EP4CGX50DF27C7N - Cyclone IV GX FPGA 49,888 LEs | Intel
MPN： EP4CGX50DF27C7N ✓ 啟用中EP4CGX50DF27C7N 概覽
A field-programmable gate array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and (in 'GX' families) multi-gigabit transceivers. FPGAs occupy the programmable-logic tier of the digital design hierarchy: discrete logic -> CPLD (gates) -> FPGA (logic blocks + hard IP) -> SoC/ASIC. Cyclone IV GX specifically targets the low-power, transceiver-equipped middle ground between cost-optimized Cyclone IV E and higher-end Stratix families.
Key specifications of the EP4CGX50DF27C7N include 49,888 logic elements, 2,562,048 embedded memory bits, 232 user I/O pins on the F27 package variant, integrated 3.125 Gbps transceivers (number of transceiver channels is package-dependent), and a 1.2 V core supply. The device supports DDR/DDR2/DDR3/QDRII/RLDRAM memory interfaces via dedicated PHY blocks, and offers 6 PLLs plus clock networks for flexible clocking. Compared with Cyclone IV E, the GX variant adds transceiver capability at roughly the same power envelope.
Architecturally, the EP4CGX50 uses a 60 nm process node with 1.2 V core, which gives a favorable power/performance trade-off versus 90 nm Cyclone III and a lower price point than 40 nm Cyclone V. The device family supports Nios II soft-core processor embedding, enabling fully customized SoC implementations in a single chip.
Typical applications include industrial video bridging and display controllers, low-cost serial-connectivity bridges (PCIe Gen1/Gen2, SATA, GigE), motor control, software-defined radio front-ends, and machine-vision interfaces. The integrated transceivers make it particularly suitable for protocol bridging between high-speed serial links and parallel LVCMOS/LVTTL logic.
Designers should plan power sequencing carefully: the Cyclone IV GX requires ramp-rate-controlled ramp-up of the 1.2 V core rail to avoid in-rush current issues. Use the Altera/Intel PowerPlay Early Power Estimator (EPE) spreadsheet before tape-out to size decoupling and thermal solutions.
This page synthesizes distributor pricing, drop-in same-family variants, and PCB-layout design notes not aggregated on the official Intel datasheet, providing practical information gain for engineers evaluating Cyclone IV GX options.
直接替換替代品，適用於 EP4CGX50DF27C7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4CGX50DF27C7N （相同外形與佔位） — 差異在於 Package, Transceivers, Embedded Memory, Speed Grade, Logic Elements.
EP4CGX50DF27C7
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX50DF27C6N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX50DF27C8N
✅ 直接替換聯絡詢價
查看資料表 →EP4CGX110DF27C7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4CGX150DF27C7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP4CGX50DF27C7N 最大額定值與電氣特性
| Family | Cyclone IV GX |
| Logic Elements (LE) | 49,888 |
| Total Embedded Memory Bits | 2,562,048 |
| User I/O Pins (max) | 310 |
| Transceivers | Yes (3.125 Gbps GX channels, package-dependent) |
| Core Supply Voltage | 1.2 V |
| Process Node | 60 nm |
| Operating Temperature (Commercial 'C') | 0C to +85C |
| 封裝 | 672-pin FBGA (FineLine BGA) |
| 安裝類型 | Surface Mount |
| PLL Count | 6 |
| Hard Memory Controller | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
EP4CGX50DF27C7N 672-pin fbga (fineline bga) 腳位配置指南
EP4CGX50DF27C7N（672-pin fbga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4CGX50DF27C7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4CGX50DF27C7N 適用於 6 應用s: Industrial Video Bridging & Display Controllers, PCI Express Gen1/Gen2 Endpoint Card, Gigabit Ethernet & Industrial Protocol Bridges, Motor Control & Industrial Drive Front-End, Software-Defined Radio (SDR) Front-End & DSP, Machine Vision & Camera Link Interface.
Industrial Video Bridging & Display Controllers
The EP4CGX50DF27C7N's 49,888 logic elements plus dedicated DDR3 PHY make it well-suited for industrial video bridging between MIPI, HDMI, LVDS, and DisplayPort interfaces, with integrated 3.125 Gbps transceivers handling high-speed serial outputs. At typical utilization of 60-70% LEs and 80% of available M9K memory blocks, a single Cyclone IV GX can drive dual-channel FHD display pipelines without external bridge ICs. Pair with the EPCQ64A configuration memory and a 50 MHz LVCMOS oscillator.
推薦
PCI Express Gen1/Gen2 Endpoint Card
The EP4CGX50DF27C7N's integrated 3.125 Gbps transceivers include a hard PCIe Gen1/Gen2 PHY block that supports x1/x2/x4 endpoint applications with minimal soft-logic overhead. A complete PCIe endpoint including DMA engine and MSI-X interrupt logic fits comfortably in 30K-35K LEs. The 672-ball F27 BGA provides sufficient I/O for up to x4 PCIe plus auxiliary GPIO. Pair with a 100 MHz PCIe reference clock and standard 8b/10b SerDes external conditioning.
