EP3C25E144C8 - 24,624-Cell Cyclone III FPGA | Intel
MPN： EP3C25E144C8 ✗ 停產EP3C25E144C8 概覽
A field-programmable gate array, or FPGA, is a programmable semiconductor in which configurable logic blocks, memory resources, and programmable I/O replace a fixed digital circuit. An FPGA belongs to the semiconductor hierarchy and provides parallel hardware implementation without changing the physical IC. The Cyclone III family is positioned for cost-sensitive embedded, communications, industrial, and control applications requiring programmable logic and deterministic hardware behavior.
The EP3C25E144C8 combines 24,624 logic elements with 82 user I/O in a relatively compact 144-LQFP package. Its 608,256 bits of embedded memory support data buffering, state machines, lookup-table structures, and modest on-chip data storage. The stated 402 MHz maximum frequency provides a useful headline figure for timing planning, although actual interface performance must be evaluated against the applicable Cyclone III timing and power guidance.
The device uses a 65 nm process technology and a 1.2 V core voltage. These figures place it in the low-voltage programmable-logic class, where board design must provide stable core and I/O supplies and appropriate decoupling. The exposed thermal pad in the LQFP package provides the primary thermal path from the device to the PCB, making copper area, thermal vias, and airflow important in high-utilization designs.
Typical uses include industrial control, communications interfaces, instrumentation, embedded signal processing, and general-purpose logic consolidation. Its 82 I/O are suitable for parallel data buses, status and control signals, clocks, and moderate external memory interfaces. The 144-pin exposed-pad package also offers a manageable board footprint compared with larger FPGA packages while supporting substantially more programmable resources than a simple logic device.
Designers should treat FPGA migration and timing closure as deliberate engineering steps. Validate pin assignments against the selected board configuration, constrain all clock and I/O paths, confirm the pinout for the exact EP3C25E144C8 ordering code, and budget the exposed pad for thermal dissipation. A replacement part should be accepted only after its pinout, speed grade, voltage requirements, configuration compatibility, and intended package have been checked.
This page consolidates the verified distributor specifications, package and sourcing information, same-family drop-in candidates, and application-oriented design guidance for engineers evaluating the Intel EP3C25E144C8. It also distinguishes documented facts from parameters that require confirmation from the manufacturer datasheet or the incumbent design.
直接替換替代品，適用於 EP3C25E144C8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3C25E144C8 （相同外形與佔位） — 差異在於 Core Supply Voltage, Maximum Frequency, Package.
EP3C25E144C8N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3C25E144C8NES
✅ 直接替換📋 參考替代品（不在目錄中）
EP3C25E144C8N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP3C25E144C6
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP3C25E144C7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3C25E144C8 最大額定值與電氣特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Elements | 24,624 |
| User I/O Count | 82 I/O |
| Embedded Memory | 608,256 bits |
| Maximum Frequency | 402 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 65 nm |
| 封裝 | 144-LQFP Exposed Pad |
| Package Pin Count | 144 pins |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
EP3C25E144C8 144 pins 腳位配置指南
EP3C25E144C8（144 pins 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3C25E144C8.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3C25E144C8 適用於 6 應用s: Industrial Control and Automation, Data Acquisition and Signal Conditioning, Communications Interface Consolidation, USB Device Interface, Embedded Instrumentation, Programmable Logic Consolidation.
Industrial Control and Automation
The EP3C25E144C8 fits compact programmable controllers that coordinate sensors, actuators, interlocks, and machine sequencing. Its 82 I/O provide practical capacity for digital inputs, outputs, counters, and parallel buses, while 24,624 logic elements can implement timing, state-machine, and control functions in parallel hardware. The 402 MHz stated maximum frequency supports demanding control datapaths, but the selected board must still meet Cyclone III timing constraints. A production design should use 1.2 V core decoupling, continuous ground planes, and an exposed-pad thermal path. Before industrial qualification, confirm the exact operating-temperature grade, supported I/O standards, isolation requirements, and current lifecycle policy.
推薦
Data Acquisition and Signal Conditioning
The EP3C25E144C8 can consolidate parallel data acquisition, digital filtering, trigger control, and data formatting in one programmable device. The 608,256 embedded-memory bits provide on-chip storage for samples, descriptors, and intermediate processing, reducing external-memory traffic for moderate acquisition rates. Its 82 I/O allow connection to parallel sensors, converters, counters, and interface logic. Engineers should constrain all acquisition and clock paths, account for input-slew and output-loading requirements, and verify the supported I/O standards. Because the supplied data does not identify ADC functionality or performance-grade I/O, the FPGA should serve as digital control and processing rather than be assumed to perform analog conversion.
