EP4SGX180KF40I3N - 180K LEs Stratix IV GX FPGA | Intel
MPN： EP4SGX180KF40I3N ✗ 停產EP4SGX180KF40I3N 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that lets designers implement arbitrary digital functions after PCB fabrication. Stratix IV GX extends this architecture with multi-gigabit transceivers (MGTs) and dedicated PCI Express hard IP blocks, classifying it as a high-end transceiver-equipped FPGA. Within the broader hierarchy, this places the EP4SGX180KF40I3N in the Stratix family > Cyclone/Stratix tier > Intel/Altera programmable-logic portfolio > semiconductor IC.
Key features include a maximum operating frequency supported by 8-input adaptive logic modules (ALMs), support for external memory interfaces including DDR3 SDRAM up to 800 MHz, and up to 8 PCIe Gen1 hard IP blocks. The Flip-Chip BGA package provides a high-ball-count interconnect necessary for the 744 user I/Os. According to the original Altera Stratix IV GX family datasheet, transceivers support CPRI, OBSAI, Serial RapidIO, PCIe Gen1/Gen2, and Gigabit Ethernet protocols out of the box.
Typical applications include high-end telecommunications line cards, wireless baseband processing, military radar systems, broadcast video infrastructure, and high-performance ASIC prototyping. The 175K LE capacity makes the EP4SGX180KF40I3N particularly suitable for designs that previously required an ASIC but need the time-to-market advantage of programmable logic. Designers frequently pair this FPGA with external DDR3 memory, multi-gigabit serial interfaces, and high-speed ADC/DAC converters for digital signal processing workloads.
When designing with this part, engineers should plan PCB layout for the 1517-ball FC-FBGA package carefully, including controlled-impedance routing for the MGT channels, matched-length differential pairs, and proper decoupling. Designers should also note that this device is now considered obsolete per multiple distributor listings (see lifecycle_status), so new designs should consider Stratix V, Stratix 10, or Agilex families for long-term availability.
This page synthesizes distributor pricing snapshots, drop-in same-package alternatives, and PCB design notes that go beyond the manufacturer datasheet to help engineers evaluate the EP4SGX180KF40I3N for both new and legacy designs.
直接替換替代品，適用於 EP4SGX180KF40I3N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SGX180KF40I3N （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Mounting Type, Logic Elements.
EP4SGX180KF40C4G
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX180KF40C2N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX180KF40I4N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP4SGX230KF40I3N
✅ 直接替換聯絡詢價
查看資料表 →EP4SGX290KF40I3N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP4SGX180KF40I3N 最大額定值與電氣特性
| Series | Stratix IV GX |
| Family | Stratix IV |
| Logic Elements | 175,750 |
| Adaptive Logic Modules (ALMs) | 70,300 |
| Total Memory Bits | 13,954,048 |
| Maximum User I/Os | 744 |
| 封裝 | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| 安裝類型 | Surface Mount |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 3 |
| Transceiver Data Rate | Up to 3.125 Gbps |
| DSP Blocks | Yes (hardware multiplier-accumulators) |
| RoHS 狀態 | Compliant |
EP4SGX180KF40I3N 1517-bbga, fcbga (flip-chip bga) 腳位配置指南
EP4SGX180KF40I3N（1517-bbga, fcbga (flip-chip bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SGX180KF40I3N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SGX180KF40I3N 適用於 6 應用s: Wireless Baseband Processing, Telecommunications Line Cards, Broadcast Video Infrastructure, Military Radar and Signal Intelligence, High-Performance ASIC Prototyping, Industrial Test and Measurement.
Wireless Baseband Processing
The EP4SGX180KF40I3N is well-suited for wireless baseband processing in 4G LTE and LTE-Advanced base-station line cards. The device's 175,750 logic elements and 13.9 Mbits of embedded memory (M9K + M144K blocks) provide ample resources for FFT/iFFT engines, channel coding/decoding (turbo, LDPC), and MIMO processing pipelines. The integrated multi-gigabit transceivers operating up to 3.125 Gbps handle CPRI and OBSAI fronthaul links to remote radio heads without external PHY devices. The 744 user I/Os provide generous parallel interfaces for ADC/DAC sample data, while the industrial temperature grade supports outdoor cabinet installations.
推薦
Telecommunications Line Cards
Designers use the EP4SGX180KF40I3N as a traffic-manager / packet-processor on multi-Gigabit telecom line cards. Its hard PCI Express Gen1/Gen2 IP blocks allow direct attachment to host processors, while the multi-gigabit transceivers connect to SFP+/XFP optical modules for 10 Gbps uplink aggregation. The 40 nm process and 0.9 V core voltage keep power consumption manageable in dense chassis designs. The 1517-ball FC-FBGA package supports the high pin count required for parallel TCAM/RLDRAM III lookups in deep-pipeline forwarding engines.
