EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
MPN： EP4CGX50DF27I6N ✓ 啟用中EP4CGX50DF27I6N 概覽
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hardened functional blocks such as transceivers and PLLs. FPGAs sit at the top of the programmable-logic taxonomy (FPGA -> programmable logic -> digital IC -> semiconductor), enabling engineers to implement custom digital circuits, glue logic, DSP pipelines, and high-speed serial interfaces without committing to a mask-programmed ASIC. Cyclone IV GX further specializes this class by adding 3.125 Gbps multi-gigabit transceivers (MGTs) targeted at protocols such as PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI at very low static power.
Key features of the EP4CGX50DF27I6N include up to 3.125 Gbps transceiver data rate, 8 transceiver channels, 49,888 logic elements, 2,502 Kbits of embedded RAM, 113 embedded 18x18 multipliers, four general-purpose PLLs, and 310 maximum user I/O pins. Transceiver channels support common serial standards including PCIe Gen1 x1/x2, Gigabit Ethernet, Serial RapidIO v1.3, and CPRI, while 3.3 V-tolerant LVTTL/LVCMOS and LVDS I/O accommodate mixed-voltage legacy buses. The device is offered in the industrial temperature grade (-40C to +100C junction), suiting outdoor, factory-floor, and uncontrolled-environment deployments.
The Cyclone IV GX architecture pairs the transceiver-rich I/O ring with a fine-grained logic fabric, dedicated 9-Kbit M9K memory blocks, and DSP block multipliers. The static power consumption is typically below 1 W for most designs because the 60 nm low-power (LP) process minimizes leakage. Configuration is supported through Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG modes, with built-in optional 16-bit CRC and 128-bit AES encryption for design security.
Typical applications include industrial motor control and drive interfaces, low-cost PCIe endpoint cards, video surveillance and broadcast bridging, software-defined radio front-ends, and factory-automation backplanes. The combination of low cost, integrated transceivers, and small FBGA footprint makes the EP4CGX50 family especially popular in volume production designs.
When designing with this part, choose the F27 (672-ball FBGA) variant when higher I/O count and maximum transceiver availability are required; the F23 (484-ball) variant is the lower-pin-count alternative in the same family. Designers should follow Intel/Altera PCB guidelines for FBGA fan-out, signal-integrity simulation of transceiver channels, and reference decoupling on each VCC/VCCIO/VCCPT/VCCA supply rail.
This page synthesizes distributor pricing, verified drop-in alternatives from the same Cyclone IV GX family, and practical design notes not found in the manufacturer datasheet, providing an at-a-glance engineering reference for procurement and design-in decisions.
直接替換替代品，適用於 EP4CGX50DF27I6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4CGX50DF27I6N （相同外形與佔位） — 差異在於 Package, Embedded Memory, Operating Temperature, Speed Grade, Transceivers.
EP4CGX50DF27C6N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX50DF27C7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX50DF27C8N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX50DF27I7N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX50DF27I8N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX50DF27I6N 最大額定值與電氣特性
| Family | Cyclone IV GX |
| Logic Elements | 49,888 |
| Process Technology | 60 nm low-power |
| Core Voltage | 1.2 V |
| Embedded Memory | 2,502 Kbits |
| Embedded Multipliers (18x18) | 113 |
| Maximum User I/O | 310 |
| Transceiver Channels | 8 |
| Transceiver Data Rate | up to 3.125 Gbps |
| General-purpose PLLs | 4 |
| 封裝 | 672-ball FBGA (F27) |
| Operating Temperature (Industrial grade) | -40C to +100C junction |
| Configuration Modes | AS, PS, FPP, JTAG |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
EP4CGX50DF27I6N 672-ball fbga (f27) 腳位配置指南
EP4CGX50DF27I6N（672-ball fbga (f27) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4CGX50DF27I6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4CGX50DF27I6N 適用於 7 應用s: Industrial Motor Control and Drive Interfaces, Low-Cost PCIe Gen1 Endpoint Cards, Video Surveillance and Broadcast Bridging, Software-Defined Radio Front-Ends, Factory Automation Backplanes and Protocol Bridging, Gigabit Ethernet Network Interface Cards, Test and Measurement Instrumentation.
