
| 10 | $1690 | $16,900.00 |
| 25 | $1560 | $39,000.00 |
| 50 | $1485 | $74,250.00 |
| 100 | $1395 | $139,500.00 |
EP3SE80F1152C4N 개요
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy a unique position in the digital IC hierarchy: programmable logic device (PLD) -> FPGA -> high-density programmable logic, enabling hardware reconfiguration that ASICs cannot match. Stratix III E is engineered for high-performance, power-optimized applications such as DSP, baseband processing, and high-throughput data pipelines.
Key features include 717 MHz maximum internal operating frequency, 1.1 V core supply, integrated DSP blocks for high-throughput arithmetic, 12 transceivers supporting multi-gigabit serial I/O, and a low-power FPGA fabric optimized for power efficiency. The 1152-ball FC-FBGA package provides 744 user I/Os, making it ideal for high-pin-count designs requiring dense signal fan-out.
Architecturally, Stratix III E uses a 65 nm process and combines hard DSP blocks, M9K/M144K block RAM, and dedicated memory interfaces (DDR2/DDR3/QDRII/RLDRAM) on a programmable interconnect fabric. The C4 speed grade and industrial temperature grading make this part suitable for demanding signal-processing applications.
Typical applications include telecom baseband processing, high-performance digital signal processing, ASIC prototyping, test and measurement instrumentation, and high-speed serial interface aggregation. The device integrates transceivers up to 6.375 Gbps depending on configuration.
When designing with the EP3SE80F1152C4N, ensure the PCB layout follows Intel/Altera's recommended power plane stacking, decoupling capacitor guidelines, and JTAG chain configuration to fully leverage the Stratix III architecture's signal integrity.
This page synthesizes distributor pricing, drop-in Stratix III E alternatives within the same 1152-FBGA footprint, and practical FPGA design notes that complement the manufacturer datasheet.
드롭인 대체품: EP3SE80F1152C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE80F1152C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Configuration Method, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE80F1152C4LN
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1907.77 / 개
데이터시트 보기 →EP3SE80F1152C4L
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2280 / 개
데이터시트 보기 →EP3SE80F1152C4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$895 / 개
데이터시트 보기 →EP3SE80F1152C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1690 / 개
데이터시트 보기 →EP3SE80F1152C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1880 / 개
데이터시트 보기 →EP3SE80F1152C2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2685 / 개
데이터시트 보기 →EP3SE110F1152C4N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP3SE110F1152C4LN
✅ 드롭인✓ 재고 있음
$3510 / 개
데이터시트 보기 →EP3SE80F1152C4N 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Number of LABs/CLBs | 3,200 |
| Total RAM Bits | 6,843,392 |
| Number of I/O | 744 |
| Voltage - Supply | 1.1 V core |
| Operating Frequency (Max) | 717 MHz |
| Process Technology | 65 nm CMOS |
| 실장 유형 | Surface Mount |
| 패키지 / 케이스 | 1152-BBGA, FCBGA |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C4 |
| Lead Free | Yes |
| RoHS 상태 | Compliant |
| Transceivers | 12 high-speed transceivers (per Stratix III E datasheet family) |
EP3SE80F1152C4N 1152-bbga, fcbga 핀 구성 가이드
EP3SE80F1152C4N(1152-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE80F1152C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE80F1152C4N 적합 용도: 7 애플리케이션s: Telecom Baseband Processing, High-Performance DSP Signal Processing, ASIC Prototyping and Emulation, High-Speed Memory Interface Aggregation, Test and Measurement Instrumentation, Industrial Imaging and Video Processing, Aerospace and Defense Signal Intelligence.
Telecom Baseband Processing
The EP3SE80F1152C4N's 80,000 logic elements and integrated DSP blocks make it well-suited for wireless baseband signal processing. The Stratix III E architecture provides dedicated multiplier blocks and DSP slices that accelerate FFT/IFFT, channelization, and modulation/demodulation operations in LTE and WiMAX base stations. Operating at up to 717 MHz with 1.1 V core supply, the EP3SE80F1152C4N delivers deterministic throughput for real-time baseband tasks while keeping power consumption in check. The 744 user I/Os and integrated high-speed transceivers aggregate antenna data streams, baseband samples, and CPRI/OBSAI backhaul interfaces on one device. Companion parts include EPCQ128 configuration devices and external DDR3 memory buffers.
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High-Performance DSP Signal Processing
Stratix III E devices like the EP3SE80F1152C4N integrate hundreds of dedicated DSP blocks (18x18 multipliers with adders and accumulators), enabling high-throughput FIR filters, matrix operations, and radar processing. The 6,843,392 bits of embedded block RAM (M9K/M144K) hold filter coefficients and intermediate samples on-chip, eliminating off-chip memory bottlenecks in long-tap filter chains. At 717 MHz fabric speed, the device sustains tens of GMACs of DSP throughput, suiting medical imaging front-ends, software-defined radio (SDR), and test-and-measurement digitizer back-ends. The C4 commercial speed grade provides timing margin for production timing closure.
