GX36420-DNT - 4x64Gb/s Linear Quad TIA Die | Renesas
부품 번호: GX36420-DNT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $135.92 | $135.92 |
GX36420-DNT 개요
A linear transimpedance amplifier is an analog front-end component that converts the weak photocurrent generated by a photodiode into a proportional output voltage. In coherent optical communication systems, linear TIAs (rather than limiting TIAs) preserve the amplitude and phase information of the received signal so that a downstream digital signal processor (DSP) can perform equalization, carrier recovery, and constellation demapping. The TIA sits at the front of the receiver signal chain: photodiode -> TIA -> linear post amplifier -> ADC -> DSP, making its noise, bandwidth, and linearity decisive for optical link sensitivity and reach.
The quad-lane integration of the GX36420 covering XI, XQ, YI, and YQ channels is its headline feature: one die handles all four arms of a dual-polarization coherent receiver, reducing die count, wire-bond complexity, and inter-channel mismatch in 400G/600G module designs. Its 64Gbps-per-lane data rate supports 400G (4x100G) and higher-baud coherent transceivers, and the integrated digital DC-control interface allows closed-loop adjustment of operating points over the module microcontroller bus.
Typical applications include 400G and 600G coherent optical transceivers for data-center interconnect and long-haul telecom, coherent receiver optical sub-assemblies (ROSA), and integration into PIC-based photonic modules where a good-die sourcing model is required.
Design consideration: because this is a bare-die product, electrical performance depends heavily on the customer's die-attach, wire-bond, and impedance-matching strategy; consult the Renesas die design kit and application support before layout. As a bare die, it is not AEC-Q100 packaged-device qualified and requires controlled assembly conditions.
This page synthesizes distributor pricing, lifecycle data, and drop-in-alternative information for the GX36420-DNT that is not consolidated on any single manufacturer or distributor page.
드롭인 대체품: GX36420-DNT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: GX36420-DNT (동일 폼 팩터 및 풋프린트) — 차이점: Number of Channels, Target Application, Device Type, MSL Level, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
GX36420-F-DNT
✅ 드롭인✓ 재고 있음
$359 / 개
데이터시트 보기 →GX36420-DNT 최대 정격 & 전기적 특성
| Device Type | Linear Quad Transimpedance Amplifier (TIA) Die |
| Number of Channels | 4 (XI, XQ, YI, YQ) |
| Data Rate per Lane | 64 Gbps |
| Application Target | 400G/600G coherent optical receivers |
| Integrated DC Control Interface | Digital interface circuitry for DC controls |
| Supply Form | Bare die (DIE SALE - PRICE IN GOOD DIE - WAF) |
| 패키지 | Bare die (no package) |
| MSL 레벨 | Not applicable (bare die) |
| 실장 유형 | Die attach / wire bond (custom packaging) |
GX36420-DNT bare die (no package) 핀 구성 가이드
GX36420-DNT(bare die (no package) 패키지)의 핀 구성입니다. 이 아날로그 부품에는 입력, 출력, 전원 공급 핀이 있습니다. 오프셋 널, 보상, 인에이블 핀 구성은 제조사 데이터시트를 참조하십시오. 신호 컨디셔닝 및 증폭기 회로에 이상적입니다.
다음에 대한 상세 핀아웃 데이터 없음: GX36420-DNT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
GX36420-DNT 적합 용도: 6 애플리케이션s: 400G Coherent Optical Transceivers, 600G Coherent Receivers, Coherent Receiver Optical Sub-Assemblies (ROSA), Photonic Integrated Circuit (PIC) Modules, Data Center Interconnect (DCI), Telecom Long-Haul Transmission Systems.
400G Coherent Optical Transceivers
The GX36420-DNT is purpose-built for 400G coherent optical transceiver receivers, where four linear TIA lanes at 64 Gbps each convert the photocurrents from the XI, XQ, YI, and YQ photodiodes of a dual-polarization coherent receiver. Because it is a linear TIA, it preserves amplitude and phase information so the module DSP can perform chromatic-dispersion equalization and carrier-phase recovery, directly setting receiver sensitivity and optical reach. Die-level integration of all four lanes minimizes bond-wire parasitics that would otherwise erode 64Gbaud bandwidth headroom, and the digital DC-control interface lets the module microcontroller trim each lane's operating point for gain and offset calibration over temperature.
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600G Coherent Receivers
For next-generation 600G coherent modules using higher-baud operation, the GX36420-DNT's 64 Gbps-per-lane linear TIA bandwidth provides the analog front-end needed before the ADC and DSP stages. In this role the four on-die TIAs handle the increased symbol rate of 600G dual-polarization schemes while the integrated DC-control circuitry supports continuous adaptive biasing as link conditions change. Supplying the amplifier as a good die allows module makers to co-package the TIA directly on the receiver optical sub-assembly (ROSA) alongside the photodiode array, shortening the critical photocurrent path and reducing inter-channel skew, which is a decisive factor in meeting 600G OSNR budgets.
