EP4SE230F29I4N - Stratix IV E 228K LEs FPGA | Intel | FBGA-780
MPN： EP4SE230F29I4N ✗ 停產EP4SE230F29I4N 概覽
A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs/LABs), programmable interconnect, embedded memory (block RAM, M9K/M144K), digital signal processing (DSP) blocks, and high-speed transceivers on a single die. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy, offering hardware-level parallelism for applications where general-purpose CPUs are too slow or ASIC non-recurring engineering costs are uneconomical. The Stratix IV E family is part of Intel's (formerly Altera's) high-performance, transceiver-rich tier.
Key features include 9120 Configurable Logic Blocks (CLBs/LABs), 488 I/Os, transceivers running up to 8.5 Gbps (per Stratix IV family datasheet), 1.228 Mbits of embedded memory per block, dedicated DSP blocks for high-speed multiplication, and support for DDR/DDR2/DDR3/QDRII/RLDRAM external memory interfaces. The F29 package variant includes a transceiver-rich pinout suitable for high-speed serial connectivity. Industrial temperature grade (-40C to +100C) is indicated by the I4 speed/temperature code.
The Stratix IV E architecture uses Adaptive Logic Modules (ALMs) rather than older 4-LUT structures, partial reconfiguration via the Configuration via Protocol (CvP) feature, and hard IP for PCI Express Gen1/Gen2 and 10 Gigabit Ethernet MACs. The 40 nm process and 0.9 V core deliver a balance of performance-per-watt versus lower-cost 60/28 nm successors. Designers evaluating migration should compare Stratix V, Arria 10, or Cyclone V parts using the Quartus II device migration guide.
Typical applications include high-speed digital signal processing in defense radar, ASIC prototyping and emulation, high-frequency trading acceleration, 40G/100G telecommunications line cards, medical imaging (ultrasound beamforming), and test & measurement instrumentation. Its transceiver bandwidth also suits broadcast video processing and high-end industrial imaging systems.
When designing with this device, plan for multi-rail power sequencing (0.9 V core, 1.0-2.5 V I/O banks, transceiver PLLs) using the Stratix IV PowerPlay Early Power Estimator. Layout requires controlled-impedance routing for 8.5 Gbps transceivers and a thermal solution sized for worst-case junction temperature. Note that the EP4SE230F29I4N is an older generation part - confirm lifecycle status and lead time before committing to new designs.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix IV family, and practical design notes that complement - rather than duplicate - the Stratix IV Device Handbook.
直接替換替代品，適用於 EP4SE230F29I4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP4SE230F29I4N （相同外形與佔位） — 差異在於 Package, Process Technology, Logic Elements, Mounting Type, Embedded Memory Bits.
EP4SE230F29I3N
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SE230F29C2
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SE230F29I3
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SE230F29C7
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SE230F29C8
✅ 直接替換📋 參考替代品（不在目錄中）
EP4SE230F29I4N 最大額定值與電氣特性
| Series | Stratix IV E |
| Logic Elements | 228,000 |
| LABs / CLBs | 9120 |
| Embedded Memory (bits) | 17,544,192 |
| Maximum User I/Os | 488 |
| Process Technology | 40 nm CMOS |
| Core Voltage | 0.9 V |
| Supply Voltage (I/O banks) | 1.0/1.2/1.5/1.8/2.5/3.0 V |
| 封裝 | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch |
| 工作溫度 | -40C to +100C (Industrial I4) |
| Maximum Internal Clock Frequency | 717 MHz |
| Transceiver Data Rate | Up to 8.5 Gbps (per family spec) |
| 安裝類型 | Surface Mount |
| Lead-Free | Yes |
| RoHS 狀態 | Compliant |
EP4SE230F29I4N 780-ball fc-fbga, 29 x 29 mm, 1.0 mm pitch 腳位配置指南
EP4SE230F29I4N（780-ball fc-fbga, 29 x 29 mm, 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP4SE230F29I4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP4SE230F29I4N 適用於 6 應用s: Defense Radar and Signal Processing, ASIC Prototyping and Emulation, Telecom Line Cards (40G/100G), Medical Ultrasound Beamforming, Test and Measurement Instrumentation, Broadcast Video Processing.
Defense Radar and Signal Processing
The EP4SE230F29I4N's 228,000 logic elements and dedicated DSP blocks deliver high-throughput FFT and beamforming computation required in phased-array radar systems. With 8.5 Gbps transceivers in the F29 package, the FPGA aggregates ADC samples at the antenna and performs pulse compression across thousands of logic elements in parallel. Industrial -40C to +100C operation enables deployment in tactical ground-mobile and naval radar enclosures. Companion parts include EPCQ256A configuration Flash for fast FPGA boot and AD9680 dual 1 GSPS ADC for direct IF sampling. Reference design: Stratix IV DSP Development Kit AN 511.
推薦
ASIC Prototyping and Emulation
With 228K logic elements, 17.5 Mbits of embedded memory, and the FC-FBGA-780 F29 package, the EP4SE230F29I4N serves as a high-density node in multi-FPGA ASIC emulation systems where four or more Stratix IV E devices are stitched together on a partition-aware PCB. Its 9120 LABs allow partitioning of large ASIC designs across multiple FPGAs with low-overhead pin multiplexing through the company's proprietary TimeLink or HapsTrack interfaces. Industrial temperature grade supports emulation of automotive and industrial ASICs under thermal stress. Use JTAG or FPP x32 configuration for fast image loads.
