LFE2-20E-6F672I - 21K LUT ECP2 FPGA | Lattice Semiconductor
MPN： LFE2-20E-6F672I ✓ 啟用中LFE2-20E-6F672I 概覽
An FPGA is a semiconductor whose digital logic is configured after manufacture. In the product hierarchy, the LFE2-20E-6F672I is an FPGA and CPLD-family programmable logic device within the broader category of programmable logic semiconductors. Its parallel architecture allows multiple control, interface, arithmetic, and state-machine functions to operate concurrently, reducing reliance on separate fixed-function logic components.
The device provides approximately 21K LUTs and 402 I/O, giving designers substantial logic capacity and high external connectivity for a 672-ball package. The -6 designation identifies its performance grade, while the trailing I indicates the industrial-temperature option. Its 1.2 V core supply is the principal internal operating supply specified for this device, while the I/O system provides connections to external circuitry.
The ECP2 architecture supports DSP and embedded-memory functions alongside general-purpose programmable logic. This combination is valuable when a design must process sampled data, implement protocol interfaces, control peripherals, and maintain deterministic digital behavior within one FPGA. The large BGA footprint also exposes enough pins for wide buses, high-speed interfaces, clock distribution, and ground-oriented power delivery.
Typical uses include industrial automation controllers, network interface equipment, test and measurement systems, audio processing, communications infrastructure, and embedded control platforms. The 402 available I/O allow dense peripheral connectivity, while the 21K LUT capacity supports parallel datapaths and multiple protocol engines. For designs with several independent clock domains, FPGA clock-planning and I/O-standard resources should be assigned before layout begins.
PCB implementation requires careful treatment of the 672-ball BGA package, including escape routing, layer transitions, power-plane distribution, and thermal management. Keep high-speed nets short, provide continuous ground references, and follow the manufacturer's package, power, decoupling, and layout guidance before fabrication. Signal-integrity and via-in-pad choices should be reviewed against the intended board stack-up.
This product page consolidates the device's key electrical, package, and application characteristics with practical design guidance and a focused family comparison. It helps engineers establish whether the LFE2-20E-6F672I offers the required logic density, I/O count, speed grade, and package for a new programmable-logic design.
直接替換替代品，適用於 LFE2-20E-6F672I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： LFE2-20E-6F672I （相同外形與佔位） — 差異在於 Mounting Type, Package Type.
LFE2-20E-6FN672I
✅ 直接替換📋 參考替代品（不在目錄中）
LFE2-20E-6F672C
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →LFE2-20E-6FN672C
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LFE2-20E-5F672I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →LFE2-20E-6F672I 最大額定值與電氣特性
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Capacity | 21K LUTs |
| User I/O Count | 402 I/O |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -6 |
| Temperature Grade | Industrial |
| 封裝 | 672-BBGA |
| Package Type | 672-FPBGA |
| Terminal Form | Ball |
| Terminal Count | 672 terminals |
| Package Shape | Square |
| 安裝類型 | Surface mount BGA |
| Programmable Logic | FPGA |
| DSP Capability | Supported |
LFE2-20E-6F672I square 腳位配置指南
LFE2-20E-6F672I（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： LFE2-20E-6F672I.
請參閱 資料表 以查看完整腳位配置。
典型應用
LFE2-20E-6F672I 適用於 6 應用s: Industrial Automation Controller, Industrial Ethernet Interface, Digital Audio Processor, Test and Measurement Equipment, RF and Communications Baseband, Embedded Data Acquisition System.
Industrial Automation Controller
The LFE2-20E-6F672I fits industrial automation controllers that combine machine sequencing, sensor conditioning, actuator control, and communications in one programmable device. Its 21K LUTs can support multiple state machines and protocol engines, while 402 I/O provide substantial connectivity for encoders, discrete controls, analog interfaces, and isolated field buses. The -6 grade provides additional timing margin for demanding control paths, and the industrial-temperature ordering option supports industrial equipment. Place the device in a multilayer board with carefully planned ground distribution and verify every signal standard and power requirement against the manufacturer package guidance.
推薦
Industrial Ethernet Interface
The LFE2-20E-6F672I is suitable for industrial Ethernet interface designs requiring dedicated packet-processing logic, parallel data paths, and extensive board-level connectivity. Its 21K LUTs can implement protocol-specific framing, filtering, buffering, and supervisory functions, while the 402 I/O support bus-oriented interfaces and control signals. An external Ethernet physical-layer device can handle analog signaling while the FPGA manages digital packet flow and system timing. The 672-ball package supplies enough I/O for parallel buses, status registers, clocking, and redundancy features, although board-level signal integrity must be engineered before high-speed operation.