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Coherent Receiver Optical Sub-Assemblies (ROSA)
Within a coherent ROSA, the GX36420-DNT die is bonded directly to the dual-polarization 90-degree hybrid photodiode array, converting the four photocurrent outputs (XI, XQ, YI, YQ) with matched transimpedance across channels. Bare-die integration is the preferred architecture here because bond-wire inductance between photodiode and TIA is the dominant bandwidth limiter at 64 Gbps; co-packaging keeps this path sub-millimeter. Designers should follow the Renesas die design kit for pad coordinates and bond-wire guidelines, and use the digital DC-control bus to equalize gain and DC offsets across the four lanes so the DSP sees a balanced constellation at the ADC input.
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Photonic Integrated Circuit (PIC) Modules
PIC-based coherent modules integrate lasers, modulators, and photodetectors on a photonic chip, and the GX36420-DNT die complements such PICs as the electronics-side quad linear TIA. Its die-sale supply model (DIE SALE - PRICE IN GOOD DIE - WAF) matches PIC co-packaging flows, where dies are singulated, attached, and wire-bonded in the customer's hybrid assembly line. The 64 Gbps linear lanes cover the four coherent arms in one die, cutting die count versus single-lane TIAs and improving channel matching because all four amplifiers share one silicon process and temperature environment - a measurable advantage for polarization-multiplexed QPSK/16QAM receivers.
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Data Center Interconnect (DCI)
Data-center interconnect links at 400G and beyond rely on coherent optics for metro and long-haul spans, and the GX36420-DNT supplies the receiver analog front end for such coherent transceivers. Its 64 Gbps linear lanes enable the high-baud signaling these links require, while linear operation preserves the signal fidelity needed for DSP-based dispersion compensation over tens of kilometers. Die-level sourcing lets DCI module vendors integrate the TIA directly into compact OSFP/QSFP-DD form factors where board-level amplifier footprints would not fit, and the shared-die architecture keeps the four lanes' gain and phase tightly matched for stable dual-polarization demodulation.
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Telecom Long-Haul Transmission Systems
In long-haul telecom receivers, the GX36420-DNT's quad 64Gbps linear TIA die converts weak photocurrents from coherent photodiodes into linearity-preserving voltage signals, which is what allows the DSP to recover QPSK or higher-order QAM constellations after thousands of kilometers of fiber. The integrated digital DC-control circuitry supports per-channel gain and offset trimming needed to compensate fiber aging and amplifier drift, and die-form integration keeps the photodiode-to-TIA interconnect short enough to sustain 64 Gbaud. For system vendors this translates into higher optical-signal-to-noise-ratio margins and longer unrepeatered spans per channel.
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추천 제품 요약
엔지니어링 참조 데이터: GX36420-DNT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | GX36420-F-DNT |
|---|---|---|
| Package | Bare die (DIE SALE - WAF) | Bare die (same die design, alternate flow) |
| Brand | Renesas Electronics | Renesas Electronics |
| Channels | 4 (XI, XQ, YI, YQ) | 4 (XI, XQ, YI, YQ) |
| Data Rate per Lane | 64 Gbps | 64 Gbps |
| TIA Type | Linear | Linear |
| DC Control Interface | Digital interface, integrated | Digital interface, integrated |
| Target Application | 400G/600G coherent | 400G/600G coherent |
주요 차별점
- Quad-lane integration on a single die (vs GX36420-F-DNT (and single-lane TIAs generally))
- Linear (not limiting) signal path (vs Limiting TIAs)
- Integrated digital DC-control interface (vs TIA dies with analog-only control)
설계 노트
At 64 Gbps per lane, bond-wire inductance between the photodiode and each TIA input is the dominant bandwidth limiter. Keep photodiode-to-die bonds as short as possible (sub-millimeter where feasible), use symmetric bond geometries across all four lanes to preserve channel-to-channel matching, and follow the pad coordinates and electrical models in the Renesas die design kit rather than estimating. Simulate the complete photodiode-bond-TIA-load chain at 64Gbaud before committing to a bond diagram.
Although the GX36420-DNT is a die, its carrier substrate follows RF co-packaging practice: dedicate solid ground planes directly under the die attach area, place supply decoupling capacitors within a few millimeters of the die's supply pads, and route the four differential output pairs on controlled-impedance (100-ohm differential, per your DSP input spec) traces of equal length. The digital DC-control bus can be routed more leisurely, but keep it away from the 64Gbps lanes to avoid coupling control noise into the linear signal path.
Do not power the die before confirming supply voltage and pin map from the Renesas die design kit - bare dies have no keyed package to prevent mis-bonding, and an incorrect supply connection can destroy the part instantly. Also remember this is a die-sale item: incoming inspection (visual, electrical sample probing) should be planned, and only die-sale quantities of known-good die should be committed to production. ESD handling class 0 controls are mandatory; linear TIAs with 64Gbps inputs are extremely ESD-sensitive.
규정 준수 정보
Compliance declarations not present in retrieved distributor data. For a bare-die product, request the Renesas material declaration for the GX36420 family. Bare die is not a packaged AEC-Q100 device.