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ASIC Prototyping and Emulation
With 80,000 logic elements and 744 user I/Os, the EP3SE80F1152C4N is widely used as an ASIC prototyping vehicle. Designers partition large ASIC RTL across multiple Stratix III E devices, using the FPGA's high logic density and abundant I/O for multi-FPGA partition bridges. The 1152-FBGA package supports high-bandwidth interconnect between FPGAs in a multi-device emulation farm. Integrated transceivers provide high-speed serial chip-to-chip links for time-domain multiplexing of prototype signals. Industrial speed grade and JTAG-based configuration simplify bring-up in production ASIC bring-up labs.
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High-Speed Memory Interface Aggregation
Stratix III E devices integrate dedicated memory PHY blocks supporting DDR2, DDR3, QDRII, and RLDRAM II interfaces. The EP3SE80F1152C4N's 744 I/Os allow designers to aggregate multiple external memory banks - for example, parallel DDR3 channels for high-bandwidth data buffering in video processing or networking line cards. The device's IOE structure and PLL-based clock tree provide the low-jitter clocks required for DDR3-1600 operation. Embedded M9K/M144K blocks provide on-chip ping-pong buffers to bridge between memory and DSP fabric.
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Test and Measurement Instrumentation
The EP3SE80F1152C4N's combination of high logic density, abundant I/O, and DSP blocks makes it a fit for high-end digitizers, protocol analyzers, and arbitrary waveform generators. The 717 MHz fabric supports multi-GSPS acquisition systems, while embedded transceivers push acquisition data upstream at multi-gigabit rates. Hardware engineers use the FPGA to implement real-time triggering, deep memory management, and protocol-aware pattern generation. Commercial C4 speed grade is widely accepted in test equipment, where production volumes are modest and design flexibility is critical.
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Industrial Imaging and Video Processing
In machine vision and broadcast video applications, the EP3SE80F1152C4N's DSP blocks accelerate pixel-level operations such as color space conversion, image scaling, and edge detection. The 6,843,392 bits of block RAM hold line buffers and frame buffers locally, supporting real-time HD-SDI and SDI video processing at full frame rates. The 744 user I/Os aggregate multiple camera sensors (MIPI, LVDS, parallel CMOS) into a single processing pipeline. The C4 commercial speed grade and Stratix III E low-power fabric make this variant suitable for vision systems with thermal constraints.
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Aerospace and Defense Signal Intelligence
The EP3SE80F1152C4N is commonly used in SIGINT, EW (electronic warfare), and radar systems where reconfigurable processing is essential. Stratix III E's high logic density allows real-time implementation of wideband digital receivers, adaptive beamforming, and signal classification algorithms. The 1152-FBGA package provides rugged mechanical mounting for vibration-prone environments, and the device's deterministic fabric timing supports low-latency decision paths required in threat detection. Per Altera's qualification data, extended temperature and MIL-STD screening variants are available in the same die family for defense applications.
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추천 제품 요약
엔지니어링 참조 데이터: EP3SE80F1152C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE80F1152C4LN | EP3SE80F1152C4L | EP3SE80F1152C3N | EP3SE80F1152C2N | EP3SE110F1152C4N | EP3SE110F1152C4LN |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 (+37.5%) | 110,000 (+37.5%) |
| Number of LABs | 3,200 | 3,200 | 3,200 | 3,200 | 3,200 | 4,400 | 4,400 |
| Number of I/O | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | C4 | C4 | C4 | C3 (slower) | C2 (slowest) | C4 | C4 |
| Max Operating Frequency | 717 MHz | 717 MHz | 717 MHz | lower (C3 speed) | lower (C2 speed) | 717 MHz | 717 MHz |
주요 차별점
- Higher logic capacity in same F1152 footprint (vs EP3SE80F1152C2N)
- Direct upgrade path within same package (vs EP3SE110F1152C4N)
- Lead-free manufacturing finish (vs EP3SE80F1152C4L)
설계 노트
The Stratix III E EP3SE80F1152C4N requires multiple power rails: 1.1 V core, 2.5 V/3.3 V auxiliary, and per-bank I/O voltages (1.2 V to 3.3 V). Per Altera's Stratix III handbook, a minimum of 16 decoupling capacitors per bank plus bulk capacitance on each rail is required. Use Altera's PowerPlay Early Power Estimator (EPE) to size regulators before layout. Estimated: at 717 MHz with full DSP utilization, the EP3SE80 draws approximately 6-8 A from the 1.1 V rail.
The 1152-FBGA package requires high-density PCB with at least 6 routing layers for fanout, microvia (laser-drilled) stackups, and matched-length routing on differential pairs for high-speed transceivers. Per Altera's Stratix III board design guidelines, keep trace lengths within 0.5 mm tolerance for clocks above 250 MHz, and use length-matched serpentine routing on DDR3 interfaces.
Do not assume pin compatibility between EP3SE80F1152 and EP3SE80F780 packages - the F780 variant has only 488 I/Os in a smaller 780-ball FBGA. Per the Stratix III device handbook, ball maps differ significantly, so any cross-package migration requires PCB redesign. Stay within the F1152 family for drop-in compatibility. The 'N' suffix indicates lead-free finish; non-N variants may have SnPb ball finish and require special PCB assembly profiles.
규정 준수 정보
RoHS compliant per Altera/Intel product page. Lead-free finish confirmed by 'N' suffix in MPN. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. NRND lifecycle status per Altera/Intel product notice.