LMZ31530RLGT - 30A SIMPLE SWITCHER Power Module, 3-14.5V Input | TI
MPN： LMZ31530RLGT ✓ 啟用中LMZ31530RLGT 概覽
What is a power module? A power module (also called a POL module or integrated point-of-load converter) is a category of switching regulator in which the controller IC, MOSFET switches, inductor, and key support components are factory-assembled inside one package. The module sits inside the power management IC hierarchy alongside discrete buck converters, synchronous regulators, and LDO regulators. Compared to a discrete buck design, a module simplifies layout, reduces EMI risk, and shortens design cycle time by removing the magnetics design step.
Key features include ultra-fast load-step response, selectable switching frequency between 300 kHz and 800 kHz, an optional split-power-rail topology, and over-current, over-temperature, and under-voltage protections. The exposed QFN pad supplies a low thermal-resistance path to the host PCB, supporting continuous 30 A output with proper copper-pour area. The combination of factory-tuned compensation and integrated magnetics is the principal reason designers choose the LMZ31530RLGT over a discrete buck when board space and time-to-market dominate the trade-off.
From an architectural perspective, the module uses a peak-current-mode control loop, which feeds the inductor current into the modulator to provide line-feed-forward and cycle-by-cycle current limiting. The internal MOSFETs are rated for the 14.5 V maximum input, and the integrated shielded inductor minimizes radiated EMI by containing the AC flux inside the package boundary. Synchronization to a system clock is supported, allowing multiple modules to operate in phase-shifted mode to spread ripple frequency across the PCB.
Typical applications include 30 A point-of-load rails for FPGA core and transceiver supplies, ASIC and DSP core voltages, server and telecom cards with intermediate bus architectures, and any board that needs a compact 0.6 V to 3.6 V rail from a 12 V input. Industrial automation controllers and test-and-measurement equipment use this module where small footprint and proven compensation outweigh the small premium over discrete solutions.
When designing with this device, ensure the host PCB carries a substantial copper-pour area on the exposed thermal pad to keep junction temperature within ratings at full load. Decouple the input with low-ESR ceramic capacitors placed as close as possible to the VIN and PGND pads, and follow the layout guidance in the datasheet to avoid ground bounce. Output ripple is set by the external output capacitors - higher-quality ceramics yield lower ripple.
This page synthesizes distributor pricing, drop-in alternatives, and PCB-layout design notes not found in the manufacturer datasheet, with cross-references to compatible parts in the TI SIMPLE SWITCHER and TPSM power-module families.
直接替換替代品，適用於 LMZ31530RLGT — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
LMZ31520RLGT
✅ 直接替換📋 參考替代品（不在目錄中）
LMZ31530RLQR
✅ 直接替換📋 參考替代品（不在目錄中）
LMZ31530RLGR
✅ 直接替換📋 參考替代品（不在目錄中）
LMZ31530RLG
✅ 直接替換📋 參考替代品（不在目錄中）
TPSM82813SILR
✅ 直接替換📋 參考替代品（不在目錄中）
LMZ31530RLGT 最大額定值與電氣特性
| 拓撲 | Non-Isolated Step-Down (Buck) Power Module |
| 輸入電壓範圍 | 3 V to 14.5 V |
| 輸出電壓範圍 | 0.6 V to 3.6 V (adjustable) |
| Output Current (Continuous) | 30 A |
| Reference Accuracy | 1 % |
| 切換頻率 | Selectable 300 kHz to 800 kHz |
| 輸出數量 | 1 |
| 封裝 | 72-BQFN (RLG), 15 x 16 x 5.8 mm |
| 工作溫度範圍 | -40 C to +85 C |
| 安裝類型 | Surface Mount |
| Internal Switches | Yes (integrated MOSFETs) |
| Integrated Inductor | Yes (shielded) |
| External Components Required | As few as 3 |
| Protection Features | OCP, OTP, UVLO |
| Synchronization | Yes (external clock) |
| Split Power Rail | Optional |
| RoHS 狀態 | Compliant |
LMZ31530RLGT 72-bqfn (rlg), 15 x 16 x 5.8 mm 腳位配置指南
LMZ31530RLGT（72-bqfn (rlg), 15 x 16 x 5.8 mm 封裝）的腳位配置。 此功率元件具有閘極、汲極與源極端子。對於非極性封裝，請參閱製造商資料表以取得確切的第 1 腳方向與佈局詳細資訊。常見應用包括電源設計、馬達驅動與負載切換。
無詳細腳位定義資料： LMZ31530RLGT.
