ISL33002IUZ-T - 2-Ch I2C Bus Buffer Hot-Swap | Renesas
MPN： ISL33002IUZ-T ✓ 啟用中ISL33002IUZ-T 概覽
An I2C bus buffer, also called a bus accelerator or signal repeater, is an interface IC that regenerates the SDA and SCL signals so the total bus capacitance can exceed the 400pF limit defined by the I2C specification. Within the signal-chain hierarchy (buffer -> interface IC -> signal buffer/repeater), bus buffers isolate capacitance on either side of the device, allowing long cables, large backplanes, and high fan-out systems to communicate reliably at standard I2C data rates.
Key features include bus capacitance buffering beyond the 400pF I2C maximum, rise-time accelerator circuitry that reduces power consumption otherwise wasted in passive pull-up resistors while improving data-rate performance, hot-swap circuitry that prevents bus corruption during live card insertion, and robust ESD protection of ±6kV Class 3 HBM on all pins, with ±12kV HBM on the SDA/SCL pins.
The device supports logic level translation between voltage domains, includes an accelerator disable pin for flexible system control, and provides low quiescent current. Operation over an industrial -40C to +85C temperature range makes the -T (tape-and-reel, industrial temperature grade) variant suitable for factory and telecom equipment. The 8 Ld MSOP occupies only 3mm x 3mm of board area.
Typical applications include I2C bus extension across backplanes and racks, hot-swappable line cards, level translation between 1.8V/3.3V/5V domains, and server or networking chassis management buses (such as IPMB-style monitoring). The buffer fits wherever capacitance, cable length, or card insertion would otherwise corrupt I2C signaling.
A key design consideration: enable the accelerator circuit only when bus rise times are marginal with the chosen pull-up resistors, since excessive acceleration can cause signal ringing on lightly loaded buses.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 ISL33002IUZ-T — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ISL33002IUZ-T （相同外形與佔位） — 差異在於 Function, Packaging, Package, Number of Channels, Channels.
ISL33001IUZ-T
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ISL33003IUZ-T
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ISL33002IUZ
✅ 直接替換聯絡詢價
查看資料表 →ISL33002IUZ-T7
✅ 直接替換📋 參考替代品（不在目錄中）
ISL33001IUZ
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ISL33002IUZ-T 規格
| 功能 | 2-channel I2C bus buffer with rise-time accelerators and hot-swap |
| Supply Voltage Range | +2.3 V to +5.5 V |
| 資料速率 | >400 kHz operation |
| Bus Capacitance Buffering | Extends beyond the 400 pF I2C specification maximum |
| ESD Protection (all pins) | ±6 kV HBM Class 3 |
| ESD Protection (SDA/SCL pins) | ±12 kV HBM |
| Level Translation | Yes |
| Accelerator Disable Pin | Yes |
| Hot-Swap Capability | Yes |
| 靜態電流 | Low (value per manufacturer datasheet) |
| 通道數 | 2 |
| 封裝 | 8 Ld MSOP |
| 安裝類型 | Surface Mount |
| Temperature Grade | Industrial (-40C, per Mouser listing) |
| RoHS 狀態 | Pb-free / RoHS compliant |
| Packaging | Tape and Reel (-T suffix) |
ISL33002IUZ-T 8 ld msop 腳位配置指南
ISL33002IUZ-T（8 ld msop 封裝）的腳位配置。 腳位編號、功能與連接圖定義於製造商資料手冊中。請參閱該手冊以取得確切的封裝尺寸與焊接指引。
無詳細腳位定義資料： ISL33002IUZ-T.
請參閱 資料表 以查看完整腳位配置。
典型應用
ISL33002IUZ-T 適用於 6 應用s: Backplane I2C Bus Extension, Hot-Swap Line Cards and Modules, Logic Level Translation Between Voltage Domains, Server and Telecom Management Buses, Industrial Factory Automation, Consumer Electronics Display and Sensor Buses.
Backplane I2C Bus Extension
In chassis and rack systems, the shared management I2C bus spans multiple slots, connectors, and cable harnesses, easily exceeding the 400pF capacitance ceiling defined by the I2C specification. The ISL33002IUZ-T buffers both SDA and SCL so capacitance is partitioned per segment, allowing >400kHz signaling across long backplanes. Its rise-time accelerators restore fast edges without resorting to very low-value pull-up resistors, cutting static pull-up power on the rail. The 8-lead MSOP fits tightly into slot-level line card layouts, and the industrial -40C grade suits telecom and server environments where ambient temperatures vary widely across the chassis.
推薦
Hot-Swap Line Cards and Modules
When a card is inserted into a live backplane, the undriven connector pins and card-side capacitance transiently load the bus and can corrupt in-flight I2C data. The ISL33002IUZ-T includes dedicated hot-swap circuitry that keeps the card-side bus inactive during insertion, then engages cleanly, preventing bus stalls. Its ±6kV HBM Class 3 ESD protection on all pins - and ±12kV HBM on SDA/SCL - adds robustness against insertion-induced transients. Operating from +2.3V to +5.5V lets the card-side logic run at 3.3V while the backplane segment runs at 5V, with level translation handled by the same device.
