EP4CE15E22C9L - 15,408-Cell 60 nm Cyclone IV E FPGA | Intel
MPN： EP4CE15E22C9L ✗ 停產EP4CE15E22C9L 概覽
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after fabrication. A configurable FPGA combines programmable logic blocks, embedded memory, and programmable I/O into one device. Within the device hierarchy, the EP4CE15E22C9L belongs to the Cyclone IV E FPGA family, which provides a higher level of integration than basic programmable logic arrays while supporting parallel interface logic, control functions, and moderate levels of on-chip data processing.
The Cyclone IV E device provides 15,408 logic elements and 516,096 embedded-memory bits for implementing state machines, datapaths, protocol bridges, controllers, and general-purpose digital logic. Its 81 I/O pins make the device suitable for designs requiring numerous external connections. The 144-pin LQFP exposed-pad package supports conventional surface-mount assembly while providing a thermal and ground connection through its exposed pad.
The EP4CE15E22C9L operates from a 1.2 V core supply and uses 60 nm process technology. These figures position it as a low-power, moderately integrated FPGA for cost-sensitive embedded systems. Configuration programming determines the logic implemented inside the device, allowing one physical component to support multiple product functions when appropriate design tools and configuration data are used.
Typical uses include industrial automation, communications interfaces, consumer electronics, test equipment, and embedded control systems. The FPGA can implement parallel sensor acquisition, custom protocol handling, timing controls, display or data-acquisition logic, and supervisory functions. Designs combining an FPGA with a microcontroller or dedicated interface IC can partition work between configurable parallel logic and sequential embedded processing.
PCB implementation should account for the exposed thermal pad, supply decoupling, configuration pins, and the requirements of the selected Cyclone design tools. Use the manufacturer pin-description table when assigning tracks, and follow the device power-up and configuration sequence before enabling dependent circuitry. Thermal performance and signal integrity depend on stack-up, return paths, component placement, and the switching activity of the implemented logic.
This product page consolidates device identity, package details, verified technical parameters, drop-in alternatives, comparison parameters, and practical design guidance. It is intended to accelerate component review while leaving final programming, timing, power, and PCB decisions to the system design engineer.
直接替換替代品，適用於 EP4CE15E22C9L — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4CE15E22C9L （相同外形與佔位） — 差異在於 Process Technology, Package, Speed Grade, Logic Elements, Mounting Type.
EP4CE15E22C8N
✅ 直接替換聯絡詢價
查看資料表 →EP4CE15E22C7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4CE15E22C6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4CE15E22C9N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP4CE15F23C8N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4CE15E22C9L 最大額定值與電氣特性
| Device Type | Cyclone IV E Field Programmable Gate Array (FPGA) |
| Logic Elements | 15,408 cells |
| Embedded Memory | 516,096 bits |
| I/O Count | 81 pins |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| Total Package Pins | 144 pins |
| 封裝 | 144-LQFP Exposed Pad |
| Package Code | HLFQFP |
| Terminal Form | Gull wing |
| Package Shape | Square |
| 安裝方式 | Surface mount |
| Temperature Grade | Other |
| Programmable Device Type | FPGA |
EP4CE15E22C9L square 腳位配置指南
EP4CE15E22C9L（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4CE15E22C9L.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4CE15E22C9L 適用於 6 應用s: Industrial Automation Controller, Communications Interface and Protocol Bridge, Data Acquisition and Signal Processing, Test and Measurement Instrumentation, Consumer and Embedded Control, Video and Display Interface Logic.
Industrial Automation Controller
The EP4CE15E22C9L fits industrial automation controllers that combine deterministic parallel control with programmable logic. Its 15,408 logic elements can implement interlocks, state machines, sequencing engines, and machine I/O expansion, while 81 I/O pins provide substantial connectivity for sensors, actuators, encoders, and discrete control signals. The 1.2 V core supply and 60 nm process support a cost-conscious embedded implementation, and the 144-pin exposed-pad LQFP provides a conventional surface-mount assembly option. Configure the device for timing-critical sequencing and use its embedded 516,096 memory bits for counters, status tables, and communication staging. Final qualification must confirm the operating-temperature requirement for the installation environment.
推薦
Communications Interface and Protocol Bridge
The EP4CE15E22C9L is suitable for communications interfaces requiring parallel datapaths, custom framing, and multiple external signals. Its 15,408 logic elements can accommodate transmit and receive state machines, FIFO control, CRC processing, and protocol conversion, while the 81 I/O pins support parallel buses and control channels. The 516,096 embedded-memory bits can hold packet data, command queues, or lookup information without external memory in moderately sized designs. Compared with a hardwired interface ASIC, the FPGA permits field-reconfigurable logic and faster product revisions. Its lower speed grade relative to more demanding fabric devices should be checked against the selected data rate, and all external interfaces must use properly terminated, impedance-controlled routing.