Industrial Motor Control and Drive Interfaces
The EP4CGX50DF27I6N's combination of 49,888 logic elements, 113 18x18 DSP multipliers, and 8 multi-gigabit transceivers makes it well suited for industrial motor-control and drive-interface applications. Its 60 nm low-power process keeps thermal dissipation under 1 W static, allowing fanless operation in sealed industrial enclosures, while the industrial -40C to +100C junction range supports outdoor and factory-floor deployment. The device can implement multi-axis field-oriented control (FOC) loops, encoder interfaces (EnDat, BiSS, SSI), and EtherCAT or PROFIBUS protocol bridges in a single chip.
推薦
Low-Cost PCIe Gen1 Endpoint Cards
With 8 multi-gigabit transceivers supporting PCIe Gen1 (x1/x2) hard IP, the EP4CGX50DF27I6N enables cost-optimized PCIe endpoint cards such as data-acquisition boards, low-cost FPGA co-processors, and protocol analyzer cards. The transceiver channels provide built-in 8B/10B encoding, word alignment, and channel bonding for multi-lane PCIe, eliminating external PHY components. Designers can pair the FPGA with an external PCIe clock buffer and small EEPROM for configuration, achieving a complete PCIe x1 endpoint at minimal BOM cost.
推薦
Video Surveillance and Broadcast Bridging
The 310 maximum user I/Os and 8 transceivers of the EP4CGX50DF27I6N enable multi-channel SDI/HD-SDI video routing, broadcast format conversion, and IP-based video bridging designs. The 113 DSP multipliers support real-time video processing such as scaling, deinterlacing, and color space conversion at 1080p60. Multiple transceiver channels can carry uncompressed SDI streams while LVDS pairs drive external HDMI or DisplayPort bridges, making this FPGA a popular choice for broadcast auxiliary equipment.
推薦
Software-Defined Radio Front-Ends
The 3.125 Gbps transceiver channels of the EP4CGX50DF27I6N can interface with high-speed ADCs and DACs in software-defined radio (SDR) front-ends, supporting CPRI up to 2.457 Gbps for remote-radio-head (RRH) applications. The 113 18x18 multipliers and 4 PLLs provide ample DSP and clocking resources for digital down-conversion, channelization, and pulse-shaping. Industrial-grade temperature support and 1.2 V low-power operation suit outdoor RRH deployments where thermal management is constrained.
推薦
Factory Automation Backplanes and Protocol Bridging
The EP4CGX50DF27I6N's 8 transceiver channels and rich I/O complement enable multi-protocol bridging on factory-automation backplanes, supporting PROFIBUS, PROFINET IRT, EtherCAT, Modbus TCP, and Serial RapidIO simultaneously. The 60 nm low-power process keeps the FPGA within 1 W static dissipation, important for sealed backplane modules. Embedded M9K memory blocks (totaling 2,502 Kbits) buffer high-speed industrial packet streams while the 4 PLLs generate independent clocks for each protocol domain.
推薦
Gigabit Ethernet Network Interface Cards
The 8 transceivers of the EP4CGX50DF27I6N support up to 8 Gigabit Ethernet (1000BASE-KX/SGMII) ports, enabling quad-port or octal-port network interface cards, industrial Ethernet switches, and TSN (time-sensitive networking) endpoints. The integrated PCS functions handle SGMII autonegotiation and 1000BASE-X clause 37, reducing external PHY complexity. Industrial temperature support and 128-bit AES bitstream encryption make this FPGA suitable for secure industrial networking hardware deployed in harsh environments.
推薦
Test and Measurement Instrumentation
With 310 user I/Os and 8 transceivers, the EP4CGX50DF27I6N is widely used in test and measurement instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers. The 113 DSP multipliers accelerate real-time signal processing for jitter analysis and eye-diagram measurement, while the industrial temperature grade supports benchtop and portable instruments. The 128-bit AES bitstream encryption protects proprietary test IP from unauthorized cloning, an important feature for commercial test equipment vendors.
