KGM03CR50J225MH - 2.2µF 6.3V X5R MLCC 0201 | KYOCERA AVX
MPN： KGM03CR50J225MH ✓ 啟用中KGM03CR50J225MH 概覽
An MLCC (multilayer ceramic chip capacitor) is a passive component built from alternating thin layers of ceramic dielectric and internal metal electrodes, terminated with nickel-barrier solder coatings for surface mounting. MLCCs sit within the broader capacitor taxonomy of ceramic capacitors -> capacitors -> passive components. The 0201 case (0.6mm x 0.3mm) is the smallest EIA standard MLCC footprint and is critical for decoupling and bulk storage in mobile, wearable, and IoT designs where PCB area is severely constrained.
Key features of the KGM03CR50J225MH include its 6.3V DC rated voltage (suitable for downstream-of-LDO rails on 3.3V or 5V systems), a high 2.2µF capacitance value in the 0201 case (a notable density achievement), X5R dielectric which provides stable capacitance across the operating temperature range, and ±20% tolerance (the J suffix per KYOCERA AVX coding). The nickel-barrier terminations support lead-free reflow profiles up to 260°C peak, in compliance with RoHS and REACH directives.
The X5R dielectric delivers volumetric efficiency superior to X7R or Y5V in this small case size, but trades absolute stability for size - capacitance can drop 15-25% under DC bias near the rated voltage, a phenomenon called DC bias derating. For noise-sensitive analog nodes, designers should evaluate capacitance at the actual DC operating point, not the nominal 2.2µF.
Typical applications include decoupling of low-power SoC power pins, bulk hold-up on wearables and hearables, filter capacitors in compact sensor modules, and bypass on Bluetooth Low Energy and Nordic-style MCUs. It is especially suited to mobile phones, smart watches, hearing aids, and other space-constrained consumer devices.
When designing with this part, follow standard MLCC PCB layout practice: use the recommended 0201 land pattern, minimize trace inductance between the capacitor and the IC power pin, and consider DC bias derating in worst-case voltage conditions. Avoid mechanical stress on the ceramic body.
This page synthesizes distributor pricing, parametric drop-in alternatives, and engineering application notes beyond what is available on the KYOCERA AVX datasheet, helping engineers select and source this part with confidence.
直接替換替代品，適用於 KGM03CR50J225MH — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
02016D225MAT2A
✅ 直接替換📋 參考替代品（不在目錄中）
KGM03CR50J225MN
✅ 直接替換📋 參考替代品（不在目錄中）
GRM033R60J225ME15D
✅ 直接替換📋 參考替代品（不在目錄中）
CL03A225KP3NNNC
✅ 直接替換📋 參考替代品（不在目錄中）
CGA0603X5R225M
✅ 直接替換📋 參考替代品（不在目錄中）
EMK063ABJ225KP-F
✅ 直接替換📋 參考替代品（不在目錄中）
KGM03CR50J225MH 最大額定值與電氣特性
| Capacitance | 2.2 µF |
| Capacitance Tolerance | ±20% |
| Rated Voltage (DC) | 6.3 V |
| Dielectric Characteristic | X5R |
| 封裝 / 外殼 | 0201 (0603 Metric) |
| EIA Size Code | 0201 |
| 安裝類型 | Surface Mount (SMD/SMT) |
| 工作溫度範圍 | -55°C to +85°C |
| Termination Style | Nickel barrier with solder coating |
| Temperature Coefficient | X5R (±15% over -55°C to +85°C) |
| Packaging | Tape & Reel (T/R) |
| MSL 等級 | 1 (unlimited floor life) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| Construction | Multilayer ceramic chip with internal electrodes |
| Polarity | Non-polarized |
| Manufacturer Series | KGM Series (KYOCERA AVX MLCC) |
KGM03CR50J225MH 0201 (0603 metric) 腳位配置指南
KGM03CR50J225MH（0201 (0603 metric) 封裝）的腳位配置。 腳位編號、功能與連接圖定義於製造商資料手冊中。請參閱該手冊以取得確切的封裝尺寸與焊接指引。
無詳細腳位定義資料： KGM03CR50J225MH.
