FX18-60P-0.8SV - 60-Pin 0.8mm Pitch Board-to-Board Header | Hirose
MPN： FX18-60P-0.8SV ✓ 啟用中FX18-60P-0.8SV 概覽
A Board-to-Board (B2B) connector is a type of interconnect that joins two printed circuit boards electrically and mechanically, either in a stacked (mezzanine), coplanar, or right-angle configuration. The FX18 Series sits within the family hierarchy of mezzanine connector -> board-to-board connector -> rectangular connector -> electronic interconnect, and is engineered specifically for high-speed digital signaling required by modern serial bus standards. Within the broader connector ecosystem, B2B headers like the FX18 are classified as plug-side components, paired with FX18 receptacle (socket) counterparts of the same pin count and pitch.
Key features include 60 contacts on a 0.8 mm pitch, a rated current up to 12 A on power contacts, gold contact plating for low contact resistance, surface-mount termination with retention features, and support for 3-step sequential mating. The FX18 Series supports data rates up to 10 Gbps, enabling compatibility with standards such as PCI Express, SATA, and high-speed LVDS. Operating temperature ranges of up to 125 C with heat-resistant options are available for thermally demanding enclosures.
The connector uses a precision-stamped contact design with optimized contact geometry to maintain signal integrity at multi-gigabit speeds, and it is supplied in tape-and-reel packaging compatible with automated SMT placement. The vertical orientation and outer shroud layout facilitate dense routing on stacked or coplanar PCB assemblies, particularly where conventional headers cannot accommodate the required pin count within the available board real estate.
Typical applications include Open Pluggable Specification (OPS 2.0) digital signage modules, server backplanes, industrial control boards, embedded computing platforms, and test-and-measurement instrumentation where high-density, high-speed interconnects are required. The 0.8 mm pitch enables fine-pitch routing while the multi-functional contacts reduce the total pin count required for power distribution.
When designing with this connector, verify the mating receptacle (FX18-60S-0.8SV family) for pin compatibility and ensure PCB land patterns match the Hirose-recommended footprint. Use the manufacturer's recommended PCB keep-out and pick-and-place footprints for reliable automated assembly.
This page synthesizes distributor pricing, drop-in variants within the Hirose FX18 family, and practical design notes not aggregated in a single manufacturer datasheet.
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FX18-60P-0.8SV
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查看資料表 →FX18-60P-0.8SV 規格
| Series | FX18 |
| Connector Type | Plug (Header), Outer Shroud Contacts |
| Number of Positions | 60 |
| Pitch | 0.8 mm |
| 安裝類型 | Surface Mount (SMT), Vertical |
| Contact Plating | Gold |
| Rated Current (Power Contact) | 12 A (max, MF contact) |
| 資料速率 | Up to 10 Gbps |
| Multi-Functional Contact | Yes (signal + ground + power in one pin) |
| Sequential Mating | 3-step sequential |
| Mating Direction | Vertical (coplanar / mezzanine) |
| 工作溫度 | Up to 125 C (heat-resistant option) |
| Industry Standard | Open Pluggable Specification (OPS 2.0) compatible |
| Packaging | Tape & Reel |
| RoHS Compliance | RoHS (EU) 2015/863 compliant |
| Mating Receptacle | FX18-60S-0.8SV family |
FX18-60P-0.8SV standard 腳位配置指南
FX18-60P-0.8SV（standard 封裝）的腳位配置。 腳位編號、功能與連接圖定義於製造商資料手冊中。請參閱該手冊以取得確切的封裝尺寸與焊接指引。
無詳細腳位定義資料： FX18-60P-0.8SV.
請參閱 資料表 以查看完整腳位配置。
典型應用
FX18-60P-0.8SV 適用於 6 應用s: Open Pluggable Specification (OPS 2.0) Digital Signage, Server Backplane and Embedded Computing, Industrial Control and Factory Automation, Test and Measurement Instrumentation, Networking Switch and Router Modules, Medical Imaging and Diagnostic Equipment.
Open Pluggable Specification (OPS 2.0) Digital Signage
The FX18-60P-0.8SV is a Hirose-specified OPS 2.0 plug header used on digital signage plug-in modules. Its 60 positions at 0.8 mm pitch carry multi-gigabit display data (up to 10 Gbps) plus the 12 A power contacts needed to supply backlight and SoC rails from the OPS 2.0 host backplane. According to the FX18 family datasheet, the multi-functional contact combines signal, ground, and power on one pin, dramatically reducing the connector pin count required for OPS 2.0 compliance versus discrete signal/power headers.
推薦
Server Backplane and Embedded Computing
The FX18-60P-0.8SV is widely used as a mezzanine interconnect between server CPU/Switch boards and daughtercards. Its 0.8 mm pitch and 10 Gbps per-channel capability handle PCIe Gen3 and high-speed LVDS links, while the 12 A MF power contacts supply point-of-load rails without routing separate power headers. According to Hirose FX18 family documentation, the 3-step sequential mating enables hot-plug-style staged contact engagement, important in serviceable server backplane designs.