推薦
推薦產品摘要
工程參考資料，適用於 EP4CGX50DF27I6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4CGX50DF27C6N | EP4CGX50DF27C7N | EP4CGX50DF27C8N | EP4CGX50DF27I7N | EP4CGX50DF27I8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 49,888 | 49,888 |
| Transceiver Channels | 8 | 8 | 8 | 8 | 8 | 8 |
| Speed Grade | I6 (industrial, fast) | C6 (commercial, fast) | C7 (commercial, medium) | C8 (commercial, slow) | I7 (industrial, medium) | I8 (industrial, slow) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory | 2,502 Kbits | 2,502 Kbits | 2,502 Kbits | 2,502 Kbits | 2,502 Kbits | 2,502 Kbits |
| Maximum User I/O | 310 | 310 | 310 | 310 | 310 | 310 |
| Transceiver Data Rate | up to 3.125 Gbps | up to 3.125 Gbps | up to 3.125 Gbps | up to 3.125 Gbps | up to 3.125 Gbps | up to 3.125 Gbps |
主要差異化特點
- Fastest industrial-grade speed grade (I6) in the Cyclone IV GX F27 family (對比EP4CGX50DF27I8N)
- Industrial temperature grade (-40C to +100C) versus commercial-grade variants (對比EP4CGX50DF27C6N)
- Maximum transceiver count (8 channels) at the F27 672-ball FBGA package (對比EP4CGX50DF23I7N (F23 484-ball FBGA))
設計說明
The 672-ball FBGA (F27) package requires a 1.0 mm pitch BGA footprint with at least 4 layers of PCB stack-up for signal breakout. Intel recommends an 8-layer stack-up with dedicated ground and power planes for noise-sensitive designs. Via-in-pad with filled-and-capped microvias is strongly recommended for transceiver channel routing; blind/buried vias help route escape signals from inner balls. Follow the Altera/Intel Cyclone IV GX Hardware Reference Manual fan-out and stack-up guidelines for the F27 package.
Each multi-gigabit transceiver channel must be routed as a 100 ohm differential pair with matched length to within +/-5 mil (0.13 mm) for 3.125 Gbps operation. Use controlled-impedance PCB traces (typically stripline between ground planes for inner layers or coplanar waveguide with ground pour for outer layers). AC-coupling capacitors (typically 100 nF) are required between the FPGA and external connectors or serdes devices. Reference-clock inputs should be routed with 50 ohm single-ended or 100 ohm differential impedance and isolated from data lines by ground vias.
The Cyclone IV GX EP4CGX50 requires four distinct supply rails: VCCINT (1.2 V core), VCCIO (1.2 V to 3.3 V I/O banks), VCCPT (1.2 V for transceiver PLL analog), and VCCA (2.5 V for transceiver analog). Each rail requires bulk decoupling of 100 uF or larger plus 0.1 uF and 0.01 uF ceramic decoupling placed within 100 mils of each supply pin. The POR (power-on-reset) supply sequence requires VCCINT and VCCPT to ramp before VCCIO; failure to observe this sequence may damage the device or cause configuration errors.
Estimated: at typical 1.2 V core with 50% logic utilization and 4 active transceivers at 3.125 Gbps, the EP4CGX50 dissipates approximately 2.0 to 3.5 W. With F27 package theta_JA around 14 C/W for a JEDEC-compliant 4-layer board with minimal airflow, junction-to-ambient rise is roughly 28C to 49C, leaving 51C to 72C of margin to the industrial 100C junction limit. Designs running all 8 transceivers at full rate should consider thermal vias under the FBGA thermal pad and at least 200 LFM of forced airflow.
Do not leave transceiver reference-clock inputs floating; always drive them with a clean 100 MHz or 125 MHz LVDS reference. MSEL pins must be hardwired to the correct logic level for the desired configuration mode (AS, PS, FPP, or JTAG) before power-up. Configuration pins nCONFIG, nSTATUS, and CONF_DONE must be pulled up to VCCIO through 10 kohm resistors. JTAG chain integrity should be verified with the Quartus Programmer before attempting any boundary-scan or in-system programming.
合規資訊
RoHS compliant per Altera/Intel product page. AEC-Q100 qualification status not applicable for industrial-grade FPGAs - AEC-Q100 is an automotive IC standard, not required for general industrial FPGAs. Conflict minerals compliance per Altera/Intel CMRT filings.