ISL33003IUZ-T - I2C Bus Buffer, Hot-Swap, 8-MSOP | Renesas
MPN： ISL33003IUZ-T ✓ 啟用中ISL33003IUZ-T 概覽
An I2C bus buffer (also called a bus repeater or signal buffer) is an interface IC that regenerates the two-wire SDA and SCL signals of an I2C bus, extending the total bus capacitance beyond the 400 pF limit specified by the I2C specification. Within the interface IC hierarchy (bus buffer -> signal buffer/repeater -> interface IC -> semiconductor), buffers let designers add more devices, longer cables, and larger PCB traces to an I2C segment without sacrificing signal integrity or data-rate performance.
Key features of the ISL33003 include capacitance extension beyond the 400 pF I2C limit, rise-time accelerator circuitry that reduces the power consumed by passive pull-up resistors while improving data-rate performance, and hot-swap circuitry that prevents corruption of the bus during card insertion or removal. The two channels allow buffering of both SDA and SCL in one compact 8-MSOP package.
Technically, the buffer separates capacitive loading on either side of the device, isolating a heavily loaded segment from the controller segment. The rise-time accelerators actively pull the bus lines high during transitions, allowing weaker (higher-value, lower-power) pull-up resistors to be used without slowing edge rates. The hot-swap function keeps the I/O pins high-impedance until the local supply stabilizes, avoiding bus latch-up or data corruption during live insertion.
Typical applications include backplane and card-cage systems with pluggable I2C cards, server and telecom chassis management (I2C/PMBus sensor rails), and long bus runs in industrial control where many EEPROMs, RTCs, or I/O expanders share one bus.
Design consideration: place the buffer physically between the capacitive segments, and follow the datasheet recommendations for pull-up sizing and accelerator enable configuration to avoid false START conditions.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 ISL33003IUZ-T — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ISL33003IUZ-T （相同外形與佔位） — 差異在於 Function, Package, Number of Channels, Packaging, Temperature Grade.
ISL33003IUZ
✅ 直接替換📋 參考替代品（不在目錄中）
ISL33003IRT2Z
✅ 直接替換📋 參考替代品（不在目錄中）
ISL33001IUZ-T
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ISL33002IUZ-T
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ISL33003IUZ-T 規格
| 功能 | 2-channel I2C bus buffer with rise-time accelerators and hot-swap |
| Number of Channels | 2 |
| Bus Capacitance Extension | Beyond 400 pF I2C specification limit |
| Rise Time Accelerators | Yes |
| Hot-Swap Capability | Yes |
| 工作溫度 | -40C to +85C (industrial) |
| 封裝 | 8-MSOP |
| 安裝類型 | Surface Mount |
| Number of Terminals | 8 |
| Carrier Type | Reel (T suffix, tape and reel) |
| MoQ | 2500 (tape and reel) |
| Temperature Grade | Industrial |
ISL33003IUZ-T 8-msop 腳位配置指南
ISL33003IUZ-T（8-msop 封裝）的腳位配置。 腳位編號、功能與連接圖定義於製造商資料手冊中。請參閱該手冊以取得確切的封裝尺寸與焊接指引。
無詳細腳位定義資料： ISL33003IUZ-T.
請參閱 資料表 以查看完整腳位配置。
典型應用
ISL33003IUZ-T 適用於 6 應用s: Server Backplane I2C Management, Pluggable Telecom Card Cages, Industrial Control Long Bus Runs, LED Display and Lighting Panels, Battery Management Systems, Optical Module and Test Instrument Cards.
Server Backplane I2C Management
Server and storage chassis use I2C/PMBus buses to reach dozens of hot-swap power supplies, fan controllers, and temperature sensors spread across a large backplane whose trace capacitance quickly exceeds the 400 pF I2C limit. The ISL33003IUZ-T buffers both SDA and SCL with its two channels, regenerating drive strength so each capacitance segment stays within specification, while the hot-swap circuitry prevents bus corruption when a PSU or fan tray is inserted into the powered chassis. Its rise-time accelerators let designers use weaker pull-ups, cutting standby bus power across always-on management rails. Industrial -40C to +85C rating covers uncooled chassis corners.
推薦
Pluggable Telecom Card Cages
Telecom line cards and AMC/microTCA carriers carry I2C management buses onto hot-pluggable modules. Inserting a card into a live backplane can glitch SDA/SCL and latch up the segment or inject false START conditions. The ISL33003IUZ-T sits at the card-edge connector: its hot-swap circuitry keeps the I/O pins high-impedance until local power is stable, protecting both the card and the shared bus. Beyond insertion protection, buffering isolates the card's local device capacitance from the backplane segment, so bus loading stays predictable regardless of how many slots are populated.