請參閱 資料表 以查看完整腳位配置。
典型應用
KGM03CR50J225MH 適用於 6 應用s: Smartphone SoC Power Decoupling, Wearable and Hearable Bulk Hold-Up, Bluetooth Low Energy Module Decoupling, IoT Sensor Module Bypass, Hearing Aid Miniaturized Filtering, Compact Medical Patch Power Decoupling.
Smartphone SoC Power Decoupling
The KGM03CR50J225MH is ideally suited for high-density decoupling of smartphone application-processor power pins, where PCB area near the SoC is severely constrained. With 2.2µF of bulk capacitance in the 0201 (0.6mm x 0.3mm) footprint, this AVX part delivers roughly 12 µF per cm² when placed in tight grids, allowing designers to meet 100+ µF total bulk requirements on the core voltage rail without expanding the keep-out zone around the SoC. The 6.3V rating covers downstream-of-LDO 0.8V-3.3V rails. X5R dielectric provides stable capacitance across the mobile operating range of -20°C to +70°C. Engineers pair this part with smaller 0.1µF 0201 MLCCs for high-frequency decoupling; the 2.2µF bulk handles transient load steps during camera burst or 5G PA ramp events.
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Wearable and Hearable Bulk Hold-Up
Inside true-wireless earbuds, smart watches, and fitness bands, the KGM03CR50J225MH provides compact bulk capacitance for hold-up time during BLE radio bursts and sensor sampling events. The 0201 case occupies minimal board space on flex or rigid-flex PCBAs common in wearables, while the 2.2µF / 6.3V rating supports single-cell Li-ion (3.7V-4.2V) regulated rails at 3.3V or 1.8V. The X5R dielectric retains usable capacitance across body-temperature operating conditions up to 40°C. Compared to a tantalum alternative, this AVX part eliminates polarity concerns and reduces height profile to under 0.35mm, critical for earbud form factors. Designers typically place 4-8 of these in parallel near the battery-management IC for low-frequency energy storage complementing higher-frequency decoupling.
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Bluetooth Low Energy Module Decoupling
The KGM03CR50J225MH is widely used to decouple the power pins of Bluetooth Low Energy SoCs such as Nordic nRF52-series and similar low-power wireless MCUs. The 2.2µF bulk capacitance supports TX current peaks up to 7-15 mA during radio events, smoothing the battery rail to maintain a clean VDD for the radio core. The 0201 footprint suits ultra-compact BLE modules where the entire PCB is often under 10mm x 15mm. The 6.3V rating is well above typical BLE supply voltages of 1.8V-3.6V, providing ample margin. The part's X5R dielectric and -55°C to +85°C range accommodate both indoor and outdoor IoT deployments. Pair this bulk MLCC with 0.1µF and 10nF 0201 high-frequency decoupling capacitors.
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IoT Sensor Module Bypass
The KGM03CR50J225MH serves as effective bypass capacitance for compact IoT sensor modules integrating MEMS accelerometers, gyroscopes, pressure sensors, or environmental sensors on a single PCB. The 2.2µF bulk capacitance stabilizes the sensor supply rail against digital-activity transients from the host MCU, while the 0201 case allows placement directly under or adjacent to BGA-style sensor packages. The 6.3V rating covers 3.3V and 1.8V sensor rails from Li-ion or coin-cell-derived LDOs. X5R dielectric maintains stable capacitance across the typical -10°C to +60°C IoT operating envelope. Multi-sensor modules often use 4-6 of these parts per board, distributed near analog and digital supply pins.
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Hearing Aid Miniaturized Filtering
In behind-the-ear and in-canal hearing aids where total PCB area may be under 50mm², the KGM03CR50J225MH provides 2.2µF of capacitance for power-rail decoupling on the digital DSP, wireless audio receiver, and Class-D amplifier stages. The 0201 case (0.6mm x 0.3mm x 0.3mm) is small enough to place inside the battery compartment area, maximizing use of the tiny enclosure. The 6.3V rating is well above the 1.0V-3.6V rails used in modern hearing aid designs. Compared to tantalum or polymer alternatives, this AVX MLCC eliminates polarity constraints and reduces height profile. Designers typically populate 2-3 of these per hearing aid alongside lower-value 0201 MLCCs for RF and audio frequency decoupling.
