LFE2-20E-6F672I - 21K LUT ECP2 FPGA | Lattice Semiconductor
料号： LFE2-20E-6F672I ✓ 量产中LFE2-20E-6F672I 概述
An FPGA is a semiconductor whose digital logic is configured after manufacture. In the product hierarchy, the LFE2-20E-6F672I is an FPGA and CPLD-family programmable logic device within the broader category of programmable logic semiconductors. Its parallel architecture allows multiple control, interface, arithmetic, and state-machine functions to operate concurrently, reducing reliance on separate fixed-function logic components.
The device provides approximately 21K LUTs and 402 I/O, giving designers substantial logic capacity and high external connectivity for a 672-ball package. The -6 designation identifies its performance grade, while the trailing I indicates the industrial-temperature option. Its 1.2 V core supply is the principal internal operating supply specified for this device, while the I/O system provides connections to external circuitry.
The ECP2 architecture supports DSP and embedded-memory functions alongside general-purpose programmable logic. This combination is valuable when a design must process sampled data, implement protocol interfaces, control peripherals, and maintain deterministic digital behavior within one FPGA. The large BGA footprint also exposes enough pins for wide buses, high-speed interfaces, clock distribution, and ground-oriented power delivery.
Typical uses include industrial automation controllers, network interface equipment, test and measurement systems, audio processing, communications infrastructure, and embedded control platforms. The 402 available I/O allow dense peripheral connectivity, while the 21K LUT capacity supports parallel datapaths and multiple protocol engines. For designs with several independent clock domains, FPGA clock-planning and I/O-standard resources should be assigned before layout begins.
PCB implementation requires careful treatment of the 672-ball BGA package, including escape routing, layer transitions, power-plane distribution, and thermal management. Keep high-speed nets short, provide continuous ground references, and follow the manufacturer's package, power, decoupling, and layout guidance before fabrication. Signal-integrity and via-in-pad choices should be reviewed against the intended board stack-up.
This product page consolidates the device's key electrical, package, and application characteristics with practical design guidance and a focused family comparison. It helps engineers establish whether the LFE2-20E-6F672I offers the required logic density, I/O count, speed grade, and package for a new programmable-logic design.
直接替换替代料： LFE2-20E-6F672I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LFE2-20E-6F672I （相同外形与封装尺寸） ——差异在于 Mounting Type, Package Type.
LFE2-20E-6FN672I
✅ 直接替换📋 参考替代料（不在目录中）
LFE2-20E-6F672C
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →LFE2-20E-6FN672C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LFE2-20E-5F672I
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →LFE2-20E-6F672I 最大额定值与电气特性
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Capacity | 21K LUTs |
| User I/O Count | 402 I/O |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -6 |
| Temperature Grade | Industrial |
| 封装 | 672-BBGA |
| Package Type | 672-FPBGA |
| Terminal Form | Ball |
| Terminal Count | 672 terminals |
| Package Shape | Square |
| 安装类型 | Surface mount BGA |
| Programmable Logic | FPGA |
| DSP Capability | Supported |
LFE2-20E-6F672I square 引脚配置指南
LFE2-20E-6F672I（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LFE2-20E-6F672I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LFE2-20E-6F672I 适用于 6 应用s: Industrial Automation Controller, Industrial Ethernet Interface, Digital Audio Processor, Test and Measurement Equipment, RF and Communications Baseband, Embedded Data Acquisition System.
Industrial Automation Controller
The LFE2-20E-6F672I fits industrial automation controllers that combine machine sequencing, sensor conditioning, actuator control, and communications in one programmable device. Its 21K LUTs can support multiple state machines and protocol engines, while 402 I/O provide substantial connectivity for encoders, discrete controls, analog interfaces, and isolated field buses. The -6 grade provides additional timing margin for demanding control paths, and the industrial-temperature ordering option supports industrial equipment. Place the device in a multilayer board with carefully planned ground distribution and verify every signal standard and power requirement against the manufacturer package guidance.
推荐
Industrial Ethernet Interface
The LFE2-20E-6F672I is suitable for industrial Ethernet interface designs requiring dedicated packet-processing logic, parallel data paths, and extensive board-level connectivity. Its 21K LUTs can implement protocol-specific framing, filtering, buffering, and supervisory functions, while the 402 I/O support bus-oriented interfaces and control signals. An external Ethernet physical-layer device can handle analog signaling while the FPGA manages digital packet flow and system timing. The 672-ball package supplies enough I/O for parallel buses, status registers, clocking, and redundancy features, although board-level signal integrity must be engineered before high-speed operation.