推薦
Industrial Control Long Bus Runs
Factory automation and process control systems often run I2C between cabinets, sensor clusters, and local EEPROM/RTC banks over cable lengths that add hundreds of picofarads of capacitance. Placing the ISL33003IUZ-T at segment boundaries splits the total load: the controller segment sees only the buffer input, while the buffered segment is driven with regenerated edges and rise-time acceleration, allowing long cable runs without slowing the data rate below the design target. The industrial temperature rating (-40C to +85C) and 8-MSOP footprint suit dense DIN-rail and PCB-mounted control modules.
推薦
LED Display and Lighting Panels
Large LED matrix and signage panels daisy-chain many I2C LED driver chips across large PCB areas, and the copper pours plus driver input capacitance push the bus beyond 400 pF. The ISL33003IUZ-T buffers SDA and SCL between panel zones so each segment meets the I2C capacitance budget, while rise-time accelerators maintain sharp edges at the panel's PWM update rate without the power penalty of very strong pull-ups. The compact 8-MSOP fits within LED driver column spacing, and hot-swap behavior allows panel modules to be serviced without powering the whole display down.
推薦
Battery Management Systems
Multi-cell battery packs and BMS slaves report voltage, current, and temperature over I2C/SMBus to a pack controller, often across a connector that is mated and unmated repeatedly during pack service. The ISL33003IUZ-T's hot-swap circuitry protects the management bus from insertion glitches at the pack connector, and buffering lets the pack accommodate large wire-harness capacitance while the controller-side segment stays clean. Its low-power accelerator approach reduces continuous bus pull-up drain, which matters in always-monitoring storage and standby power budgets.
推薦
Optical Module and Test Instrument Cards
Optical transceiver trays (QSFP/SFP management via I2C) and modular test instruments share the same electrical challenge: hot-pluggable modules with significant capacitance attached to a live management bus. The ISL33003IUZ-T buffers the module-side segment from the host controller, and its hot-swap protection prevents data corruption during module exchange, supporting uninterrupted monitoring in systems that cannot pause operation. The 8-MSOP package conserves board area on dense module-carrier PCBs where every square millimeter near the cage connector is contested.
推薦
推薦產品摘要
工程參考資料，適用於 ISL33003IUZ-T — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ISL33003IUZ | ISL33003IRT2Z | ISL33001IUZ-T | ISL33002IUZ-T |
|---|---|---|---|---|---|
| Package | 8-MSOP | 8-MSOP - same | 8-MSOP - same | 8-MSOP - same | 8-MSOP - same |
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Channels | 2 | 2 | 2 | 2 | 2 |
| Bus Capacitance Extension | Beyond 400 pF | Beyond 400 pF | Beyond 400 pF | Beyond 400 pF | Beyond 400 pF |
| Rise Time Accelerators | Yes | Yes | Yes | Yes | Yes |
| Hot-Swap Capability | Yes | Yes | Yes | Yes | Yes |
| Packaging / MOQ | Tape & Reel, MOQ 2500 | Tube, MOQ 2000 | Reel | Tape & Reel | Tape & Reel |
主要差異化特點
- Highest drive member of the ISL3300x buffer family (對比ISL33001IUZ-T)
- Integrated hot-swap protection (對比ISL33001IUZ-T)
- Trade-off: Renesas-only drop-in ecosystem (對比ISL33002IUZ-T)
設計說明
When cascading or segmenting I2C buffers, ensure only one buffer path exists between a master and any slave to avoid level-restore loops that stall the bus. The rise-time accelerator injects current during rising edges; if pull-ups are extremely strong (very low resistance), accelerator benefit diminishes, and if too weak, ensure the datasheet minimum pull-up is met. Do not place the ISL33003 in series with a level translator without checking DC restore behavior on the shared node.
Place the ISL33003IUZ-T at the physical midpoint of the capacitive boundary - i.e., where the heavily loaded segment meets the controller segment - typically near the backplane connector for hot-swap cards. Keep SDA1/SCL1 traces short and symmetric; decouple both supply pins (if dual-supply per the datasheet pinout) with 100 nF ceramic capacitors within 2 mm of the pins. The exposed compact 8-MSOP requires no thermal copper, but solid ground plane reduces bus jitter.
Estimated: bus power savings with accelerators depend on pull-up selection - e.g., replacing 1 kOhm pull-ups to a 3.3 V rail (about 3.3 mA per line per active-low period) with 10 kOhm pull-ups cuts static pull-up current roughly tenfold, with the accelerator supplying edge current only during transitions. Verify supply-pin current and voltage range against the electrical characteristics tables in the Renesas ISL33001/33002/33003 datasheet before finalizing the pull-up budget.
合規資訊
Compliance status not stated in the retrieved web data; consult the Renesas product page and datasheet for RoHS/REACH declarations.