推薦
Broadcast Video Infrastructure
The EP4SGX180KF40I3N is widely deployed in broadcast video routers, format converters, and 3G-SDI / HD-SDI signal-processing cards. Its transceivers support SDI rates up to 2.97 Gbps (3G-SDI) with deterministic latency, while the abundant on-chip memory enables line buffers for cross-point switching and color-space conversion. The industrial temperature grade ensures reliable operation in environmentally controlled broadcast facilities. Designers pair this FPGA with external DDR3 SDRAM for frame-store memory and HDMI/SDI serializer/deserializer companions.
推薦
Military Radar and Signal Intelligence
Defense integrators use the EP4SGX180KF40I3N for radar pulse-Doppler processing and electronic-warfare (EW) signal-intelligence receivers. The 175K logic elements support real-time FFT-based spectral analysis, while the integrated transceivers handle direct digitization of IF signals after appropriate ADC front-ends. The industrial temperature grade and 40 nm process provide the reliability margin required for military programs. Conformal coating and ruggedized packaging options can be specified for deployed systems.
推薦
High-Performance ASIC Prototyping
Design teams use the EP4SGX180KF40I3N as a vehicle for ASIC prototyping before committing to mask costs. The 175,750 logic elements map easily to mid-complexity ASIC netlists, and the abundant embedded memory emulates on-chip SRAM blocks with high fidelity. Multi-FPGA partitioning is supported via the multi-gigabit transceivers, which serve as high-speed chip-to-chip bridges in large emulation racks. Quartus II synthesis with Synplify or Precision RTL provides the ASIC correlation flow.
推薦
Industrial Test and Measurement
Test-equipment manufacturers use the EP4SGX180KF40I3N in protocol-aware test instruments such as Serial RapidIO analyzers, PCIe Gen2 exercisers, and 10 Gigabit Ethernet BERT testers. The integrated transceivers provide the physical interface, while the embedded DSP blocks accelerate pattern generation, error counting, and bit-error-rate calculations. Industrial temperature grade supports bench-top and rack-mounted laboratory environments with stable thermal characteristics. The 744 user I/Os accommodate parallel front-panel interfaces and backplane connectors.
推薦
推薦產品摘要
工程參考資料，適用於 EP4SGX180KF40I3N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SGX180KF40C4G | EP4SGX180KF40C2N | EP4SGX180KF40I4N | EP4SGX230KF40I3N | EP4SGX290KF40I3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same |
| Logic Elements | 175,750 | 175,750 | 175,750 | 175,750 | 228,000 | 290,000 |
| Total Memory Bits | 13,954,048 | 13,954,048 | 13,954,048 | 13,954,048 | 17,133,312 | 21,553,664 |
| Maximum User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 3 (mid) | 4 (slow) | 2 (fast) | 4 (slow) | 3 (mid) | 3 (mid) |
| Transceiver Rate (max) | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
主要差異化特點
- Highest transceiver-equipped density at the 1517-ball FCBGA tier in the Stratix IV GX family (對比EP4SGX110KF40I3N)
- Industrial temperature grade vs commercial grade for harsh-environment deployment (對比EP4SGX180KF40C2N)
- Mid-tier speed grade 3 balances Fmax and power consumption (對比EP4SGX180KF40C4N)
設計說明
The 1517-ball Flip-Chip BGA requires microvia PCB technology with laser-drilled vias and 1.0 mm or finer pitch escape routing. Use a minimum 12-layer stackup with dedicated ground and power planes adjacent to the FPGA balls for transceiver channel reference planes. Decoupling must include 0.1 uF, 1 uF, and 10 uF MLCC capacitors placed within 100 mils of the device power balls, with the smaller values closest to the package. Maintain 100 ohm differential impedance for MGT transmit and receive pairs.
Estimated: at full utilization (~80% logic toggle, 100% transceiver utilization), the EP4SGX180KF40I3N can dissipate between 8 W and 12 W of total power. With theta_JA of approximately 0.5 C/W using a standard air-cooled heatsink and adequate airflow (200 LFM), this yields a junction temperature rise of 4 C to 6 C above ambient. Always populate the thermal pad (central ball array) with sufficient thermal vias to a dedicated internal copper plane for heat spreading.
Multi-gigabit transceiver channels are extremely sensitive to impedance discontinuities. Use 100 ohm differential routing for all MGT pairs, maintain intra-pair length matching within 5 mils, and avoid routing transceiver pairs across PCB splits or via stubs. Reference the Altera Stratix IV GX Transceiver User Guide for pre-emphasis and equalization settings, and always perform post-layout signal-integrity simulation with the IBIS-AMI models.
Do not assume all Stratix IV GX FPGAs in the 1517-ball FCBGA package are pin-compatible across density grades; the EP4SGX180KF40I3N, EP4SGX230KF40I3N, and EP4SGX290KF40I3N share the same 1517-ball footprint, but the EP4SGX110KF40 variants use different pin assignments. Always verify against the device-specific Pin-Out File before committing to PCB layout. Also note the part is obsolete - new designs should target Stratix V, Stratix 10, or Agilex families.
合規資訊
RoHS compliant per multiple distributor listings (icchip.net and DigiKey). AEC-Q100 not applicable - FPGAs are not qualified to automotive stress standards; for automotive applications, refer to the Cyclone V or MAX 10 families. Halogen-free and conflict-minerals status not stated explicitly in the provided data.