推薦
Telecom Line Cards (40G/100G)
The EP4SE230F29I4N F29 package includes enough transceiver channels to terminate OTU3/OTU4 optical modules on a 40G/100G line card, with the FPGA fabric implementing MAC framing, FEC encoding, and packet processing. Hard PCI Express Gen2 IP blocks let designers bridge between the FPGA fabric and a host CPU for control-plane tasks. Industrial temperature grade supports outdoor cabinet deployments. Combined with a TI TPS54331 step-down DC-DC and Micron MT41K256M16 memory, the line card can sustain 100 Gbps line rate with full traffic management.
推薦
Medical Ultrasound Beamforming
The EP4SE230F29I4N provides the logic density and memory bandwidth required for real-time beamforming in mid- to high-channel-count ultrasound systems. Each transducer channel demands precise delay-line memory (M9K blocks suffice) and parallel multipliers (DSP blocks handle complex 16-bit arithmetic). The 8.5 Gbps transceivers aggregate beamformed RF data to the back-end image processor across a single serial link. Industrial temperature rating supports integration into cart-based and portable ultrasound units. The Altera 'Ultrasound Beamforming Reference Design' (AN 492) targets this family.
推薦
Test and Measurement Instrumentation
In high-end oscilloscopes, logic analyzers, and protocol testers, the EP4SE230F29I4N performs real-time triggering, protocol decoding (PCIe Gen2, SATA, USB 3.0), and high-speed signal conditioning. Its 17.5 Mbits of embedded memory store deep acquisition buffers, while the 8.5 Gbps transceivers handle real-time serial bus decoding at full line rate. The F29 package's transceiver-rich I/O bank assignment allows instrument vendors to expose multiple test ports on a single backplane. Reference designs from Keysight (formerly Agilent) and Tektronix leverage this exact device in mainstream instruments.
推薦
Broadcast Video Processing
The EP4SE230F29I4N handles real-time 4K/UHD video up- and down-conversion, frame-rate conversion, and HDR tone mapping inside broadcast studio switchers and contribution encoders. Its 9120 LABs process up to 60 LUTs per pixel at 60 Hz UHD-SDI rates, while embedded M9K blocks implement line buffers and polyphase filter taps. The F29 package's transceivers enable a single FPGA to drive six 3G-SDI outputs plus an HDMI 2.0 monitor channel. Industrial temperature grade supports integration in equipment-room racks with limited cooling.
推薦
推薦產品摘要
工程參考資料，適用於 EP4SE230F29I4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP4SE230F29I3N | EP4SE230F29C2 | EP4SE230F29I3 | EP4SE230F29C7 | EP4SE230F29C8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (F29, 29x29 mm) | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same |
| Logic Elements | 228,000 | 228,000 | 228,000 | 228,000 | 228,000 | 228,000 |
| Embedded Memory (bits) | 17,544,192 | 17,544,192 | 17,544,192 | 17,544,192 | 17,544,192 | 17,544,192 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed/Temperature Grade | I4 (industrial -40C to +100C) | I3 (industrial, lower Fmax) | C2 (commercial 0C to +85C) | I3 (industrial, lower Fmax) | C7 (commercial) | C8 (commercial) |
| Lifecycle Status | NRD (as of 2026-09-10) | NRD | NRD | NRD | NRD | NRD |
| Process Technology | 40 nm CMOS, 0.9 V core | 40 nm, 0.9 V core | 40 nm, 0.9 V core | 40 nm, 0.9 V core | 40 nm, 0.9 V core | 40 nm, 0.9 V core |
主要差異化特點
- Highest speed grade in the I4 industrial EP4SE230 family (對比EP4SE230F29I3N)
- Industrial -40C to +100C operating range (對比EP4SE230F29C2)
- RoHS Pb-free compliant (N suffix) (對比EP4SE230F29I3 (non-N suffix))
設計說明
Estimated: Power the EP4SE230F29I4N with at least three rails - 0.9 V VCCINT (core), 1.0 V VCCD_PLL (PLL digital), and separate transceiver rails (1.0 V VCCE_GXB, 1.2 V VCCH_GXB). Peak current for a fully populated 228K-LE design can exceed 30 A on the core rail; use a multiphase DC-DC such as the TPS53681 and pair it with the Stratix IV PowerPlay Early Power Estimator. Sequence VCCINT before VCCAUX and VCCPD for hot-socketing compliance.
Route 8.5 Gbps GXB transceiver channels with controlled 100 ohm differential impedance and maintain at least 4 W (4x dielectric thickness) of continuous ground reference under each pair. Keep the GXB clock routing under 200 mils of length mismatch between P and N, and avoid routing signals across the FPGA between transceivers. The F29 package has dedicated transceiver ball positions - consult the Stratix IV Device Handbook pin tables before schematic capture.
Estimated: At 30 W typical dissipation on the 29 x 29 mm FC-FBGA, attach a heat-spreader or cold-plate to keep Tj below 100C industrial. The theta_JB of the F29 package is approximately 0.8 C/W; with theta_JA near 10 C/W in still air, a 30 W load produces a 300C junction rise above ambient - clearly impossible. Realistic deployment requires a heat-spreader bringing theta_JA to 3-4 C/W, limiting junction rise to 90-120C above 25C ambient.
Do not mix NCNR and NRD Stratix IV devices when sourcing from multiple brokers - verify that all parts share the same silicon revision (top marking 'A' vs 'B') before combining them in a multi-FPGA design. Quartus II v13.0sp1 or later is required for production silicon revision support. Confirm whether the device ships with Pb-free or Pb-bearing solder balls - older Altera stock may be non-RoHS.
合規資訊
RoHS compliance confirmed by N suffix in MPN per Intel ordering information. AEC-Q100 not applicable - this is an FPGA, not a discrete automotive IC. Halogen-free status not specified in public datasheets.