推薦
Logic Level Translation Between Voltage Domains
Mixed-voltage systems frequently need to join a 1.8V or 2.5V sensor segment with a 3.3V or 5V controller segment on one I2C network. The ISL33002IUZ-T supports a +2.3V to +5.5V supply range and performs logic level translation as part of its buffering function, eliminating an additional translator stage. Because it actively drives both sides rather than relying on passive MOSFET switching, it maintains signal integrity where capacitance is high - precisely the condition where passive translators perform worst. Its accelerator disable pin lets the designer tune edge rates for EMI-sensitive or short-signal segments, and low quiescent current suits battery-backed management rails.
推薦
Server and Telecom Management Buses
Platform management buses (such as IPMB-style networks in ATCA/MicroTCA chassis) rely on I2C to reach dozens of FRU temperature, voltage, and EEPROM devices. Aggregate capacitance and cable length routinely exceed specification limits, producing NACK errors and bus hangs. Placing ISL33002IUZ-T buffers at segment boundaries regenerates the SDA/SCL drive and confines faults to one segment. The hot-swap function is essential because FRUs are inserted while the chassis is powered, and the ±12kV HBM rating on SDA/SCL provides margin against handling-induced ESD during board assembly and field servicing in telecom central offices.
推薦
Industrial Factory Automation
Factory automation controllers distribute I2C to sensor clusters, displays, and configuration EEPROMs across control cabinets where wiring adds hundreds of picofarads. The ISL33002IUZ-T extends bus reach beyond the 400pF limit while its >400kHz operation preserves fast polling cycles for real-time monitoring loops. The industrial -40C temperature grade accommodates unheated cabinets and cold-start conditions. Its ±6kV HBM protection across all pins helps survive harsh industrial EMI environments, and the accelerator disable pin lets engineers trade edge speed for reduced ringing on heavily shielded cable runs. Low quiescent current suits always-on supervision supplies in continuous-duty production equipment.
推薦
Consumer Electronics Display and Sensor Buses
Television panels, set-top boxes, and smart appliances route I2C between an SoC, EDID EEPROMs, tuning modules, and touch or ambient-light sensors spread across a large chassis; connector and flex-cable capacitance commonly pushes the bus past 400pF. The ISL33002IUZ-T buffers the bus locally, enabling reliable 100/400kHz communication across the distributed network, and its small 3mm x 3mm 8-MSOP footprint suits dense consumer board layouts. The wide +2.3V to +5.5V supply range matches typical consumer standby and main rails, and hot-swap protection prevents bus lockup when HDMI or module interfaces are plugged in during operation.
推薦
推薦產品摘要
工程參考資料，適用於 ISL33002IUZ-T — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ISL33001IUZ-T | ISL33003IUZ-T | ISL33002IUZ |
|---|---|---|---|---|
| Package | 8-MSOP | 8-MSOP - same | 8-MSOP - same | 8-MSOP - same |
| Brand | Renesas Electronics (Intersil) | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Channels | 2 (SDA + SCL) | 2 | 2 | 2 |
| Supply Voltage | +2.3 V to +5.5 V | +2.3 V to +5.5 V | +2.3 V to +5.5 V | +2.3 V to +5.5 V |
| Data Rate | >400 kHz | >400 kHz | >400 kHz | >400 kHz |
| Packaging Format | Tape & Reel (-T) | Tape & Reel | Tape & Reel | Tray/Tube |
主要差異化特點
- Combined accelerator + hot-swap feature set (對比ISL33001IUZ-T)
- ±12kV HBM ESD on SDA/SCL pins (對比ISL33003IUZ-T)
- Trade-off: package size vs feature integration (對比TCA9517DR)
設計說明
Use the accelerator disable pin to tune edge rates: on lightly loaded bus segments, the rise-time accelerators can cause ringing or double-clocking due to over-acceleration. Enable them only on segments where measured rise times exceed the I2C rise-time budget (typically when bus capacitance approaches or exceeds 400pF). Measure with an oscilloscope at both ends of the longest bus segment; a rising edge that rings below the 0.3*VDD threshold will be read as a glitch.
When substituting within the ISL33001/33002/33003 family, do not assume feature parity: the three parts share the same 8-MSOP footprint and supply range but differ in the accelerator and hot-swap feature mix per the shared family datasheet. A design relying on hot-swap protection must not be populated with a family variant lacking it, even though the footprint is identical. Verify the feature table and pin function descriptions before any BOM swap.
Place the buffer as close as possible to the segment boundary (connector or card edge) so the capacitance partition actually falls at the buffer. Decouple VCC with a 0.1uF ceramic capacitor placed within 2mm of the supply pin. Route SDA/SCL on adjacent layers with a ground reference to control coupling on long backplane runs, and keep stub lengths on tapped devices short to limit reflected-capacitance loading on either segment.
合規資訊
Pb-free w/ anneal (RoHS compliant) per Mouser listing and Renesas product page. No REACH, halogen-free, AEC-Q100, or conflict-minerals statements found in the provided data.