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Compact Medical Patch Power Decoupling
The KGM03CR50J225MH supports miniaturized medical patch designs such as continuous-glucose monitors, ECG patches, and disposable biosensors where the entire electronics assembly may fit on a 20mm x 30mm flex PCB. The 2.2µF bulk capacitance in the 0201 case supports the regulated rails powering low-power MCUs, BLE radios, and sensor analog front ends. The 6.3V rating covers single-cell Li-polymer (3.7V-4.2V) derived 3.3V or 1.8V rails. The X5R dielectric retains stable capacitance across body-worn operating temperatures of 32°C-42°C. AVX's qualification under the KGM series includes reliability data suitable for medical applications, though formal ISO 13485 qualification is at the OEM level. Designers use 3-5 of these parts distributed across the patch electronics.
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推薦產品摘要
工程參考資料，適用於 KGM03CR50J225MH — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 02016D225MAT2A | KGM03CR50J225MN | GRM033R60J225ME15D | CL03A225KP3NNNC | CGA0603X5R225M | EMK063ABJ225KP-F |
|---|---|---|---|---|---|---|---|
| Brand | KYOCERA AVX | KYOCERA AVX | KYOCERA AVX | Murata Manufacturing | Samsung Electro-Mechanics | TDK | Taiyo Yuden |
| Package | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) |
| Capacitance | 2.2 µF | 2.2 µF | 2.2 µF | 2.2 µF | 2.2 µF | 2.2 µF | 2.2 µF |
| Rated Voltage (DC) | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V |
| Dielectric | X5R | X5R | X5R | X5R | X5R | X5R | X5R |
| Tolerance | ±20% | ±20% | ±20% | ±20% | ±10% | ±20% | ±10% |
| Operating Temperature | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
主要差異化特點
- Highest-density 0201 2.2µF 6.3V MLCC in the KYOCERA AVX KGM series (對比02016D225MAT2A)
- Cross-brand sourcing flexibility in identical 0201 footprint (對比GRM033R60J225ME15D (Murata))
- Tighter ±10% tolerance option not available from KYOCERA AVX in this KGM part (對比CL03A225KP3NNNC (Samsung))
設計說明
Use the KYOCERA AVX recommended 0201 land pattern from the datasheet to avoid tombstoning and solder-joint stress. Recommended pad dimensions are approximately 0.30mm x 0.40mm with 0.20mm spacing. Place the capacitor as close as physically possible to the IC power pin - trace inductance of even 1-2 nH will degrade high-frequency decoupling effectiveness. Use a single ground via adjacent to the negative pad to minimize parasitic inductance.
Estimated: at the 6.3V rated voltage, this X5R 2.2µF MLCC can lose 15-25% of its nominal capacitance due to DC bias derating. At 5V operation the effective capacitance drops to roughly 1.7-1.9µF, and at 3.3V approximately 1.9-2.1µF. Always evaluate decoupling margin at the actual operating DC voltage, not the nominal 2.2µF nameplate value. If your design needs the full 2.2µF at 6.3V, consider a higher voltage rating part or a different dielectric.
The 0201 case is mechanically fragile. Avoid placing the capacitor in high-stress PCB regions such as board edges, near mounting screws, or under heavy components. For boards subject to drop testing (wearables, hearables, mobile devices), use underfill or corner staking per IPC-9701 if the part sits in a high-flex area. Hand-soldering 0201 parts requires hot-air or precision iron techniques; reflow is strongly preferred.
合規資訊
RoHS and REACH compliant per KYOCERA AVX KGM series documentation. Halogen-free status not explicitly stated in the verified datasheet - marked unknown. Not AEC-Q100 qualified; this is a commercial/industrial-grade passive component. Lead-free reflow compatible to 260°C peak per JEDEC J-STD-020.