推薦
Gigabit Ethernet & Industrial Protocol Bridges
Industrial Ethernet protocols such as PROFINET, EtherCAT, EtherNet/IP, and SERCOS III all run on 100 Mbps or 1 Gbps links that the EP4CGX50DF27C7N handles via its integrated transceivers and tri-speed Ethernet MAC support. With 49,888 LEs, the device can host two simultaneous Ethernet channels with full protocol stack offload. The 6 PLLs provide independent clocks for SGMII and parallel GPIO, simplifying multi-protocol gateway designs.
推薦
Motor Control & Industrial Drive Front-End
FPGA-based motor control benefits from the EP4CGX50DF27C7N's deterministic latency, parallel PWM generation, and high-resolution encoder interfaces (BiSS, EnDat, SSI, Tamagawa). With 49,888 LEs, the device can drive up to 6 axes of FOC motor control with 16 kHz PWM at 100 kHz loop rates. Transceivers can support the industrial encoder feedback channel. Pair with isolated gate drivers and current-sense amplifiers.
推薦
Software-Defined Radio (SDR) Front-End & DSP
The 3.125 Gbps transceivers plus 49,888 LEs and on-chip multipliers make the EP4CGX50DF27C7N suitable for narrow-band SDR front-ends, including DVB-T, DVB-S2, and custom OFDM waveforms. The hard 18x18 multipliers deliver ~140 GMACs of DSP throughput for IF-stage decimation and channelization. Drop-in same-package family variants such as EP4CGX110DF27C7N offer headroom for higher-bandwidth applications.
推薦
Machine Vision & Camera Link Interface
The EP4CGX50DF27C7N excels as a Camera Link frame grabber or as a programmable image pre-processor for area-scan and line-scan cameras. 49,888 LEs can host 2D convolution, color-space conversion, and HDR pipelines up to 80 MHz pixel clock. Transceivers enable CoaXPress or GigE Vision uplink, while parallel LVCMOS lanes drive the sensor side. The DDR3 PHY handles multi-Mpixel frame buffering without external SDRAM controllers.
推薦
推薦產品摘要
工程參考資料，適用於 EP4CGX50DF27C7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4CGX50DF27C7 | EP4CGX50DF27C6N | EP4CGX50DF27C8N | EP4CGX110DF27C7N | EP4CGX150DF27C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 109,424 | 149,760 |
| Speed Grade | C7 | C7 | C6 | C8 | C7 | C7 |
| Transceivers (3.125 Gbps) | Yes | Yes | Yes | Yes | Yes | Yes |
| Embedded Memory (bits) | 2,562,048 | 2,562,048 | 2,562,048 | 2,562,048 | 5,062,400 | 6,480,448 |
| User I/O (max) | 310 | 310 | 310 | 310 | 310 | 310 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
主要差異化特點
- Integrated 3.125 Gbps transceivers in mid-density 49,888 LE Cyclone IV GX die (對比EP4CGX30CF19C7N)
- Maximum density at F27 footprint (49,888 LEs) (對比EP4CGX50CF23C7N)
- Commercial 'C7' speed grade with full speed/area optimization (對比EP4CGX50DF27C6N)
設計說明
Estimated: At typical utilization (60-70% LEs, 50% memory, full transceiver lanes at 3.125 Gbps PRBS31), the EP4CGX50DF27C7N draws ~3.5-5 W. Design the 1.2 V VCCINT rail with a buck regulator rated for at least 6 A continuous (e.g. TPS54360DDA) and place 22uF X5R bulk plus 0.1uF + 1nF high-frequency decoupling within 5 mm of every VCC pin pair. The transceiver rails VCCPT_2P5 and VCCA need separate LDO filtering.
The 672-ball F27 FineLine BGA has a 1.0 mm ball pitch requiring microvia (laser-drilled) PCB stackup. Use at minimum a 6-layer board: signal / GND / signal / VCC / GND / signal. Route all high-speed transceiver lanes (GXB) as 100 ohm differential 8-mil traces with ground stitching vias every 0.5 wavelength. Place the transceiver AC-coupling capacitors within 5 mm of the TX ball.
Cyclone IV GX is sensitive to VCCINT ramp rate. The 1.2 V core must ramp monotonically between 0.5 ms and 100 ms; faster or slower ramps can cause in-rush latch-up. Use a soft-start DC-DC (e.g. TPS54x family) or a power-good-controlled load switch. Also: do not leave any VCC/GND ball unconnected - every ball needs a via-in-pad connection to internal planes.
For PCIe Gen2 (5 Gbps) and SATA (6 Gbps) links on the GX transceivers, follow the Altera Transceiver Link Design Guide: keep TX-to-RX trace mismatch under 20 mils, use 100 ohm +/- 10% differential impedance, and place the AC-coupling caps as close to the TX pins as possible. Reference the Cyclone IV GX Transceiver Layout Guidelines for eye-diagram tuning.
合規資訊
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - this is a commercial/industrial part, not automotive-grade.