推薦
Digital Audio Processor
The LFE2-20E-6F672I can support digital audio processing when a design needs configurable filters, sample-rate conversion control, channel routing, and DSP behavior alongside general control logic. The device's 21K LUTs allow parallel audio pipelines, and its DSP capability supports arithmetic functions that would otherwise consume additional fixed-function logic. The 402 I/O provide connections for multichannel audio buses, clocks, control registers, and status signals. Designers should use the manufacturer timing tools to constrain audio-clock paths and select appropriate external memory or interface components where sample storage exceeds the FPGA's embedded resources.
推薦
Test and Measurement Equipment
The LFE2-20E-6F672I fits programmable test and measurement equipment requiring deterministic timing, broad I/O, and flexible logic resources. Its 21K LUTs can implement acquisition sequencing, trigger logic, pattern generation, calibration tables, and instrument-control functions, while 402 I/O support parallel data acquisition, trigger buses, and instrument status. The programmable architecture allows one FPGA design to adapt to different test profiles without changing the PCB. Timing-critical acquisition and trigger paths should be assigned carefully, while the large BGA package requires controlled escape routing and a stable power-distribution network.
推薦
RF and Communications Baseband
The LFE2-20E-6F672I can implement communications baseband functions requiring programmable filtering, symbol processing, framing, and parallel data movement. Its DSP capability is useful for multiply-accumulate-oriented processing, while 21K LUTs provide capacity for control, protocol, and timing logic around the main datapath. The 402 I/O allow direct connection to converters, memory interfaces, clock sources, and digital control blocks. Designers should constrain all RF-clock-derived paths, verify timing across every required clock domain, and avoid placing sensitive routes adjacent to noisy switching or power-conversion sections of the completed board.
推薦
Embedded Data Acquisition System
The LFE2-20E-6F672I suits embedded data-acquisition systems that must combine sensor acquisition control, digital filtering, event logging, and communications. Its 21K LUTs support parallel sample routing and control logic, while 402 I/O provide connections to multiplexers, analog-to-digital converters, memory, and communication transceivers. Programmable logic can implement flexible acquisition sequences without changing hardware when test requirements evolve. The -6 grade can improve timing margin for demanding datapaths, but the complete clocking and memory-access architecture must still meet timing closure. Use a multilayer PCB and validate BGA assembly and thermal performance during hardware bring-up.
推薦
推薦產品摘要
工程參考資料，適用於 LFE2-20E-6F672I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LFE2-20E-6FN672I | LFE2-20E-6F672C | LFE2-20E-6FN672C | LFE2-20E-5F672I |
|---|---|---|---|---|---|
| Package | 672-FPBGA | 672-FPBGA | 672-FPBGA | 672-FPBGA | 672-FPBGA |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| FPGA Family | ECP2 | ECP2 | ECP2 | ECP2 | ECP2 |
| Logic Capacity | 21K LUTs | 21K LUTs | 21K LUTs | 21K LUTs | 21K LUTs |
| User I/O Count | 402 I/O | 402 I/O | 402 I/O | 402 I/O | 402 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -6 | -6 | -6 | -6 | -5 |
| Temperature Option | Industrial | Industrial | Commercial | Commercial | Industrial |
| DSP Capability | Supported | Supported | Supported | Supported | Supported |
主要差異化特點
- Retains the full 21K-LUT and 402-I/O configuration across the compared ECP2 options (對比LFE2-20E-5F672I)
- Industrial-temperature ordering configuration (對比LFE2-20E-6F672C)
- Matches the N-suffix device's core resource and package configuration (對比LFE2-20E-6FN672I)
設計說明
Treat the 672-ball BGA as a high-density routing problem. Plan ball-escape routing, power and ground planes, test points, and assembly access before placing the symbol in the PCB editor. Use continuous reference planes beneath signal layers wherever possible, and validate the stack-up, via geometry, and solder-mask design with the selected assembly process.
Separate the 1.2 V core supply from I/O supplies as recommended in the manufacturer power guidance. Provide local high-frequency decoupling at the relevant supply balls and use low-impedance distribution layers to minimize voltage droop during high-speed switching. Verify the complete power tree, current limits, sequencing requirements, and test-point accessibility before schematic sign-off.
Assign clocks, high-speed buses, and other timing-sensitive interfaces in the FPGA constraints before layout. Match routing lengths where required by the external interface, avoid excessive stub lengths, and provide solid return paths beneath every high-speed route. The 402 available I/O should be planned as a system-level resource for buses, clocks, controls, and future expansion rather than treated as an unlimited set of point-to-point signals.
Do not approve a replacement using package family and LUT count alone. Compare the complete ordering suffix, speed grade, temperature option, I/O standards, power configuration, and BGA ball map. The LFE2-20E-6FN672I and -6FN672C options require suffix decoding, while LFE2-20E-5F672I has a lower speed grade that may change timing closure.
合規資訊
The available product information identifies the device as an industrial ECP2 FPGA in a 672-FPBGA package but does not state its RoHS, REACH, lead-free, halogen-free, or conflict-minerals status.