請參閱 資料表 以查看完整腳位配置。
典型應用
LMZ31530RLGT 適用於 6 應用s: FPGA Core and Transceiver Point-of-Load, ASIC and DSP Core Voltage Rail, Server and Telecom Card Intermediate Bus, Industrial Automation Controllers, Test and Measurement Equipment, Networking Switch and Router Line Cards.
FPGA Core and Transceiver Point-of-Load
The LMZ31530RLGT delivers 30 A continuous from a 12 V intermediate bus to produce 0.85 V to 1.0 V FPGA VCCINT rails, where the part's 1 percent reference accuracy and ultra-fast load-step response keep VCCINT inside the FPGA's tolerance window during sudden current transients. Modern FPGAs pull tens of amps in microseconds when transitioning from sleep to active states, and the module's integrated shielded inductor contains the AC flux to minimize radiated EMI that would otherwise couple into adjacent high-speed transceiver channels. Placed next to the FPGA on a 12 V plane with the datasheet-recommended copper pour, it provides a compact, factory-compensated solution that engineers can route in under a day instead of designing a discrete buck.
推薦
ASIC and DSP Core Voltage Rail
The LMZ31530RLGT is sized for 30 A ASIC and DSP core rails where the device typically sources 0.8 V to 1.2 V from a 5 V or 12 V bus. With selectable switching frequency between 300 kHz and 800 kHz, designers can place the switching fundamental away from sensitive clock harmonics and avoid synchronization with ADC sampling rates. The module's split-power-rail option lets the host board feed the driver section from a separate rail to reduce input ripple under large load steps, which is essential for ASIC rails that swing from a few hundred milliamps in idle to 25-plus amps in burst mode. Compared to a discrete buck, the integrated inductor saves roughly 100 mm² of board space and removes the loop-compensation design step.
推薦
Server and Telecom Card Intermediate Bus
In server and telecom line cards with 12 V intermediate bus architectures, the LMZ31530RLGT converts 12 V directly to 1.0 V or 1.5 V for ASICs and DDR memory, eliminating an intermediate isolation stage. The integrated magnetics allow many modules to be placed near their loads without EMI coupling between inductors, and the synchronization pin lets multiple modules operate in phase-shifted mode to spread ripple frequency across the PCB. Hot-spot thermal management is simplified by the exposed thermal pad, which dumps heat directly into an inner PCB copper plane rather than requiring airflow over a discrete inductor.
推薦
Industrial Automation Controllers
The LMZ31530RLGT fits 24 V-to-12 V power-conversion subsystems inside PLCs and industrial controllers, supplying 30 A point-of-load rails for microcontrollers, motor-control DSPs, and communication PHYs. Its 14.5 V maximum input is well below the 24 V industrial rail, but in practice the module is fed from a regulated 12 V sub-rail after front-end protection. The wide -40 C to +85 C operating temperature range supports cabinet-mounted installations without derating. The integrated OCP, OTP, and UVLO protections reduce the host board's protection-component count.
推薦
Test and Measurement Equipment
The LMZ31530RLGT is used in bench-top instruments where a low-noise 30 A rail is needed for FPGA-based signal processing. Because the module's switching frequency is selectable up to 800 kHz, designers can move the fundamental away from the measurement passband and rely on the high-frequency noise floor rather than the switching fundamental. Synchronization to a system clock prevents intermodulation with ADC sampling, which is critical in spectrum analyzers and arbitrary waveform generators where the supply rail must not contaminate the measurement. The integrated magnetics mean there is no external inductor to pick up stray fields from the analog front end.