推薦
Industrial Control and Factory Automation
The FX18-60P-0.8SV's heat-resistant option supports up to 125 C operation, making it suitable for sealed industrial enclosures and factory automation controllers. Its outer shroud provides mechanical robustness in high-vibration mounting locations, and the 12 A power contacts can drive motor-driver low-voltage rails directly. According to Hirose reliability data, the FX18 series is qualified for industrial safety standards and is specified for long-life factory automation deployments.
推薦
Test and Measurement Instrumentation
High-pin-count test instruments use the FX18-60P-0.8SV to dock removable probe or front-panel modules carrying sensitive analog and high-speed digital signals. The 0.8 mm pitch keeps the connector footprint small while the 10 Gbps capability preserves signal integrity for high-speed ADC/DAC data paths. According to the Hirose FX18 datasheet, the multi-functional contact design reduces crosstalk by integrating ground returns adjacent to each signal pin, important for low-noise measurement front ends.
推薦
Networking Switch and Router Modules
The FX18-60P-0.8SV supports high-speed SERDES links between networking line cards and switch ASIC boards, with up to 10 Gbps per channel enabling multi-lane Ethernet and PCIe aggregation. The vertical SMT orientation keeps line-card stack heights low, while the 12 A MF power contacts feed PoE and switch-ASIC supply rails. According to the Hirose FX18 family specification, the connector's optimized contact geometry is designed to minimize insertion loss and reflection at multi-gigabit signaling frequencies.
推薦
Medical Imaging and Diagnostic Equipment
Medical imaging systems use the FX18-60P-0.8SV to interconnect detector boards, processing boards, and display modules within compact diagnostic enclosures. The 0.8 mm pitch and multi-gigabit capability support uncompressed image data transfer, while the 12 A power contacts handle detector bias and processing-board rails. According to the Hirose FX18 family datasheet, the high-reliability contact design and gold plating meet the long-life and low-resistance requirements of medical imaging deployments.
推薦
推薦產品摘要
工程參考資料，適用於 FX18-60P-0.8SV — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | FX18-60P-0.8SV(11) | FX18-60P-0.8SV(30) |
|---|---|---|---|
| Brand | Hirose Electric | Hirose Electric | Hirose Electric |
| Package / Mounting | Vertical SMT, 60-pos, 0.8 mm pitch | Vertical SMT, 60-pos, 0.8 mm pitch - same | Vertical SMT, 60-pos, 0.8 mm pitch - same |
| Number of Positions | 60 | 60 | 60 |
| Pitch | 0.8 mm | 0.8 mm | 0.8 mm |
| Data Rate | Up to 10 Gbps | Up to 10 Gbps | Up to 10 Gbps |
| Power Contact Current | 12 A (MF contact) | 12 A (MF contact) | 12 A (MF contact) |
| Contact Plating | Gold | Gold | Gold |
| Sequential Mating | 3-step | 3-step | 3-step |
| Specification Code | Base (-) | (11) variant | (30) variant |
主要差異化特點
- Multi-functional contact combines signal, ground, and 12 A power in a single pin (對比Discrete signal + power headers (typical alternative architectures))
- Optimized for 10 Gbps high-speed transmission (對比Standard 0.8 mm pitch B2B headers)
- OPS 2.0 standard compatibility (對比Proprietary B2B header designs)
設計說明
Use Hirose's official Allegro or Altium footprint for the FX18-60P-0.8SV to ensure correct pad geometry and stencil apertures. The 0.8 mm pitch and outer shroud contacts require precise land pattern registration - even 0.05 mm misalignment can degrade contact reliability and mating force. Recommended PCB thickness is 1.6 mm with ENIG or OSP surface finish for gold-plated SMT contacts.
For high-speed channels above 5 Gbps, maintain a continuous ground reference under the connector using a ground plane in layer 2. The multi-functional contact design returns signal current through adjacent ground pins, but the PCB stack-up must support the return path; avoid routing signal traces across the connector footprint region on inner layers.
Verify the mating receptacle (FX18-60S-0.8SV family) before PCB layout - mixing vertical and right-angle receptacle variants with the vertical FX18-60P-0.8SV plug will not engage mechanically. Also confirm that the (11) or (30) specification-code variants you are using match the BOM callout of your reference design, as some FX18 sub-variants alter the sequential-mating pin assignments.
合規資訊
RoHS (EU) 2015/863 compliant per Hirose product page CL0579-0017-2-00. Reach and conflict-minerals compliance per Hirose corporate statements. Halogen-free status not explicitly stated in the verified web data. AEC-Q100 not applicable (connector, not semiconductor).