推薦
Communications Interface Consolidation
The EP3C25E144C8 is suitable for consolidating protocol converters, packet formatting, and legacy parallel-interface bridges. Its 82 user I/O support data buses, control signals, clocks, and handshake lines, while the programmable logic fabric can execute framing, buffering, and state management concurrently. The stated 402 MHz maximum operating frequency provides substantial timing margin for many moderate-rate interfaces, although actual throughput depends on I/O standards and board-level timing. For communications equipment, constrain source-synchronous paths, verify clock-domain crossings, and test the exposed pad under sustained logic activity. Lifecycle and exact temperature-grade confirmation remain essential for long-lived network infrastructure.
推薦
USB Device Interface
The EP3C25E144C8 can implement USB-facing protocol logic and interface buffering when the incumbent design has already been validated with the Cyclone III architecture. Its 24,624 logic elements and 608,256 memory bits are sufficient for moderate control-plane and data-path functions, while 82 I/O support the parallel side of a USB transceiver interface. The design should isolate USB clocking, apply source-synchronous timing constraints, and follow the transceiver vendor's reference layout. USB compliance still depends on the external PHY, firmware, protocol implementation, and validation effort; the FPGA does not provide USB certification by itself.
推薦
Embedded Instrumentation
The EP3C25E144C8 can implement measurement sequencing, calibration tables, digital filtering, and instrument control in a single programmable device. Its embedded memory can hold configuration data and intermediate samples, while 82 I/O support sensors, displays, front-panel controls, and status indicators. The 402 MHz stated maximum frequency allows parallel filtering or correlation functions to execute efficiently, subject to actual timing closure. A practical instrumentation implementation should separate analog input conditioning from the FPGA, add clock jitter margin, and keep sensitive routing away from high-current switching nodes. Verify supported I/O voltage, operating temperature, and configuration reliability before using the part in safety- or measurement-critical equipment.
推薦
Programmable Logic Consolidation
The EP3C25E144C8 is useful for consolidating several fixed functions into one programmable device, including glue logic, counters, protocol engines, and buffer controllers. The 24,624 logic elements and 608,256 bits of embedded memory provide a moderate logic budget, while the 82 I/O keep the design within a 144-LQFP exposed-pad footprint. Consolidation can reduce board count, but timing closure, pin assignment, power budgeting, and partial reconfiguration considerations may become more complex. Engineers should establish a clear resource and I/O budget before migration, preserve the original pin constraints, and perform post-route timing verification. The exposed pad must remain thermally connected to a low-impedance ground structure to avoid localized heating.
推薦
推薦產品摘要
工程參考資料，適用於 EP3C25E144C8 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3C25E144C8N | EP3C25E144C8NES | EP3C25E144C8N | EP3C25E144C6 | EP3C25E144C7 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
主要差異化特點
- Same verified resource configuration for the N suffix (對比EP3C25E144C8N)
- Verified package, terminal, and functional consistency (對比EP3C25E144C8NES)
- Directly documented procurement visibility (對比EP3C25E144C6)
設計說明
Treat the exposed pad as the FPGA's primary thermal and electrical-ground path. Place the EP3C25E144C8 over a continuous ground plane, add multiple thermal vias where the PCB design rules permit, and provide sufficient copper area to distribute heat. The supplied data does not contain junction-temperature limits, thermal resistance, or worst-case power, so do not infer thermal performance from the 402 MHz headline frequency. Use the manufacturer power calculator and package data with the actual design's logic utilization and switching activity.
Design the 1.2 V core rail as a dedicated, low-noise supply and verify startup sequencing against all I/O voltage requirements. Place local high-frequency decoupling at the supply pins and use bulk capacitance only after calculating its effect on inrush and control-loop stability. Because the verified data does not provide current limits, power dissipation, configuration-pin requirements, or permissible I/O voltage combinations, use the manufacturer electrical-characteristics table before finalizing rail capacity, sequencing, and power-fault behavior.
Preserve the original Cyclone III pin constraints and route configuration, clock, and user-I/O signals according to the manufacturer layout guidance. The 82 user I/O make pin assignment a central part of the design because incorrect assignments can prevent configuration or create contention. For a replacement, compare the entire pin table rather than checking only package dimensions. Use a differential-pair geometry appropriate to every active I/O standard, maintain return paths, and separate clocks from noisy switching outputs.
Do not treat an identical package drawing as proof of drop-in compatibility. Validate the complete pinout, exposed-pad connection, core voltage, supported I/O standards, speed grade, temperature grade, configuration interface, and bitstream compatibility. The supplied search results confirm close same-family candidates, but they do not include the complete electrical tables. Keep a reviewed cross-reference record with the selected alternate MPN and test the assembled board at temperature before authorizing field replacement.
合規資訊
The supplied verified data does not contain authoritative compliance declarations for EP3C25E144C8. Obtain the current Intel product declaration and applicable material disclosures before production release.