推薦
Networking Switch and Router Line Cards
The LMZ31530RLGT supplies 30 A point-of-load rails for network-switch ASICs and packet processors, where it converts a 12 V card-edge input to 0.85 V or 0.9 V core voltages. Multiple modules can be synchronized and phase-shifted to spread ripple frequency, which reduces bulk-capacitor requirements on the output. The compact 15 mm x 16 mm footprint allows dense placement next to high-pin-count ASICs, and the exposed thermal pad simplifies thermal management on a card with restricted airflow. The integrated inductor reduces EMI compared to discrete designs where the inductor's stray fields can couple into adjacent high-speed signal traces.
推薦
推薦產品摘要
工程參考資料，適用於 LMZ31530RLGT — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LMZ31520RLGT | LMZ31530RLQR | LMZ31530RLGR | LMZ31530RLG | TPSM82813SILR |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 72-BQFN (RLG), 15 x 16 x 5.8 mm | 72-BQFN (RLG) - same | 72-BQFN (RLG) - same | 72-BQFN (RLG) - same | 72-BQFN (RLG) - same | QFN module - smaller footprint |
| Input Voltage Range | 3 V to 14.5 V | 3 V to 14.5 V | 3 V to 14.5 V | 3 V to 14.5 V | 3 V to 14.5 V | 2.7 V to 6 V |
| Output Voltage Range | 0.6 V to 3.6 V | 0.6 V to 3.6 V | 0.6 V to 3.6 V | 0.6 V to 3.6 V | 0.6 V to 3.6 V | 0.6 V to 5.5 V |
| Output Current | 30 A | 20 A (-33%) | 30 A | 30 A | 30 A | 3 A (-90%) |
| Operating Temperature Range | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C |
主要差異化特點
- Higher continuous output current than TPSM82813 family (對比TPSM82813SILR)
- Same footprint and pinout as lower-current LMZ31520 (對比LMZ31520RLGT)
- Reel-versus-tray variants simplify logistics (對比LMZ31530RLQR)
- Selectable switching frequency avoids intermodulation (對比TPSM82813SILR)
設計說明
Estimated: at VIN=12 V, VOUT=1.0 V, and 30 A load, the LMZ31530RLGT dissipates (12-1.0) x 30 = 330 W internally. This is well beyond the package's continuous rating without substantial PCB copper area; the datasheet specifies a minimum 4-layer PCB with thermal via array under the exposed pad. Designers should follow the layout guidelines strictly and add active airflow for sustained 30 A operation above 60 C ambient. Above this dissipation, the internal OTP will cycle the output off and on.
Place input ceramic capacitors (22 uF X7R minimum, low-ESR) as close as possible to the VIN and PGND pads. Use at least six vias per ampere to connect the input capacitors to the inner VIN plane. The output capacitors (typically 4 x 22 uF ceramic + 1 x 470 uF polymer) should sit directly under the VOUT pad area to minimize the high-frequency loop. A solid ground pour under the module with stitching vias every 5 mm reduces EMI and improves thermal performance.
Do not exceed the 14.5 V absolute-maximum input rating - a 12 V bus with hot-plug transients can exceed this. Add a TVS diode or input fuse for input transients. Avoid routing analog signal traces directly under the module's exposed pad; the switching fundamental can couple into sensitive analog paths. Do not omit the SS/TR capacitor; the soft-start cap controls inrush current and must be sized per the datasheet for the application load profile.
Keep the feedback trace from the ADJ pin to the output capacitor sense point short (under 10 mm) and away from the SW node to avoid noise coupling that can destabilize the loop. The RT/FSET resistor sets switching frequency and should be placed near the RT pin with the ground return via directly under the resistor. SYNC routing should be kept short and reference a clean ground; long SYNC traces can pick up switching noise that disrupts the module's clock synchronization.
合規資訊
RoHS compliant per TI product page. Industrial grade operating temperature -40 C to +85 C; not AEC-Q100 qualified. Conflict minerals reporting compliant per TI policy.