推荐
Digital Audio Processor
The LFE2-20E-6F672I can support digital audio processing when a design needs configurable filters, sample-rate conversion control, channel routing, and DSP behavior alongside general control logic. The device's 21K LUTs allow parallel audio pipelines, and its DSP capability supports arithmetic functions that would otherwise consume additional fixed-function logic. The 402 I/O provide connections for multichannel audio buses, clocks, control registers, and status signals. Designers should use the manufacturer timing tools to constrain audio-clock paths and select appropriate external memory or interface components where sample storage exceeds the FPGA's embedded resources.
推荐
Test and Measurement Equipment
The LFE2-20E-6F672I fits programmable test and measurement equipment requiring deterministic timing, broad I/O, and flexible logic resources. Its 21K LUTs can implement acquisition sequencing, trigger logic, pattern generation, calibration tables, and instrument-control functions, while 402 I/O support parallel data acquisition, trigger buses, and instrument status. The programmable architecture allows one FPGA design to adapt to different test profiles without changing the PCB. Timing-critical acquisition and trigger paths should be assigned carefully, while the large BGA package requires controlled escape routing and a stable power-distribution network.
推荐
RF and Communications Baseband
The LFE2-20E-6F672I can implement communications baseband functions requiring programmable filtering, symbol processing, framing, and parallel data movement. Its DSP capability is useful for multiply-accumulate-oriented processing, while 21K LUTs provide capacity for control, protocol, and timing logic around the main datapath. The 402 I/O allow direct connection to converters, memory interfaces, clock sources, and digital control blocks. Designers should constrain all RF-clock-derived paths, verify timing across every required clock domain, and avoid placing sensitive routes adjacent to noisy switching or power-conversion sections of the completed board.
推荐
Embedded Data Acquisition System
The LFE2-20E-6F672I suits embedded data-acquisition systems that must combine sensor acquisition control, digital filtering, event logging, and communications. Its 21K LUTs support parallel sample routing and control logic, while 402 I/O provide connections to multiplexers, analog-to-digital converters, memory, and communication transceivers. Programmable logic can implement flexible acquisition sequences without changing hardware when test requirements evolve. The -6 grade can improve timing margin for demanding datapaths, but the complete clocking and memory-access architecture must still meet timing closure. Use a multilayer PCB and validate BGA assembly and thermal performance during hardware bring-up.
推荐
推荐产品汇总
工程参考数据： LFE2-20E-6F672I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LFE2-20E-6FN672I | LFE2-20E-6F672C | LFE2-20E-6FN672C | LFE2-20E-5F672I |
|---|---|---|---|---|---|
| Package | 672-FPBGA | 672-FPBGA | 672-FPBGA | 672-FPBGA | 672-FPBGA |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| FPGA Family | ECP2 | ECP2 | ECP2 | ECP2 | ECP2 |
| Logic Capacity | 21K LUTs | 21K LUTs | 21K LUTs | 21K LUTs | 21K LUTs |
| User I/O Count | 402 I/O | 402 I/O | 402 I/O | 402 I/O | 402 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -6 | -6 | -6 | -6 | -5 |
| Temperature Option | Industrial | Industrial | Commercial | Commercial | Industrial |
| DSP Capability | Supported | Supported | Supported | Supported | Supported |
关键差异点
- Retains the full 21K-LUT and 402-I/O configuration across the compared ECP2 options （对比 LFE2-20E-5F672I)
- Industrial-temperature ordering configuration （对比 LFE2-20E-6F672C)
- Matches the N-suffix device's core resource and package configuration （对比 LFE2-20E-6FN672I)
设计说明
Treat the 672-ball BGA as a high-density routing problem. Plan ball-escape routing, power and ground planes, test points, and assembly access before placing the symbol in the PCB editor. Use continuous reference planes beneath signal layers wherever possible, and validate the stack-up, via geometry, and solder-mask design with the selected assembly process.
Separate the 1.2 V core supply from I/O supplies as recommended in the manufacturer power guidance. Provide local high-frequency decoupling at the relevant supply balls and use low-impedance distribution layers to minimize voltage droop during high-speed switching. Verify the complete power tree, current limits, sequencing requirements, and test-point accessibility before schematic sign-off.
Assign clocks, high-speed buses, and other timing-sensitive interfaces in the FPGA constraints before layout. Match routing lengths where required by the external interface, avoid excessive stub lengths, and provide solid return paths beneath every high-speed route. The 402 available I/O should be planned as a system-level resource for buses, clocks, controls, and future expansion rather than treated as an unlimited set of point-to-point signals.
Do not approve a replacement using package family and LUT count alone. Compare the complete ordering suffix, speed grade, temperature option, I/O standards, power configuration, and BGA ball map. The LFE2-20E-6FN672I and -6FN672C options require suffix decoding, while LFE2-20E-5F672I has a lower speed grade that may change timing closure.
合规信息
The available product information identifies the device as an industrial ECP2 FPGA in a 672-FPBGA package but does not state its RoHS, REACH, lead-free, halogen-free, or conflict-minerals status.