推薦
Data Acquisition and Signal Processing
The EP4CE15E22C9L can implement the parallel control, filtering, and data-routing logic around a mixed-signal acquisition system. With 15,408 logic elements, it can coordinate converters, apply fixed-point operations, perform thresholding, and organize samples for transfer to a processor. Its 81 I/O pins are useful for converter data buses, clocks, chip selects, and synchronization signals, while the embedded 516,096 memory bits support sample buffering and test-pattern storage. The 1.2 V core device should have local decoupling and a quiet return path to minimize data-dependent switching effects. A separate analog front end remains necessary for sensor conditioning, and sampling-clock timing should be validated against the selected converter specifications.
推薦
Test and Measurement Instrumentation
The EP4CE15E22C9L fits programmable test and measurement logic requiring configurable timing, acquisition sequencing, and analysis. Its logic-element array can implement vector generation, result comparison, trigger logic, counters, and custom interface protocols, while 81 I/O pins allow direct connection to test fixtures and converters. The embedded memory can hold calibration tables, limit values, sequences, or captured result sets. Because the device uses a 1.2 V core supply, power planning should separate core requirements from external interface levels and use level translation where necessary. The 144-pin exposed-pad LQFP is convenient for board-level assembly, but thermal verification remains important when the implemented logic drives high toggle rates through many external pins.
推薦
Consumer and Embedded Control
The EP4CE15E22C9L can serve as the configurable logic core in consumer and embedded products that require custom sequencing without a large application processor. Typical functions include keypad scanning, display timing, motor-step generation, peripheral arbitration, and low-rate communication handling. The 15,408 logic elements and 516,096 memory bits are sufficient for control-oriented designs with moderate storage requirements, while 81 I/O pins reduce the need for external I/O expanders. The 60 nm Cyclone IV E implementation supports a straightforward embedded design, while the exposed-pad package requires a defined thermal and electrical land pattern. Configuration storage and boot behavior must be designed as part of the system rather than treated as automatic device features.
推薦
Video and Display Interface Logic
The EP4CE15E22C9L can support display timing, pixel-format conversion, overlay generation, and synchronized control in moderate-resolution embedded video systems. Its 15,408 logic elements allow parallel timing generators and modest pixel pipelines, while 81 I/O pins can drive a restricted external interface if voltage and timing requirements are satisfied. Embedded memory can store lookup data, masks, and frame-pattern information for simple overlay or test functions. The device is not intended to replace a dedicated high-performance video processor in demanding 4K or multi-layer pipelines. Video timing, color depth, refresh rate, and memory bandwidth should therefore be calculated before assigning resources, and clocking should use a low-skew distribution arrangement matched to the implemented interface.
推薦
推薦產品摘要
工程參考資料，適用於 EP4CE15E22C9L — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4CE15E22C8N | EP4CE15E22C7N | EP4CE15E22C6N | EP4CE15E22C9N | EP4CE15F23C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad |
| FPGA Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Speed Grade | C9 | C8 | C7 | C6 | C9 | C8 |
| Logic Elements | 15,408 cells | 15,408 cells | 15,408 cells | 15,408 cells | 15,408 cells | Approximately 23,000 cells |
| Process Technology | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Ordering Suffix | L | N | N | N | N | N |
主要差異化特點
- Higher C9 speed grade than the direct C8 alternative (對比EP4CE15E22C8N)
- Exact C9 timing class for designs needing additional margin (對比EP4CE15E22C6N)
- Lower logic-element class supports a more focused control design (對比EP4CE15F23C8N)
- Specified exposed-pad package supports conventional assembly (對比EP4CE15E22C8N)
設計說明
Use the manufacturer exposed-pad land pattern and connect the pad to the intended ground or thermal plane according to the device pin-description table. Place the core-supply bypass capacitors close to their assigned power pins with short current loops, and provide a low-impedance return path beneath the package. Because the package contains 144 pins but the device exposes 81 user I/O pins, do not treat every package lead as a general-purpose user connection.
A speed-grade substitution is not automatically transparent. Changing from EP4CE15E22C9L to EP4CE15E22C8N can alter the timing margin of internal logic and external I/O paths. Re-run synthesis, place-and-route, and static timing analysis at the replacement grade, then inspect clock constraints, setup and hold margins, and asynchronous input paths before releasing a replacement order.
Estimate the implementation's thermal requirement from core power, I/O activity, package construction, and the PCB's copper area. The exposed pad must be connected according to the manufacturer layout guidance, but it is not a substitute for a thermal analysis. If operating temperature, switching activity, or board orientation can change, validate the hottest operating condition and preserve airflow or copper spreading around the package.
Route clocks separately from high-speed data wherever practical, provide continuous reference planes, and avoid stubs on sensitive nets. The 81 I/O pins should be assigned according to bank voltage and interface requirements rather than solely by convenience. Validate edge rates, trace lengths, terminations, and external driver strength with the actual logic configuration because implemented switching activity determines the usable timing margin.
合規資訊
The EP4CE15E22C9L is an FPGA rather than an automotive-qualified device. RoHS, REACH, lead-free, halogen-free, and conflict-minerals status require confirmation from the manufacturer or authorized supply documentation for the exact orderable MPN.